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1.发明申请SEMICONDUCTOR FLIP CHIP PACKAGE HAVING SUBSTANTIALLY NON-COLLAPSIBLE SPACER AND METHOD OF MANUFACTURE THEREOF 有权具有主要不可剥离间隔件的半导体片状芯片包及其制造方法公开(公告)号：US20110108970A1
公开(公告)日：2011-05-12
申请号：US13006697
申请日：2011-01-14
申请人： Jae Soo Lee , Geun Sik Kim , Sheila Marie L. Alvarez , Robinson Quiazon , Hin Hwa Goh , Frederick Dahilig
发明人： Jae Soo Lee , Geun Sik Kim , Sheila Marie L. Alvarez , Robinson Quiazon , Hin Hwa Goh , Frederick Dahilig
IPC分类号： H01L23/495 , H01L23/48 , H01L21/50
CPC分类号： H01L23/49513 , H01L23/16 , H01L23/3107 , H01L23/4952 , H01L24/11 , H01L24/13 , H01L24/81 , H01L2224/0401 , H01L2224/0603 , H01L2224/06505 , H01L2224/10165 , H01L2224/11 , H01L2224/1134 , H01L2224/13 , H01L2224/13099 , H01L2224/13144 , H01L2224/136 , H01L2224/1403 , H01L2224/14505 , H01L2224/16 , H01L2224/16245 , H01L2224/81136 , H01L2224/8114 , H01L2224/81193 , H01L2224/81801 , H01L2924/01027 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H01L2924/181 , H01L2924/00
摘要： A flip chip lead frame package includes a die and a lead frame having a die paddle and leads, and has a spacer to maintain a separation between the die and the die paddle. Also, methods for making the package are disclosed.
摘要翻译： 倒装芯片引线框架封装包括管芯和具有管芯焊盘和引线的引线框架，并且具有间隔件以保持管芯和管芯焊盘之间的间隔。 此外，公开了制造包装的方法。
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2.发明授权Semiconductor flip chip package having substantially non-collapsible spacer and method of manufacture thereof 有权具有基本上不可折叠间隔物的半导体倒装芯片封装及其制造方法公开(公告)号：US08405230B2
公开(公告)日：2013-03-26
申请号：US13006697
申请日：2011-01-14
申请人： Jae Soo Lee , Geun Sik Kim , Sheila Marie L. Alvarez , Robinson Quiazon , Hin Hwa Goh , Frederick Rodriguez Dahilig
发明人： Jae Soo Lee , Geun Sik Kim , Sheila Marie L. Alvarez , Robinson Quiazon , Hin Hwa Goh , Frederick Rodriguez Dahilig
IPC分类号： H01L23/495 , H01L23/48 , H01L21/50
CPC分类号： H01L23/49513 , H01L23/16 , H01L23/3107 , H01L23/4952 , H01L24/11 , H01L24/13 , H01L24/81 , H01L2224/0401 , H01L2224/0603 , H01L2224/06505 , H01L2224/10165 , H01L2224/11 , H01L2224/1134 , H01L2224/13 , H01L2224/13099 , H01L2224/13144 , H01L2224/136 , H01L2224/1403 , H01L2224/14505 , H01L2224/16 , H01L2224/16245 , H01L2224/81136 , H01L2224/8114 , H01L2224/81193 , H01L2224/81801 , H01L2924/01027 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H01L2924/181 , H01L2924/00
摘要： A flip chip lead frame package includes a die and a lead frame having a die paddle and leads, and has a spacer to maintain a separation between the die and the die paddle. Also, methods for making the package are disclosed.
摘要翻译： 倒装芯片引线框架封装包括管芯和具有管芯焊盘和引线的引线框架，并且具有间隔件以保持管芯和管芯焊盘之间的间隔。 此外，公开了制造包装的方法。
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公开(公告)号：US07250685B2
公开(公告)日：2007-07-31
申请号：US11307384
申请日：2006-02-04
IPC分类号： H01L23/48
CPC分类号： H01L23/3107 , H01L21/4828 , H01L23/49548 , H01L23/49568 , H01L24/17 , H01L2224/13099 , H01L2224/16245 , H01L2924/01029 , H01L2924/01033 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/00
摘要： The present invention provides an etched leadframe flipchip package system comprising forming a leadframe comprises forming contact leads and etching a plurality of multiple dotted grooves on the contact leads, and attaching a flipchip integrated circuit having solder interconnects on the contact leads between each of the plurality of the multiple dotted grooves.
