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公开(公告)号：US08165645B2
公开(公告)日：2012-04-24
申请号：US12332244
申请日：2008-12-10
申请人： Byung Hwa Lee , Yong Won Yu , Hyun Sam Mun , Young Suk Kim
发明人： Byung Hwa Lee , Yong Won Yu , Hyun Sam Mun , Young Suk Kim
IPC分类号： H04M1/00
CPC分类号： H01Q1/243 , H05K1/0284 , H05K3/4069 , H05K2201/0959 , H05K2201/0999 , H05K2201/10242
摘要： There is provided a mobile communication terminal case including: a case body of a mobile communication terminal having a first surface and a second surface opposite to the first surface, and a via hole formed through the first surface and the second surface; a conductive pattern provided on the first surface of the case body; a carrier film provided on the first surface of the case body to cover the conductive pattern; and conductive epoxy filling the via hole and having one end thereof in contact with the conductive pattern.
摘要翻译： 提供了一种移动通信终端壳体，包括：具有第一表面和与第一表面相对的第二表面的移动通信终端的壳体，以及穿过第一表面和第二表面形成的通孔; 设置在壳体的第一表面上的导电图案; 载体膜，设置在所述壳体的所述第一表面上以覆盖所述导电图案; 和导电环氧树脂填充通孔并且其一端与导电图案接触。
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2.发明申请ELECTRONIC DEVICE HAVING TRANSMISSION LINE PATTERN EMBEDDED IN CASE AND METHOD FOR MANUFACTURING THE SAME 审中-公开具有嵌入式传输线图案的电子设备及其制造方法公开(公告)号：US20120039050A1
公开(公告)日：2012-02-16
申请号：US13094410
申请日：2011-04-26
申请人： Ki Won CHANG , Jae Suk SUNG , Dae Kyu LEE , Hyun Do PARK , Chang Mok HAN , Hyun Sam MUN , Dae Ki LIM , Sang Woo BAE , Dae Seong JEON , Ha Ryong HONG
发明人： Ki Won CHANG , Jae Suk SUNG , Dae Kyu LEE , Hyun Do PARK , Chang Mok HAN , Hyun Sam MUN , Dae Ki LIM , Sang Woo BAE , Dae Seong JEON , Ha Ryong HONG
CPC分类号： H01Q1/243 , B29C45/1671 , H01Q1/405 , H01Q9/42 , Y10T29/49147
摘要： There are provided an electronic device having a transmission line pattern embedded in a case and a method for manufacturing the same. The electronic device includes a line pattern body embedded in a case and including a line pattern for electrically connecting components to each other, terminal portions respectively disposed at portions of the line pattern corresponding to terminals of the components to be electrically connected, and exposed from the bottom of the case, and connection members connecting the terminals of the components with the terminal portions.
摘要翻译： 提供了一种具有嵌入在壳体中的传输线图案的电子设备及其制造方法。 该电子设备包括嵌入壳体中并包括用于将部件彼此电连接的线图案的线条图案体，分别设置在与要电连接的部件的端子相对应的线图案的部分处并从 壳体的底部以及将部件的端子与端子部分连接的连接部件。
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3.发明申请CASE OF ELECTRONIC DEVICE HAVING LOW FREQUENCY ANTENNA PATTERN EMBEDDED THEREIN, MOLD THEREFOR AND METHOD OF MANUFACTURING THEREOF 有权具有嵌入式低频天线图案的电子设备的情况，其制造方法及其制造方法公开(公告)号：US20110278186A1
公开(公告)日：2011-11-17
申请号：US13103297
申请日：2011-05-09
申请人： Jae Suk SUNG , Ha Ryong HONG , Ki Won CHANG , Hyun Sam MUN , Dae Kyu LEE , Byung Hwa LEE , Tae Sung KIM , Dae Ki LIM , Yong Shik NA , Duk Woo LEE
发明人： Jae Suk SUNG , Ha Ryong HONG , Ki Won CHANG , Hyun Sam MUN , Dae Kyu LEE , Byung Hwa LEE , Tae Sung KIM , Dae Ki LIM , Yong Shik NA , Duk Woo LEE
CPC分类号： H01Q1/243 , B29C45/0046 , B29C45/14065 , B29C45/14418 , B29C45/14639 , B29C45/1671 , B29C2045/0049 , B29K2105/16 , B29K2995/0008 , B29L2031/3431 , B29L2031/3456 , B29L2031/3481
摘要： There is provided an electronic device case having a low frequency antenna pattern embedded therein, the case including: a radiator frame injection molded using a polymer mixture containing a magnetic substance component so that a radiator including a low frequency antenna pattern part is formed on one surface thereof; a case frame injection molded upwardly of the radiator frame and provided with the radiator embedded between the radiator frame and the case frame; and a boundary part forming a boundary between the radiator frame and the case frame and having a groove formed inwardly of the case frame.
