利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

14 条记录 (耗时 0.025 秒)

    Chip type solid electrolytic capacitor having a small size and a simple structure
    3.
    发明申请
    Chip type solid electrolytic capacitor having a small size and a simple structure 有权
    具有体积小，结构简单的片式固体电解电容器

    公开(公告)号：US20060270115A1

    公开(公告)日：2006-11-30

    申请号：US11492541

    申请日：2006-07-25

    申请人： Mitsunori Sano ,  Takashi Kono ,  Makoto Tsutsui

    发明人： Mitsunori Sano ,  Takashi Kono ,  Makoto Tsutsui

    IPC分类号： H01L21/00

    CPC分类号： H01G9/012 ,  H01G9/042 ,  H01G9/10 ,  H01L2924/0002 ,  Y10S257/924 ,  Y10T29/417 ,  Y10T29/435 ,  Y10T29/4913 ,  H01L2924/00

    摘要： In a chip type solid electrolytic capacitor including a capacitor element and a packaging resin covering the capacitor element, the packaging resin has a mount surface and a side surface adjacent to the mount surface. A terminal is electrically connected to the capacitor element and coupled to the packaging resin. The terminal extends along the mount surface and the side surface to have an outer surface exposed from the packaging resin and to have an inner surface opposite to the outer terminal surface. The inner surface has a stepwise shape formed by forging.

    摘要翻译： 在包括电容器元件和覆盖电容器元件的封装树脂的芯片型固体电解电容器中，封装树脂具有与安装表面相邻的安装表面和侧表面。 端子电连接到电容器元件并且耦合到封装树脂。 端子沿着安装表面和侧表面延伸以具有从包装树脂露出的外表面并且具有与外端子表面相对的内表面。 内表面具有通过锻造形成的阶梯形状。

    Chip type capacitor, method for preparing the same and anode terminal used for preparing the same
    4.
    发明申请
    Chip type capacitor, method for preparing the same and anode terminal used for preparing the same 审中-公开
    片式电容器，其制备方法以及用于制备其的阳极端子

    公开(公告)号：US20050168921A1

    公开(公告)日：2005-08-04

    申请号：US11097316

    申请日：2005-04-04

    申请人： Mitsunori Sano ,  Takashi Kono

    发明人： Mitsunori Sano ,  Takashi Kono

    IPC分类号： H01G9/00 ,  H01G9/012 ,  H01G13/00

    CPC分类号： H01G9/012 ,  H01G2/02 ,  H01G4/236

    摘要： A chip type capacitor is disclosed which has improved bond strength between an anode lead wire and an anode terminal and enhanced reliability. A method for preparing the chip type capacitor and an anode terminal used in the preparation method are also disclosed. The chip type capacitor comprises: a solid electrolytic capacitor element including an element body having an anode body, a dielectric and a cathode body, and an anode lead wire partially extending from the anode body of the element body; and an anode terminal electrically connected to the anode lead wire, the anode lead wire having such a site that about 75% or more of a periphery of a section thereof in the direction substantially perpendicular to the extending direction of the anode lead wire is covered with solidified matter resulting from solidification of a melt, the anode terminal and the anode lead wire being bonded to each other by the solidified matter.

    摘要翻译： 公开了一种芯片型电容器，其具有改善的阳极引线和阳极端子之间的结合强度，并提高了可靠性。 还公开了制备方法中制备芯片型电容器和阳极端子的方法。 芯片型电容器包括：固体电解电容器元件，包括具有阳极体，电介质和阴极体的元件体和从元件体的阳极体部分延伸的阳极引线; 以及与阳极引线电连接的阳极端子，具有这样的位置的阳极引线被覆在与阳极引线的延伸方向大致垂直的方向上的部分的周边的大约75％以上的位置 由熔体固化而产生的固化物，阳极端子和阳极引线通过凝固物彼此接合。

    Chip capacitor having external resin packaging
    6.
    发明授权
    Chip capacitor having external resin packaging 有权
    具有外部树脂封装的片式电容器

    公开(公告)号：US06430034B2

    公开(公告)日：2002-08-06

    申请号：US09826253

    申请日：2001-04-04

    申请人： Mitsunori Sano ,  Kazunori Watanabe ,  Hideaki Sato ,  Kazuhiro Mine

    发明人： Mitsunori Sano ,  Kazunori Watanabe ,  Hideaki Sato ,  Kazuhiro Mine

    IPC分类号： H01G904

    CPC分类号： H01G9/012 ,  H01G2/065

    摘要： The present invention provides a chip capacitor, a fabrication method for the same, and a metal mold that can prevent the occurrence of the chip standing phenomenon even when carrying out soldering using reflow soldering, and that be applied to further down-sizing an decreasing of weight. Curved parts 26 and 36 that extend beyond the connecting tongue pieces 21 and 31 of side piece parts 22 and 32 rising in an upward diagonal direction with respect to the connecting tongue pieces 21 and 31 are formed by press bending processing, and thereby the side piece parts 22 and 32 are exposed in an upward rising direction relative to the connecting tongue pieces 21 and 31 at the external end surfaces 15b and 15c of the external resin packaging.

