ANTENNA PATTERN FRAME AND METHOD OF MANUFACTURING THE SAME
    8.
    发明申请
    ANTENNA PATTERN FRAME AND METHOD OF MANUFACTURING THE SAME 有权
    天线图案框架及其制造方法

    公开(公告)号:US20100271283A1

    公开(公告)日:2010-10-28

    申请号:US12645992

    申请日:2009-12-23

    IPC分类号: H01Q1/36 H01Q1/50 H01P11/00

    摘要: An antenna pattern frame according to an aspect of the invention may include: a radiator having an antenna pattern portion transmitting and receiving a signal and a connection terminal portion allowing the signal to be transmitted to and received from a circuit board of an electronic device; a connection portion partially forming the radiator and connecting the antenna pattern portion and the connection terminal portion to be arranged in different planes; a radiator frame manufactured by injection molding on the radiator so that the antenna pattern portion may be provided on one side of the radiator frame and the connection terminal portion may be provided on the other side thereof, while the antenna pattern portion is embedded in the electronic device case; and a contact surface extension provided on the radiator to prevent the radiator from being loosened from the radiator frame during injection molding of the radiator frame, and increasing a contact area with respect to the radiator frame.

    摘要翻译: 根据本发明的一个方面的天线图案框架可以包括:具有发射和接收信号的天线图案部分的散热器和允许信号传送到电子设备的电路板并从电子设备的电路板接收的连接端子部分; 连接部,其部分地形成所述散热器,并将所述天线图案部分和所述连接端子部分连接在不同的平面内; 通过在散热器上注射成型制造的散热器框架,使得天线图案部分可以设置在散热器框架的一侧,并且连接端子部分可以设置在其另一侧,而天线图案部分嵌入电子 设备案例 以及设置在散热器上的接触表面延伸部,以防止散热器框架在注射模制期间散热器从散热器框架松动,并且增加相对于散热器框架的接触面积。

    ELECTRONIC DEVICE CASE HAVING ANTENNA PATTERN EMBEDDED THEREIN, METHOD FOR MANUFACTURING THE SAME, MOLD FOR MANUFACTURING ANTENNA PATTERN FRAME, AND ELECTRONIC DEVICE
    10.
    发明申请
    ELECTRONIC DEVICE CASE HAVING ANTENNA PATTERN EMBEDDED THEREIN, METHOD FOR MANUFACTURING THE SAME, MOLD FOR MANUFACTURING ANTENNA PATTERN FRAME, AND ELECTRONIC DEVICE 审中-公开
    具有嵌入天线图案的电子设备壳体,其制造方法,用于制造天线图案的模具和电子设备

    公开(公告)号:US20120001807A1

    公开(公告)日:2012-01-05

    申请号:US13091850

    申请日:2011-04-21

    IPC分类号: H01Q1/24 B29C45/14 B29C45/04

    CPC分类号: H01Q1/40 H01Q1/243 H01Q1/38

    摘要: An electronic device case includes: a radiator including an antenna pattern part transmitting or receiving a signal and a connection terminal part allowing the signal to be transmitted to or received from a circuit board of an electronic device; a radiator frame including the radiator injection-molded thereon, separated from the connection terminal part so that the connection part can have elasticity, and having a radiator support protruded from the opposite surface of one surface on which the antenna pattern part is formed; and a case frame covering one surface of the radiator frame to allow the antenna pattern part to be embedded between the case frame and the radiator frame.

    摘要翻译: 电子设备壳体包括:辐射器,包括发送或接收信号的天线图案部分和允许信号发送到电子设备的电路板或从电子设备的电路板接收的连接端子部分; 散热器框架,其包括注射在其上的散热器,与连接端子部分分离,使得连接部分具有弹性,并且具有从形成有天线图案部分的一个表面的相对表面突出的散热器支撑件; 以及覆盖散热器框架的一个表面的壳体框架,以允许天线图案部分嵌入在壳体框架和散热器框架之间。