公开(公告)号：US20080232068A1

公开(公告)日：2008-09-25

申请号：US11690046

申请日：2007-03-22

申请人： JIE LIU ,  CHUN-JIANG SHUAI ,  JIN-SONG FENG

发明人： JIE LIU ,  CHUN-JIANG SHUAI ,  JIN-SONG FENG

IPC分类号： H05K7/20

CPC分类号： H01L23/4093 ,  H01L23/3677 ,  H01L2224/73253 ,  H01L2924/10156

摘要： A heat dissipation device includes a heat sink and a fixing base for securing the heat sink to a heat-generating device. The heat sink includes a base and a pair of flanges formed on two opposite sides of the base. The fixing base includes a pair of side plates formed on a first set of two opposite sides thereof. A pair of resilient barbs extends inwards from an end portion of each side plate. The fixing base is placed on the heat sink and the resilient barbs tightly clasp first two opposite sides of the heat-generating device to press the base of the heat sink towards the heat-generating device. The flanges of the base of the heat sink abut second two opposite sides of the heat-generating device to avoid movement of the heat sink along a direction perpendicular to the flanges.

摘要翻译： 散热装置包括散热器和用于将散热器固定到发热装置的固定基座。 散热器包括基部和形成在基部的两个相对侧上的一对凸缘。 固定底座包括形成在其第一组两个相对侧上的一对侧板。 一对弹性倒钩从每个侧板的端部向内延伸。 固定基座放置在散热器上，弹性倒钩将发热装置的前两相对紧紧地夹紧，将散热片的底部朝向发热装置推压。 散热器底座的凸缘邻接发热装置的第二相对侧，以避免散热器沿垂直于凸缘的方向移动。

公开(公告)号：US20120261170A1

公开(公告)日：2012-10-18

申请号：US13532810

申请日：2012-06-26

申请人： JIN WANG ,  JIN-SONG FENG

发明人： JIN WANG ,  JIN-SONG FENG

IPC分类号： H05K1/02

CPC分类号： H05K7/142

摘要： An electronic device includes a printed circuit board, an electronic element, and a backboard assembly. The printed circuit board defines a plurality of first through holes. The electronic element is mounted on a top surface of the printed circuit board. The backboard is assembly secured to a bottom surface of the printed circuit board. The backboard assembly includes a back plate, an electrically insulative sheet, and a connection element. The electrically insulative sheet defines a plurality of second through holes. The connection element includes a plurality of first engaging structures on a first side thereof to engage with the back plate and a plurality of first clasps on a second side of the connection element opposing to the first side to engage with the electrically insulative sheet.

摘要翻译： 电子设备包括印刷电路板，电子元件和背板组件。 印刷电路板限定多个第一通孔。 电子元件安装在印刷电路板的顶表面上。 背板是固定到印刷电路板的底表面的组件。 背板组件包括背板，电绝缘片和连接元件。 电绝缘片限定多个第二通孔。 所述连接元件包括在其第一侧上与所述背板接合的多个第一接合结构以及在所述连接元件的与所述第一侧相对的第二侧上与所述电绝缘片接合的多个第一扣环。

公开(公告)号：US20080174968A1

公开(公告)日：2008-07-24

申请号：US11626734

申请日：2007-01-24

申请人： JIN-SONG FENG ,  SONG-SHUI LIU

发明人： JIN-SONG FENG ,  SONG-SHUI LIU

IPC分类号： H05K7/20

CPC分类号： H01L23/4093 ,  H01L23/3672 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipation device includes a heat sink, a retention module and a locking device for securing the heat sink to the retention module. The heat sink includes a base for contacting with a heat-generating component. The retention module includes a bottom wall and a first spring clip secured at one side thereof. The locking device is pivotably connected to the retention module and includes a second spring clip attached thereon. The heat sink rests on the bottom wall of the retention module with an end thereof being pressed by the first spring clip, and an opposite end thereof being pressed by the second spring clip. The locking device can be at a released position where the locking device is pivotable, so that the heat sink is removable from the retention module, and a locked position where the locking device presses the base of the heat sink.

摘要翻译： 散热装置包括散热器，保持模块和用于将散热器固定到保持模块的锁定装置。 散热器包括用于与发热部件接触的基座。 保持模块包括底壁和固定在其一侧的第一弹簧夹。 锁定装置可枢转地连接到保持模块并且包括附接在其上的第二弹簧夹。 散热片搁置在保持模块的底壁上，其一端由第一弹簧夹压紧，其另一端被第二弹簧夹压。 锁定装置可以处于释放位置，在该位置锁定装置可枢转，使得散热器可从保持模块移除，锁定装置可以锁定装置按压散热器的底部。

公开(公告)号：US20100002438A1

公开(公告)日：2010-01-07

申请号：US12396475

申请日：2009-03-03

申请人： YI ZHANG ,  CHENG-TIEN LAI ,  JIN-SONG FENG

发明人： YI ZHANG ,  CHENG-TIEN LAI ,  JIN-SONG FENG

IPC分类号： F21V21/00

CPC分类号： F21V29/763 ,  F21K9/00 ,  F21V19/003 ,  F21V29/51 ,  F21V29/75 ,  F21V29/76 ,  F21Y2115/10

摘要： An LED lamp includes a heat sink having a base and a plurality of LED module assemblies mounted on a top surface of the base of the heat sink. Each of the LED module assemblies includes a fixing bracket secured to the top surface of the base, an LED module mounted on a top surface of the fixing bracket and two heat pipes engaging with the fixing bracket and the heat sink. The fixing bracket includes a bottom plate attached on the top surface of the base, a top plate on which the LED module is attached and a connecting plate interconnecting the bottom plate with the top plate. The heat pipes thermally connect the bottom plate and the heat sink with the top plate.