摘要翻译： 提供了一种嵌入其中的低频天线方向图的电子设备壳体，该壳体包括：使用含有磁性体成分的聚合物混合物注射成型的散热器框架，使得在一个表面上形成包括低频天线图案部分的散热器 的; 在所述散热器框架上向上模塑并且设置有散热器框架和所述壳体框架之间的散热器的壳体框架; 以及形成散热器框架和壳体框架之间的边界并且具有形成在壳体框架内侧的槽的边界部分。
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4.发明申请CASE OF ELECTRONIC DEVICE HAVING ANTENNA PATTERN EMBEDDED THEREIN, AND MOLD THEREFOR AND METHOD OF MANUFACTURING THEREOF 失效具有嵌入式天线图案的电子设备及其制造方法及其制造方法公开(公告)号：US20110279002A1
公开(公告)日：2011-11-17
申请号：US13103398
申请日：2011-05-09
申请人： Chang Hok HAN , Ha Ryong HONG , Ki Won CHANG , Duk Woo LEE , Hyun Sam MUN , Dae Seong JEON , Tae Sung KIM , Hyun Kil NAM , Jae Suk SUNG , Dae Kyu LEE
发明人： Chang Hok HAN , Ha Ryong HONG , Ki Won CHANG , Duk Woo LEE , Hyun Sam MUN , Dae Seong JEON , Tae Sung KIM , Hyun Kil NAM , Jae Suk SUNG , Dae Kyu LEE
CPC分类号： B29C45/1671 , B29C45/0046 , B29C45/14065 , B29C45/14418 , B29C45/14639 , B29C45/14836 , B29C2045/0049 , B29L2031/3431 , B29L2031/3437 , B29L2031/3456 , B29L2031/3481 , H01Q1/243 , H01Q1/40 , H01Q5/40 , H01Q7/00 , H01Q9/0421
摘要： There is provided a case of an electronic device having an antenna pattern embedded therein, the case including: a radiator frame injection molded so that a radiator including an antenna pattern part formed of a metal sheet is exposed on one surface thereof; a case frame injection molded upward of the radiator frame, such that the radiator is embedded between the radiator frame and the case frame; and a boundary part forming a boundary between the radiator frame and the case frame and having a groove formed inward of the case frame.
摘要翻译： 提供一种具有嵌入其中的天线图案的电子设备的壳体，所述壳体包括：注射模制的散热器框架，使得包括由金属片形成的天线图案部分的散热器在其一个表面上露出; 在所述散热器框架的上方注射模塑框架，使得所述散热器嵌入在所述散热器框架和所述壳体框架之间; 以及形成散热器框架和壳体框架之间的边界并且具有形成在壳体框架内侧的槽的边界部分。
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5.发明授权Case of electronic device having antenna pattern embedded therein and mold and method for manufacturing the same 失效具有嵌入其中的天线图案的电子设备的情况及其制造方法公开(公告)号：US08711041B2
公开(公告)日：2014-04-29
申请号：US13103398
申请日：2011-05-09
申请人： Chang Hok Han , Ha Ryong Hong , Ki Won Chang , Duk Woo Lee , Hyun Sam Mun , Dae Seong Jeon , Tae Sung Kim , Hyun Kil Nam , Jae Suk Sung , Dae Kyu Lee
发明人： Chang Hok Han , Ha Ryong Hong , Ki Won Chang , Duk Woo Lee , Hyun Sam Mun , Dae Seong Jeon , Tae Sung Kim , Hyun Kil Nam , Jae Suk Sung , Dae Kyu Lee
IPC分类号： H01Q1/24
CPC分类号： B29C45/1671 , B29C45/0046 , B29C45/14065 , B29C45/14418 , B29C45/14639 , B29C45/14836 , B29C2045/0049 , B29L2031/3431 , B29L2031/3437 , B29L2031/3456 , B29L2031/3481 , H01Q1/243 , H01Q1/40 , H01Q5/40 , H01Q7/00 , H01Q9/0421
摘要： There is provided a case of an electronic device having an antenna pattern embedded therein, the case including: a radiator frame injection molded so that a radiator including an antenna pattern part formed of a metal sheet is exposed on one surface thereof; a case frame injection molded upward of the radiator frame, such that the radiator is embedded between the radiator frame and the case frame; and a boundary part forming a boundary between the radiator frame and the case frame and having a groove formed inward of the case frame.