摘要翻译： 本发明提供了一种蚀刻引线框倒装芯片封装系统，包括形成引线框架，包括形成接触引线并在接触引线上蚀刻多个多点状沟槽，以及将具有焊料互连的倒装芯片集成电路连接在多个 多点划线。
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公开(公告)号：US07414318B2
公开(公告)日：2008-08-19
申请号：US11766095
申请日：2007-06-20
IPC分类号： H01L23/495
CPC分类号： H01L23/3107 , H01L21/4828 , H01L23/49548 , H01L23/49568 , H01L24/17 , H01L2224/13099 , H01L2224/16245 , H01L2924/01029 , H01L2924/01033 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/00
摘要： The present invention provides an etched leadframe flipchip package system comprising forming a leadframe comprises forming contact leads and etching a plurality of multiple dotted grooves on the contact leads, and attaching a flipchip integrated circuit having solder interconnects on the contact leads between each of the plurality of the multiple dotted grooves.
摘要翻译： 本发明提供了一种蚀刻引线框倒装芯片封装系统，包括形成引线框架，包括形成接触引线并在接触引线上蚀刻多个多点状沟槽，以及将具有焊料互连的倒装芯片集成电路连接在多个 多点划线。
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公开(公告)号：US07443015B2
公开(公告)日：2008-10-28
申请号：US11381734
申请日：2006-05-04
IPC分类号： H01L21/00
CPC分类号： H01L23/49548 , H01L23/49503 , H01L23/4951 , H01L24/16 , H01L24/81 , H01L2224/10175 , H01L2224/13099 , H01L2224/16245 , H01L2224/8121 , H01L2224/81815 , H01L2924/01033 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/15787 , H01L2924/18301 , H01L2924/00
摘要： An integrated circuit package system includes an integrated circuit package having a downset terminal lead, a planar recessed lead surface of the downset terminal lead, and an attached integrated circuit over the planar recessed lead surface.
摘要翻译： 集成电路封装系统包括集成电路封装，其具有开路端子引线，开路端子引线的平面凹陷引线表面和平面凹陷引线表面上的附接集成电路。
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公开(公告)号：US07482683B2
公开(公告)日：2009-01-27
申请号：US11383038
申请日：2006-05-12
申请人： Antonio B. Dimaano, Jr. , Erick Dahilig , Sheila Marie L. Alvarez , Robinson Quiazon , Jose Alvin Caparas
发明人： Antonio B. Dimaano, Jr. , Erick Dahilig , Sheila Marie L. Alvarez , Robinson Quiazon , Jose Alvin Caparas
CPC分类号： H01L23/49541 , H01L21/565 , H01L23/49548 , H01L24/97 , H01L2224/16245 , H01L2924/14 , H01L2924/181 , H01L2924/00
摘要： An integrated circuit encapsulation system with vent is provided including providing a sheet material, forming a leadframe array on the sheet material, forming a leadframe air vent on the leadframe array, attaching an integrated circuit to the leadframe array, mounting the leadframe array in a mold and encapsulating the integrated circuit and the leadframe array.
摘要翻译： 提供具有通气孔的集成电路封装系统，包括提供片材，在片材上形成引线框架阵列，在引线框阵列上形成引线框架通气孔，将集成电路连接到引线框架阵列，将引线框阵列安装在模具中 并封装集成电路和引线框阵列。
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公开(公告)号：US07327025B2
公开(公告)日：2008-02-05
申请号：US10836916
申请日：2004-04-30
CPC分类号： H01L23/36 , H01L23/4334 , H01L2224/16 , H01L2224/73253 , H01L2924/15311 , H01L2924/16152 , H01L2924/16195 , H01L2924/19105
摘要： An electronic device having a substrate carrier is provided. A semiconductor connected to the substrate carrier. A heat spreader having upper and lower surfaces and legs recessed below the lower surface is connected to the substrate carrier. The Z-dimension between the heat spreader and the substrate carrier is maintained over substantially the entire area of the substrate carrier.