摘要翻译： LED灯包括具有基座的散热器和安装在散热器的基座的顶表面上的多个LED模块组件。 每个LED模块组件包括固定到基座顶面的固定支架，安装在固定支架顶表面上的LED模块和与固定支架和散热片相接合的两个热管。 固定支架包括安装在基座顶表面上的底板，安装有LED模块的顶板和将底板与顶板互连的连接板。 热管将顶板和散热器与顶板热连接。

公开(公告)号：US20090323347A1

公开(公告)日：2009-12-31

申请号：US12274358

申请日：2008-11-20

申请人： YI ZHANG ,  JIN-SONG FENG ,  CHENG-TIEN LAI

发明人： YI ZHANG ,  JIN-SONG FENG ,  CHENG-TIEN LAI

IPC分类号： F21V29/00 ,  H01J7/24

CPC分类号： F21V29/004 ,  F21S2/005 ,  F21V19/001 ,  F21V29/713 ,  F21V29/75 ,  F21V29/76 ,  F21Y2115/10 ,  Y10S362/80

摘要： An LED lamp includes a heat sink, a plurality of fin arrays mounted on the heat sink, and a plurality of LED modules mounted on the fin arrays. The heat sink includes a base and a plurality of heat dissipating fins extending from the base. The fin arrays are mounted on a top surface of the base of the heat sink. Each fin array consists of a plurality of fins interlocked together. Each fin array has a bottom mounting surface in contact with the top surface of the base and a top engaging surface defined at an acute angle with respect to the top surface of the base. The LED modules are mounted on the engaging surfaces of the fin arrays, respectively, via heat absorbing plates.

摘要翻译： LED灯包括散热器，安装在散热器上的多个散热片阵列和安装在散热片阵列上的多个LED模块。 散热器包括基部和从基部延伸的多个散热翅片。 翅片阵列安装在散热器底座的顶表面上。 每个翅片阵列由互锁在一起的多个翅片组成。 每个翅片阵列具有与基部的顶表面接触的底部安装表面和相对于基部的顶部表面以锐角限定的顶部接合表面。 LED模块分别通过吸热板安装在翅片阵列的接合表面上。

公开(公告)号：US20090059536A1

公开(公告)日：2009-03-05

申请号：US12269858

申请日：2008-11-12

申请人： CHENG-TIEN LAI ,  JIN-SONG FENG

发明人： CHENG-TIEN LAI ,  JIN-SONG FENG

IPC分类号： H05K7/20

CPC分类号： H01L23/467 ,  H01L23/3672 ,  H01L23/4093 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipation assembly includes a heat sink, a retention module surrounding the heat sink, and a pair of wire clips pivotably attached to the retention module to press the heat sink against an electronic component on a printed circuit board. The retention module includes three walls surrounding a rectangular opening through which the heat sink contacts with the electronic component. Two barbs and two supporting members are formed on the three walls. Each clip includes a pivoting section retained in one supporting member, an abutting section pressing the heat sink toward the electronic component, and a locking section locked with one barb, a connecting section connecting the abutting section with the pivoting section, and a handle formed from the locking section. Each clip is entirely located at a corresponding side of the heat sink.

摘要翻译： 散热组件包括散热器，围绕散热器的保持模块以及可枢转地连接到保持模块的一对线夹，以将散热器压靠在印刷电路板上的电子部件上。 保持模块包括围绕矩形开口的三个壁，散热器通过该壁与电子部件接触。 在三面墙上形成两个倒钩和两个支撑构件。 每个夹具包括保持在一个支撑构件中的枢转部分，将热沉朝向电子部件按压的邻接部分，以及一个锁定在一个倒钩上的锁定部分，连接该邻接部分与枢转部分的连接部分以及由 锁定部分。 每个夹子完全位于散热器的相应侧。

公开(公告)号：US20120183396A1

公开(公告)日：2012-07-19

申请号：US13271363

申请日：2011-10-12

申请人： JIN-SONG FENG ,  XING-HUA HE

发明人： JIN-SONG FENG ,  XING-HUA HE

IPC分类号： F01D25/28

CPC分类号： H05K7/20172 ,  F04D25/0613 ,  F04D29/601

摘要： An exemplary fan mount for mounting a fan which has a connecting hole includes a frame and a fastener. The frame comprising a sidewall defining a chamber for receiving the fan and a connecting wall extending inwards from the sidewall towards the chamber. A hollow elastic pole extends out from the connecting wall into the chamber, for inserting in the connecting hole of the fan. A through hole extends through the elastic hole and a corresponding part of the connecting wall. The fastener includes a shaft for engaging in the through hole. When the fastener is inserted in the through hole, the fixing pole deforms to make an outer end thereof away from the connecting wall enlarge, thereby fixing the fastener on the frame.

