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    Light emitting device and manufacturing method of the same
    3.
    发明申请
    Light emitting device and manufacturing method of the same 审中-公开
    发光器件及其制造方法相同

    公开(公告)号：US20080290359A1

    公开(公告)日：2008-11-27

    申请号：US12081888

    申请日：2008-04-23

    申请人： Tomio Inoue ,  Tsuyoshi Tsutsui ,  Jae Joon Yoon ,  Ok Hee Shin

    发明人： Tomio Inoue ,  Tsuyoshi Tsutsui ,  Jae Joon Yoon ,  Ok Hee Shin

    IPC分类号： H01L33/00

    CPC分类号： H01L33/52 ,  B29C39/42 ,  H01L24/97 ,  H01L33/0095 ,  H01L33/483 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2924/00014 ,  H01L2924/00

    摘要： There is provided a light emitting device including: a package body having first and second circumferential surfaces and a plurality of side surfaces formed therebetween, the package body defined into first and second level areas including the first and second circumferential surfaces, respectively; first and second external terminal blocks each having an electrical contact part; an LED chip disposed between the first and second external terminal blocks in the first level area and having an electrode surface where first and second electrodes are formed; and wires electrically connected to first and second electrodes of the LED chip to the electrical contact parts of the first and second external terminal blocks, respectively.

    摘要翻译： 提供了一种发光器件，包括：封装体，其具有第一和第二周向表面和形成在其间的多个侧表面，所述封装体分别限定在包括第一和第二周向表面的第一和第二水平区域中; 每个具有电接触部分的第一和第二外部接线端子; LED芯片，设置在第一电平区域中的第一和第二外部端子块之间，并且具有形成第一和第二电极的电极表面; 以及分别与LED芯片的第一和第二电极电连接到第一和第二外部端子块的电接触部分的导线。

    Small size light emitting device and manufacturing method of the same
    4.
    发明授权
    Small size light emitting device and manufacturing method of the same 有权
    小尺寸发光装置及其制造方法相同

    公开(公告)号：US08735935B2

    公开(公告)日：2014-05-27

    申请号：US13070014

    申请日：2011-03-23

    申请人： Tomio Inoue ,  Tsuyoshi Tsutsui ,  Jae Joon Yoon ,  Ok Hee Shin

    发明人： Tomio Inoue ,  Tsuyoshi Tsutsui ,  Jae Joon Yoon ,  Ok Hee Shin

    IPC分类号： H01L33/00

    CPC分类号： H01L33/52 ,  B29C39/42 ,  H01L24/97 ,  H01L33/0095 ,  H01L33/483 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2924/00014 ,  H01L2924/00

    摘要： There is provided a light emitting device including: a package body having first and second circumferential surfaces and a plurality of side surfaces formed therebetween, the package body defined into first and second level areas including the first and second circumferential surfaces, respectively; first and second external terminal blocks each having an electrical contact part; an LED chip disposed between the first and second external terminal blocks in the first level area and having an electrode surface where first and second electrodes are formed; and wires electrically connected to first and second electrodes of the LED chip to the electrical contact parts of the first and second external terminal blocks, respectively.

    摘要翻译： 提供了一种发光器件，包括：封装体，其具有第一和第二周向表面和形成在其间的多个侧表面，所述封装体分别限定在包括第一和第二周向表面的第一和第二水平区域中; 每个具有电接触部分的第一和第二外部接线端子; LED芯片，设置在第一电平区域中的第一和第二外部端子块之间，并且具有形成第一和第二电极的电极表面; 以及分别与LED芯片的第一和第二电极电连接到第一和第二外部端子块的电接触部分的导线。

    SMALL SIZE LIGHT EMITTING DEVICE AND MANUFACTURING METHOD OF THE SAME
    7.
    发明申请
    SMALL SIZE LIGHT EMITTING DEVICE AND MANUFACTURING METHOD OF THE SAME 有权
    小尺寸发光装置及其制造方法

    公开(公告)号：US20110169035A1

    公开(公告)日：2011-07-14

    申请号：US13070014

    申请日：2011-03-23

    申请人： Tomio Inoue ,  Tsuyoshi Tsutsui ,  Jae Joon Yoon ,  Ok Hee Shin

    发明人： Tomio Inoue ,  Tsuyoshi Tsutsui ,  Jae Joon Yoon ,  Ok Hee Shin

    IPC分类号： H01L33/44 ,  H01L33/62 ,  H01L33/64

    CPC分类号： H01L33/52 ,  B29C39/42 ,  H01L24/97 ,  H01L33/0095 ,  H01L33/483 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2924/00014 ,  H01L2924/00

    摘要： There is provided a light emitting device including: a package body having first and second circumferential surfaces and a plurality of side surfaces formed therebetween, the package body defined into first and second level areas including the first and second circumferential surfaces, respectively; first and second external terminal blocks each having an electrical contact part; an LED chip disposed between the first and second external terminal blocks in the first level area and having an electrode surface where first and second electrodes are formed; and wires electrically connected to first and second electrodes of the LED chip to the electrical contact parts of the first and second external terminal blocks, respectively.

    摘要翻译： 提供了一种发光器件，包括：封装体，其具有第一和第二周向表面和形成在其间的多个侧表面，所述封装体分别限定在包括第一和第二周向表面的第一和第二水平区域中; 每个具有电接触部分的第一和第二外部接线端子; LED芯片，设置在第一电平区域中的第一和第二外部端子块之间，并且具有形成第一和第二电极的电极表面; 以及分别与LED芯片的第一和第二电极电连接到第一和第二外部端子块的电接触部分的导线。