    摘要翻译： 本发明提供了一种片状电容器及其制造方法，以及即使在使用回流焊接进行焊接的情况下也能够防止芯片立起现象的发生的金属模具，并且适用于进一步减小尺寸 重量。 通过压弯加工形成延伸超过相对于连接舌片21和31向上倾斜方向上升的侧片部件22和32的连接舌片21和31的弯曲部分26和36， 部件22和32相对于外部树脂封装的外端面15b和15c处的连接舌片21和31向上升的方向露出。

    Piezoelectric actuator with a displacement enlarging feature
    7.
    发明授权
    Piezoelectric actuator with a displacement enlarging feature 失效
    具有位移放大特性的压电致动器

    公开(公告)号：US5479064A

    公开(公告)日：1995-12-26

    申请号：US365225

    申请日：1994-12-28

    申请人： Mitsunori Sano

    发明人： Mitsunori Sano

    IPC分类号： H01L41/09 ,  H02N2/00 ,  H01L41/053

    CPC分类号： H02N2/043

    摘要： A piezoelectric actuator has a housing having a top portion with an opening. A Y-shaped member comprising a bottom arm and divided two top arms. The bottom arm is fixed on a bottom portion of the housing and the divided two top arms are placed in a movable state. A detachable member is so fitted into the opening of the housing as to be detachable from the opening of the housing. A piezoelectric device has one end being fixed to the detachable member and the opposite end being in contact with a valley portion of the Y-shaped member so that when the piezoelectric device extends in a longitudinal direction by a voltage application then the opposite end presses down the alley portion thereby a distance between the tops of the divided two top arms of the Y-shaped member is enlarged. A beam has opposite ends being fixed to topes of the divided top arms and a center portion displaceable in a vertical direction when a distance between the tops of the divided top arms of the Y-shaped member is changed.

    摘要翻译： 压电致动器具有具有开口的顶部的壳体。 Y形构件，包括底臂和分开的两个顶臂。 底部臂固定在壳体的底部，并且分开的两个顶部臂被置于可动状态。 可拆卸构件被装配到壳体的开口中，以便能够从壳体的开口脱离。 压电装置的一端固定在可拆卸构件上，相对端与Y形构件的谷部接触，使得当压电装置通过施加电压沿纵向方向延伸时，相对端压下 胡同部分因此Y形构件的分开的两个顶臂的顶部之间的距离增大。 梁的相对端固定到分开的顶臂的顶部，并且当Y形构件的分开的顶臂的顶部之间的距离改变时，中心部能够在垂直方向上移动。

    Chip type capacitor, method for preparing the same and anode terminal used for preparing the same
    8.
    发明授权
    Chip type capacitor, method for preparing the same and anode terminal used for preparing the same 失效
    片式电容器，其制备方法以及用于制备其的阳极端子

    公开(公告)号：US06903922B2

    公开(公告)日：2005-06-07

    申请号：US10387397

    申请日：2003-03-14

    申请人： Mitsunori Sano ,  Takashi Kono

    发明人： Mitsunori Sano ,  Takashi Kono

    IPC分类号： H01G9/00 ,  H01G9/012 ,  H01G13/00 ,  H01G4/228 ,  H01G9/04

    CPC分类号： H01G9/012 ,  H01G2/02 ,  H01G4/236

    摘要： A chip type capacitor which has improved bond strength between an anode lead wire and an anode terminal and enhanced reliability, and a method for preparing the chip type capacitor and an anode terminal. The chip type capacitor has a solid electrolytic capacitor element including an element body having an anode body, a dielectric and a cathode body, and an anode lead wire partially extending from the anode body of the element body. An anode terminal is electrically connected to the portion of the anode lead wire extending from the anode body. This extending portion of the anode lead wire has about 75% or more of its periphery, in the direction substantially perpendicular to the extending direction of the anode lead wire, covered with solidified matter resulting from solidification of a melt, thereby bonding the anode terminal and the anode lead wire to each other.

    摘要翻译： 具有改善阳极引线和阳极端子之间的接合强度并提高可靠性的芯片型电容器，以及制造芯片型电容器和阳极端子的方法。 片式电容器具有固体电解电容器元件，其包括具有阳极体，电介质和阴极体的元件体以及从元件体的阳极体部分延伸的阳极引线。 阳极端子电连接到从阳极体延伸的阳极引线的部分。 阳极引线的该延伸部分在大致垂直于阳极引线的延伸方向的方向上具有大约75％或更多的周边，被固化的熔体所固化的物质覆盖，从而将阳极端子和 阳极引线相互连接。

    Chip capacitor and method of manufacturing same
    10.
    发明授权
    Chip capacitor and method of manufacturing same 失效

    公开(公告)号：US06519135B2

    公开(公告)日：2003-02-11

    申请号：US10140180

    申请日：2002-05-08

    申请人： Mitsunori Sano ,  Takashi Kono

    发明人： Mitsunori Sano ,  Takashi Kono

    IPC分类号： H01G904

    CPC分类号： H01G9/012 ,  H01G9/15 ,  H01G11/48 ,  Y02E60/13

    摘要： A chip capacitor has capacitor component 14 having anode lead 17 and sintered body 21 of a metal having a valve action in which anode lead 17 is embedded so as to project from embedding surface 21a, resin-based insulating film layer 24 containing a white pigment and disposed on the embedding surface of capacitor component 14, water-repellent layer 25 disposed on resin-based insulating film layer 24, anode terminal 12 having a portion bent into joint tongue 31, with anode lead 17 being placed on joint tongue 31, joint tongue 31 and anode lead 17 being welded to each other into anode terminal 12, and antireflection member 34 extending from a proximal end of joint tongue 31 of anode terminal 12 toward sintered body 21. When joint tongue 31 and anode lead 17 are welded to each other by a laser beam, antireflection member 34 prevents the laser beam from being reflected from the welded region.