摘要翻译： 用于安装具有连接孔的风扇的示例性风扇安装架包括框架和紧固件。 所述框架包括限定用于容纳所述风扇的室的侧壁和从所述侧壁向所述室向内延伸的连接壁。 中空的弹性杆从连接壁伸出进入腔室，用于插入风扇的连接孔中。 通孔延伸穿过弹性孔和连接壁的对应部分。 紧固件包括用于接合在通孔中的轴。 当紧固件插入通孔中时，固定杆变形，使得其外端远离连接壁变大，从而将紧固件固定在框架上。

公开(公告)号：US20090290342A1

公开(公告)日：2009-11-26

申请号：US12340488

申请日：2008-12-19

申请人： YI ZHANG ,  CHENG-TIEN LAI ,  JIN-SONG FENG ,  WEI-LE WU

发明人： YI ZHANG ,  CHENG-TIEN LAI ,  JIN-SONG FENG ,  WEI-LE WU

IPC分类号： F21V8/00

CPC分类号： F21V17/12 ,  F21K9/00 ,  Y10S362/80

摘要： An LED light source includes an LED module and a light-guiding module fixed on the LED module. The LED module includes a printed circuit board and a plurality of LEDs. The light-guiding module includes a frame placed on the LED module and a plurality of light guiding units engaging with the frame. The frame defines an opening in a lower portion thereof to receive the LEDs of the LED module therein and a recess in an upper portion thereof and in communication with the opening. Each of the light guiding units has a base with two flanges respectively fittingly received in two cutouts of the recess of the frame so that the light guiding unit is movable along the recess until it faces a corresponding LED.

摘要翻译： LED光源包括LED模块和固定在LED模块上的导光模块。 LED模块包括印刷电路板和多个LED。 导光模块包括放置在LED模块上的框架和与框架接合的多个导光单元。 框架在其下部限定开口以将LED模块的LED接收到其中，并且其上部的凹部与开口连通。 每个导光单元具有一个具有两个凸缘的底座，两个凸缘分别适合地容纳在框架的凹部的两个切口中，使得导光单元可以沿着凹部移动，直到其面对相应的LED。

公开(公告)号：US20090027858A1

公开(公告)日：2009-01-29

申请号：US11782459

申请日：2007-07-24

申请人： CHENG-TIEN LAI ,  JIN-SONG FENG ,  SONG-SHUI LIU

发明人： CHENG-TIEN LAI ,  JIN-SONG FENG ,  SONG-SHUI LIU

IPC分类号： H05K7/20

CPC分类号： H01L23/4093 ,  H01L23/3672 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipating device assembly for dissipating heat generated by an electronic component (32) mounted on a printed circuit board (30) is disclosed. The heat dissipating device assembly includes a back plate (26) mounted below the printed circuit board, a retention module (22) secured on the printed circuit board, a heat sink (10) disposed on the retention module for contacting the electronic component, and a pair of wire clips (24) pivotably attached to two opposite walls (222) of the retention module. The pair of clips produce symmetrical pressure acting on two lateral sides of the heat sink, thus holding the heat sink in reliable contact with the electronic component.

摘要翻译： 公开了一种用于散发由安装在印刷电路板（30）上的电子部件（32）产生的热量的散热装置组件。 所述散热装置组件包括安装在所述印刷电路板下方的背板（26），固定在所述印刷电路板上的保持模块（22），设置在所述保持模块上用于接触所述电子部件的散热片（10） 一对线夹（24），其可枢转地连接到保持模块的两个相对的壁（222）。 这对夹子产生作用在散热器的两个侧面上的对称压力，从而将散热器保持与电子部件的可靠接触。

公开(公告)号：US20130112387A1

公开(公告)日：2013-05-09

申请号：US13338252

申请日：2011-12-28

申请人： JI-YUN QIN ,  JIN-SONG FENG ,  QIANG YAN

发明人： JI-YUN QIN ,  JIN-SONG FENG ,  QIANG YAN

IPC分类号： F28F7/00

CPC分类号： H05K7/20418 ,  H01L23/367 ,  H01L2023/4056 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipation device includes a first heat sink and a second heat sink connected to each other. Each of the first and second heat sinks includes a base and a plurality of fins extending from the base. The base of the first heat sink forms a rib on a lateral face thereof, and the base of the second heat sink defines a groove in a lateral face thereof. The rib is received in the groove to connect the first heat sink with the second heat sink.

摘要翻译： 散热装置包括彼此连接的第一散热器和第二散热器。 第一和第二散热片中的每一个包括基部和从基部延伸的多个翅片。 第一散热器的底部在其侧面上形成肋，第二散热器的基部在其侧面中形成凹槽。 肋被容纳在凹槽中以将第一散热器与第二散热器连接。