利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

16 条记录 (耗时 0.013 秒)

    SMALL SIZE LIGHT EMITTING DEVICE AND MANUFACTURING METHOD OF THE SAME
    1.
    发明申请
    SMALL SIZE LIGHT EMITTING DEVICE AND MANUFACTURING METHOD OF THE SAME 有权
    小尺寸发光装置及其制造方法

    公开(公告)号：US20110169035A1

    公开(公告)日：2011-07-14

    申请号：US13070014

    申请日：2011-03-23

    申请人： Tomio Inoue ,  Tsuyoshi Tsutsui ,  Jae Joon Yoon ,  Ok Hee Shin

    发明人： Tomio Inoue ,  Tsuyoshi Tsutsui ,  Jae Joon Yoon ,  Ok Hee Shin

    IPC分类号： H01L33/44 ,  H01L33/62 ,  H01L33/64

    CPC分类号： H01L33/52 ,  B29C39/42 ,  H01L24/97 ,  H01L33/0095 ,  H01L33/483 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2924/00014 ,  H01L2924/00

    摘要： There is provided a light emitting device including: a package body having first and second circumferential surfaces and a plurality of side surfaces formed therebetween, the package body defined into first and second level areas including the first and second circumferential surfaces, respectively; first and second external terminal blocks each having an electrical contact part; an LED chip disposed between the first and second external terminal blocks in the first level area and having an electrode surface where first and second electrodes are formed; and wires electrically connected to first and second electrodes of the LED chip to the electrical contact parts of the first and second external terminal blocks, respectively.

    摘要翻译： 提供了一种发光器件，包括：封装体，其具有第一和第二周向表面和形成在其间的多个侧表面，所述封装体分别限定在包括第一和第二周向表面的第一和第二水平区域中; 每个具有电接触部分的第一和第二外部接线端子; LED芯片，设置在第一电平区域中的第一和第二外部端子块之间，并且具有形成第一和第二电极的电极表面; 以及分别与LED芯片的第一和第二电极电连接到第一和第二外部端子块的电接触部分的导线。

    Light emitting device and backlight unit including the same
    9.
    发明授权
    Light emitting device and backlight unit including the same 失效
    发光装置和包括其的背光单元

    公开(公告)号：US07942550B2

    公开(公告)日：2011-05-17

    申请号：US12276250

    申请日：2008-11-21

    申请人： Tomio Inoue ,  Yu Dong Kim ,  Jae Woo Cho ,  Ok Hee Shin

    发明人： Tomio Inoue ,  Yu Dong Kim ,  Jae Woo Cho ,  Ok Hee Shin

    IPC分类号： F21S4/00 ,  F21V21/00

    CPC分类号： H01L33/486 ,  G02F1/133615 ,  H01L33/54 ,  H01L2224/45139 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/00011 ,  H01L2924/1815 ,  H01L2924/3025 ,  Y10S362/80 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/01049

    摘要： There are provided a light emitting device and a backlight unit including the same. The light emitting device includes a package body having opposing first and second main surfaces and side surfaces, and formed of a curable resin; first and second external terminal blocks opposing each other and each having first and second surfaces formed on the first and second main surfaces and side surfaces, the first and second external terminal blocks each including a connecting part having a bonding portion located inside the package body and a terminal portion connected to the bonding portion and exposed outward; and an LED chip including an electrode forming surface where first and second electrodes are formed and a light emitting surface located opposite to the electrode forming surface, the LED chip having the first and second electrodes electrically connected to the bonding portions of the first and second external terminal blocks, respectively.

    摘要翻译： 提供了一种发光器件和包括该发光器件的背光单元。 发光器件包括：具有相对的第一和第二主表面和侧表面的封装体，并由可固化树脂形成; 第一和第二外部端子块彼此相对并且每个具有形成在第一和第二主表面和侧表面上的第一和第二表面，每个包括具有位于封装体内部的接合部分的连接部分的第一和第二外部接线端子， 连接到所述接合部并向外露出的端子部; 以及包括形成第一和第二电极的电极形成表面和与电极形成表面相对的发光表面的LED芯片，所述LED芯片具有电连接到第一和第二外部的接合部分的第一和第二电极 端子块。

    Light emitting device and manufacturing method of the same
    10.
    发明申请
    Light emitting device and manufacturing method of the same 审中-公开
    发光器件及其制造方法相同

    公开(公告)号：US20080290359A1

    公开(公告)日：2008-11-27

    申请号：US12081888

    申请日：2008-04-23

    申请人： Tomio Inoue ,  Tsuyoshi Tsutsui ,  Jae Joon Yoon ,  Ok Hee Shin

    发明人： Tomio Inoue ,  Tsuyoshi Tsutsui ,  Jae Joon Yoon ,  Ok Hee Shin

    IPC分类号： H01L33/00

    CPC分类号： H01L33/52 ,  B29C39/42 ,  H01L24/97 ,  H01L33/0095 ,  H01L33/483 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2924/00014 ,  H01L2924/00

    摘要： There is provided a light emitting device including: a package body having first and second circumferential surfaces and a plurality of side surfaces formed therebetween, the package body defined into first and second level areas including the first and second circumferential surfaces, respectively; first and second external terminal blocks each having an electrical contact part; an LED chip disposed between the first and second external terminal blocks in the first level area and having an electrode surface where first and second electrodes are formed; and wires electrically connected to first and second electrodes of the LED chip to the electrical contact parts of the first and second external terminal blocks, respectively.

    摘要翻译： 提供了一种发光器件，包括：封装体，其具有第一和第二周向表面和形成在其间的多个侧表面，所述封装体分别限定在包括第一和第二周向表面的第一和第二水平区域中; 每个具有电接触部分的第一和第二外部接线端子; LED芯片，设置在第一电平区域中的第一和第二外部端子块之间，并且具有形成第一和第二电极的电极表面; 以及分别与LED芯片的第一和第二电极电连接到第一和第二外部端子块的电接触部分的导线。