摘要翻译： 提供具有基板载体的电子装置。 连接到衬底载体的半导体。 具有在下表面下方凹陷的上表面和下表面和腿的散热器连接到基板载体。 散热器和基板载体之间的Z-尺寸维持在基板载体的基本上整个区域上。
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8.发明申请INTEGRATED CIRCUIT PACKAGING SYSTEM WITH CONDUCTIVE INK AND METHOD OF MANUFACTURE THEREOF 审中-公开具有导电油墨的集成电路包装系统及其制造方法公开(公告)号：US20150179602A1
公开(公告)日：2015-06-25
申请号：US14136274
申请日：2013-12-20
IPC分类号： H01L23/00
CPC分类号： H01L24/82 , H01L21/4867 , H01L23/3192 , H01L23/4828 , H01L24/19 , H01L24/96 , H01L2224/02311 , H01L2224/02377 , H01L2224/02379 , H01L2224/02381 , H01L2224/0239 , H01L2224/04105 , H01L2224/05548 , H01L2224/05569 , H01L2224/05611 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05664 , H01L2224/12105 , H01L2224/13022 , H01L2224/131 , H01L2224/19 , H01L2924/181 , H01L2924/00 , H01L2924/014
摘要： An integrated circuit packaging system and method of manufacture thereof including: an integrated circuit die having a contact pad; a redistribution layer on the contact pad, the redistribution layer having a chip contact, a trace, and a bump pad, the redistribution layer having a curved top surface and sidewalls which are planar; an upper passivation layer on the sidewalls of the redistribution layer with the area above the bump pad of the redistribution layer exposed from the upper passivation layer; and an external interconnect attached over the bump pad.
摘要翻译： 一种集成电路封装系统及其制造方法，包括：具有接触焊盘的集成电路管芯; 接触焊盘上的再分配层，再分配层具有芯片接触，迹线和凸块焊盘，再分布层具有弯曲的顶表面和平面的侧壁; 在再分配层的侧壁上的上钝化层，其中再分配层的凸块焊盘上方的区域暴露于上钝化层; 以及连接在凸块上的外部互连。
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公开(公告)号：US20110147899A1
公开(公告)日：2011-06-23
申请号：US13039311
申请日：2011-03-03
申请人： Frederick Rodriguez Dahilig , Sheila Marie L. Alvarez , Antonio B. Dimaano, JR. , Dioscoro A. Merilo
发明人： Frederick Rodriguez Dahilig , Sheila Marie L. Alvarez , Antonio B. Dimaano, JR. , Dioscoro A. Merilo
CPC分类号： H01L21/6835 , H01L21/568 , H01L23/13 , H01L23/3121 , H01L23/49541 , H01L23/49548 , H01L23/49575 , H01L23/49582 , H01L23/49805 , H01L24/16 , H01L24/28 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/81 , H01L24/85 , H01L25/0657 , H01L25/50 , H01L2224/0401 , H01L2224/05644 , H01L2224/13099 , H01L2224/16225 , H01L2224/16245 , H01L2224/32145 , H01L2224/45139 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48465 , H01L2224/49171 , H01L2224/73265 , H01L2224/81801 , H01L2224/83101 , H01L2224/83856 , H01L2224/85001 , H01L2224/85385 , H01L2224/85411 , H01L2224/85416 , H01L2224/85444 , H01L2224/85455 , H01L2224/85464 , H01L2225/0651 , H01L2225/06517 , H01L2225/06572 , H01L2225/06579 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/181 , H01L2924/18165 , H01L2924/3025 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A method of manufacturing an integrated circuit packaging system includes: providing an inner lead and an outer lead, the inner lead having an inner peripheral side with a non-linear contour; forming a bump contact, having a groove in and a mesa from the inner lead or the outer lead, the groove adjacent to the mesa; mounting a first device adjacent to the inner lead; connecting a second device to the mesa; and forming an encapsulation material over the first device, the inner lead, and the outer lead and covering the second device.
摘要翻译： 一种制造集成电路封装系统的方法包括：提供内引线和外引线，所述内引线具有非线性轮廓的内周侧; 形成凸起接触，其具有从内引线或外引线的凹槽和台面，与台面相邻的凹槽; 安装与内引线相邻的第一器件; 将第二设备连接到台面; 以及在所述第一装置，所述内引线和所述外引线上形成封装材料并覆盖所述第二装置。
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公开(公告)号：US20090273062A1
公开(公告)日：2009-11-05
申请号：US12498163
申请日：2009-07-06
IPC分类号： H01L23/552 , H01L23/36
CPC分类号： H01L23/3672 , H01L21/4878 , H01L2224/32225 , H01L2924/15311
摘要： A semiconductor heat spreader from a unitary metallic plate is provided. The unitary metallic plate is formed into a panel, channel walls, at least two feet, and at least one external reversing bend. The channel walls depend from the panel to define a channel between the channel walls and the panel for receiving a semiconductor therein. The feet extend from respective channel walls for attachment to a substrate.
摘要翻译： 提供了从一体金属板制成的半导体散热器。 整体金属板形成一个面板，通道壁，至少两个脚和至少一个外部反向弯曲。 通道壁从面板取决于在通道壁和面板之间限定通道，用于在其中接收半导体。 脚从相应的通道壁延伸以附接到基底。
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