公开(公告)号：US10752755B2

公开(公告)日：2020-08-25

申请号：US16081430

申请日：2017-02-28

Applicant: JNC CORPORATION ,  OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGY

Inventor： Takeshi Fujiwara ,  Takayuki Hattori ,  Jyunichi Inagaki ,  Takafumi Kuninobu ,  Kazuhiro Takizawa ,  Yasuyuki Agari ,  Hiroshi Hirano ,  Joji Kadota ,  Akinori Okada

IPC: C08K9/06 ,  C08L63/00 ,  C08L83/04 ,  C08G59/32 ,  C09K5/14 ,  C08L83/06 ,  C08K9/04 ,  H01L23/26 ,  C09C3/12 ,  C08K3/04 ,  C08G77/04 ,  C08K3/14 ,  C08K3/22 ,  C08K3/28 ,  C08K3/34 ,  C08K3/38 ,  H01L23/373

Abstract: This invention is a composition capable of forming a heat-dissipating member that has high heat resistance and high thermal conductivity. This composition for a heat-dissipating member comprises a thermally conductive first inorganic filler bonded to one end of a first coupling agent, and a thermally conductive second inorganic filler bonded to one end of a second coupling agent, the composition being characterized in that: the other end of the first coupling agent and the other end of the second coupling agent are each bonded to a bifunctional or higher silsesquioxane by a curing treatment, as illustrated in FIG. 2; or at least one of the first coupling agent and the second coupling agent includes, in the structure thereof, a silsesquioxane, and the other end of the first coupling agent and the other end of the second coupling agent are bonded together as illustrated in FIG. 3.

公开(公告)号：US12187012B2

公开(公告)日：2025-01-07

申请号：US16499323

申请日：2018-03-29

Applicant: JNC CORPORATION

Inventor： Takafumi Kuninobu ,  Takeshi Fujiwara ,  Kento Ujiiye ,  Kazuhiro Takizawa

IPC: B32B27/08 ,  H01L23/373 ,  H05K1/03

Abstract: The present application relates to a laminate between an inorganic substance and metal, which is excellent in thermal conductivity and interlayer adhesion. The laminate of the present application has a thermally conductive first inorganic filler bonded with one end of first coupling agent 11; and a metal layer bonded with one end of a third coupling agent, in which the other end of the third coupling agent is bonded with the other end of the first coupling agent. The laminate has such a bond between the inorganic filler and the metal layer through an organic compound, whereby the laminate may be excellent in thermal conductivity and interlayer adhesion.