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    INTEGRATED CIRCUIT PACKAGE SYSTEM
    4.
    发明申请
    INTEGRATED CIRCUIT PACKAGE SYSTEM 有权
    集成电路封装系统

    公开(公告)号：US20090309198A1

    公开(公告)日：2009-12-17

    申请号：US12544578

    申请日：2009-08-20

    申请人： Taesung Lee ,  Jae Soo Lee ,  Geun Sik Kim

    发明人： Taesung Lee ,  Jae Soo Lee ,  Geun Sik Kim

    IPC分类号： H01L23/495 ,  H01L21/60

    CPC分类号： H01L23/49551 ,  H01L23/3107 ,  H01L23/4951 ,  H01L2224/16 ,  H01L2924/01079 ,  H01L2924/1433

    摘要： An integrated circuit package system includes a leadframe with leads configured to provide electrical contact between an integrated circuit chip and an external electrical source. Configuring the leads to include outer leads, down set transitional leads, and down set inner leads. Connecting the integrated circuit chip electrically to the down set inner leads. Depositing an encapsulating material to prevent exposure of the down set inner leads.

    摘要翻译： 集成电路封装系统包括引线框架，其引线被配置为提供集成电路芯片和外部电源之间的电接触。 将引线配置为包括外引线，降低设定的过渡引线和降低内部引线。 将集成电路芯片电连接到下降的内部引线。 沉积封装材料以防止下降的内部引线的暴露。

    Integrated circuit package system
    5.
    发明授权
    Integrated circuit package system 有权
    集成电路封装系统

    公开(公告)号：US08410587B2

    公开(公告)日：2013-04-02

    申请号：US12544578

    申请日：2009-08-20

    申请人： Taesung Lee ,  Jae Soo Lee ,  Geun Sik Kim

    发明人： Taesung Lee ,  Jae Soo Lee ,  Geun Sik Kim

    IPC分类号： H01L23/48

    CPC分类号： H01L23/49551 ,  H01L23/3107 ,  H01L23/4951 ,  H01L2224/16 ,  H01L2924/01079 ,  H01L2924/1433

    摘要： An integrated circuit package system includes a leadframe with leads configured to provide electrical contact between an integrated circuit chip and an external electrical source. Configuring the leads to include outer leads, down set transitional leads, and down set inner leads. Connecting the integrated circuit chip electrically to the down set inner leads. Depositing an encapsulating material to prevent exposure of the down set inner leads.

    摘要翻译： 集成电路封装系统包括引线框架，其引线被配置为提供集成电路芯片和外部电源之间的电接触。 将引线配置为包括外引线，降低设定的过渡引线和降低内部引线。 将集成电路芯片电连接到下降的内部引线。 沉积封装材料以防止下降的内部引线的暴露。

    INTEGRATED CIRCUIT PACKAGE SYSTEM
    6.
    发明申请
    INTEGRATED CIRCUIT PACKAGE SYSTEM 有权
    集成电路封装系统

    公开(公告)号：US20070111394A1

    公开(公告)日：2007-05-17

    申请号：US11307313

    申请日：2006-01-31

    申请人： Taesung Lee ,  Jae Soo Lee ,  Geun Sik Kim

    发明人： Taesung Lee ,  Jae Soo Lee ,  Geun Sik Kim

    IPC分类号： H01L21/00

    CPC分类号： H01L23/49551 ,  H01L23/3107 ,  H01L23/4951 ,  H01L2224/16 ,  H01L2924/01079 ,  H01L2924/1433

    摘要： An integrated circuit package system comprised by providing a leadframe including leads configured to provide electrical contact between an integrated circuit chip and an external electrical source. Configuring the leads to include outer leads, down set transitional leads, and down set inner leads. Connecting the integrated circuit chip electrically to the down set inner leads. Depositing an encapsulating material to prevent exposure of the down set inner leads.

    摘要翻译： 一种集成电路封装系统，包括提供引线框架，该引线框架包括被配置为提供集成电路芯片和外部电源之间的电接触的引线。 将引线配置为包括外引线，降低设定的过渡引线和降低内部引线。 将集成电路芯片电连接到下降的内部引线。 沉积封装材料以防止下降的内部引线的暴露。

    Integrated circuit package system
    7.
    发明授权
    Integrated circuit package system 有权
    集成电路封装系统

    公开(公告)号：US07615851B2

    公开(公告)日：2009-11-10

    申请号：US11307313

    申请日：2006-01-31

    申请人： Taesung Lee ,  Jae Soo Lee ,  Geun Sik Kim

    发明人： Taesung Lee ,  Jae Soo Lee ,  Geun Sik Kim

    IPC分类号： H01L23/495

    CPC分类号： H01L23/49551 ,  H01L23/3107 ,  H01L23/4951 ,  H01L2224/16 ,  H01L2924/01079 ,  H01L2924/1433

    摘要： An integrated circuit package system comprised by providing a leadframe including leads configured to provide electrical contact between an integrated circuit chip and an external electrical source. Configuring the leads to include outer leads, down set transitional leads, and down set inner leads. Connecting the integrated circuit chip electrically to the down set inner leads. Depositing an encapsulating material to prevent exposure of the down set inner leads.

    摘要翻译： 一种集成电路封装系统，包括提供引线框架，该引线框架包括被配置为提供集成电路芯片和外部电源之间的电接触的引线。 将引线配置为包括外引线，降低设定的过渡引线和降低内部引线。 将集成电路芯片电连接到下降的内部引线。 沉积封装材料以防止下降的内部引线的暴露。

    Golf grip
    8.
    外观设计
    Golf grip 有权

    公开(公告)号：USD1005427S1

    公开(公告)日：2023-11-21

    申请号：US29892297

    申请日：2023-05-16

    申请人： Jae Soo Lee ,  Sarah Cho

    设计人： Jae Soo Lee ,  Sarah Cho

    摘要： FIG. 1 is a perspective view of the golf grip;
    FIG. 2 is a top plan view thereof;
    FIG. 3 is a bottom plan view thereof;
    FIG. 4 is a right side view thereof;
    FIG. 5 is a left side view thereof;
    FIG. 6 is a front view thereof;
    FIG. 7 is a rear view thereof; and,
    FIG. 8 is an enlarged break out view taken in circle 8 of FIG. 2.
    The dash-dot dash broken line disclosed on FIG. 2 forms no part of the claimed design.
    The broken lines in the drawings depict environmental subject matter of the golf grip only and form no part of the claimed design.

    Golf mat that induces a down blow impact zone swing
    10.
    发明授权
    Golf mat that induces a down blow impact zone swing 有权

    公开(公告)号：US11745076B1

    公开(公告)日：2023-09-05

    申请号：US18108244

    申请日：2023-02-10

    申请人： Jae Soo Lee ,  Sarah Cho

    发明人： Jae Soo Lee ,  Sarah Cho

    IPC分类号： A63B69/36 ,  A63B71/06

    CPC分类号： A63B69/3661 ,  A63B69/3667 ,  A63B2071/0694

    摘要： A golf mat has a down-blow impact mat removably placed in a cutout formed in a base. The upper surface of the down-blow impact mat has a hitting section that slopes down gradually from the high point to a target point. The down-blow impact mat also has a lower portion having a sloping section and a flat section. The golf mat disclosed helps to improve the golfer's takeaway swing and the downswing so the golfer may practice his or her swing, including but not limited to, better mastering the elusive two-plane golf swing, with the guidance of the sloped hitting surface.