摘要翻译： 提供一种具有嵌入其中的天线图案的电子设备的壳体，所述壳体包括：注射模制的散热器框架，使得包括由金属片形成的天线图案部分的散热器在其一个表面上露出; 在所述散热器框架的上方注射模塑框架，使得所述散热器嵌入在所述散热器框架和所述壳体框架之间; 以及形成散热器框架和壳体框架之间的边界并且具有形成在壳体框架内侧的槽的边界部分。
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6.发明申请ANTENNA RADIATOR, METHOD OF MANUFACTURING ELECTRONIC DEVICE CASE HAVING PLURALITY OF ANTENNA PATTERN RADIATORS EMBEDDED THEREIN, AND ELECTRONIC DEVICE CASE 审中-公开天线辐射器，制造具有嵌入式天线阵列散热器的电子设备的方法和电子设备公开(公告)号：US20110291899A1
公开(公告)日：2011-12-01
申请号：US13069511
申请日：2011-03-23
申请人： Sung Eun CHO , Ha Ryong HONG , Tae Sung KIM , Byung Hwa LEE , Dae Kyu LEE , Chan Gwang AN , Jae Suk SUNG , Hyun Sam MUN , Dae Ki LIM , Sang Woo BAE
发明人： Sung Eun CHO , Ha Ryong HONG , Tae Sung KIM , Byung Hwa LEE , Dae Kyu LEE , Chan Gwang AN , Jae Suk SUNG , Hyun Sam MUN , Dae Ki LIM , Sang Woo BAE
CPC分类号： H01Q1/243 , B29C45/0055 , B29C45/14639 , B29C2793/00 , B29L2031/3437 , B29L2031/3456 , Y10T29/49016
摘要： An antenna radiator includes a plurality of antenna pattern radiators including antenna pattern portions receiving or transmitting an external signal, respectively, a bridge configured to connect the antenna pattern portions, and a cutting assistance part formed in a connection portion between the bridge and the antenna pattern portions and facilitating detachment of the bridge from the antenna pattern portions.
摘要翻译： 天线辐射器包括多个天线图案散热器，分别包括接收或发送外部信号的天线图案部分，被配置为连接天线图案部分的桥和形成在桥与天线图案之间的连接部分中的切割辅助部分 并且便于桥接器与天线图案部分分离。
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7.发明申请ANTENNA PATTERN FRAME, ELECTRONIC DEVICE PROVIDED WITH ANTENNA PATTERN FRAME AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE 审中-公开天线图案框架，提供有天线图案的电子设备和用于制造电子设备的方法公开(公告)号：US20110199269A1
公开(公告)日：2011-08-18
申请号：US13023125
申请日：2011-02-08
申请人： Jae Suk SUNG , Ha Ryong HONG , Sung Eun CHO , Tae Sung KIM , Byung Hwa LEE , Hyun Sam MUN , Dae Seong JEON , Duk Woo LEE , Dae Kyu LEE , Chan Gwang AN
发明人： Jae Suk SUNG , Ha Ryong HONG , Sung Eun CHO , Tae Sung KIM , Byung Hwa LEE , Hyun Sam MUN , Dae Seong JEON , Duk Woo LEE , Dae Kyu LEE , Chan Gwang AN
CPC分类号： H01Q1/243 , H01Q1/40 , Y10T29/49018
摘要： There is provided an antenna pattern frame according to one embodiment of the present invention, including: a radiator frame that has an insertion groove formed on one surface of the radiator frame and is provided with a through part connected from one point of the insertion groove to an opposite surface to the one surface of the radiator frame; and a wire antenna that includes an antenna pattern part formed to be inserted into the insertion groove and an interconnection part formed to be exposed to the opposite surface by extending from the antenna pattern part and penetrating through the through part.
摘要翻译： 根据本发明的一个实施例，提供一种天线图案框架，包括：散热器框架，其具有形成在散热器框架的一个表面上的插入槽，并且设置有从插入槽的一个点连接的通孔， 与散热器框架的一个表面相对的表面; 以及线天线，其包括被形成为插入到所述插入槽中的天线图案部分和互连部件，所述互连部件形成为通过从所述天线图案部分延伸并穿透所述贯穿部而暴露于所述相对表面。
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公开(公告)号：US20100035671A1
公开(公告)日：2010-02-11
申请号：US12332244
申请日：2008-12-10
申请人： Byung Hwa LEE , Yong Won Yu , Hyun Sam Mun , Young Suk Kim
发明人： Byung Hwa LEE , Yong Won Yu , Hyun Sam Mun , Young Suk Kim
IPC分类号： H04M1/21
CPC分类号： H01Q1/243 , H05K1/0284 , H05K3/4069 , H05K2201/0959 , H05K2201/0999 , H05K2201/10242
摘要： There is provided a mobile communication terminal case including: a case body of a mobile communication terminal having a first surface and a second surface opposite to the first surface, and a via hole formed through the first surface and the second surface; a conductive pattern provided on the first surface of the case body; a carrier film provided on the first surface of the case body to cover the conductive pattern; and conductive epoxy filling the via hole and having one end thereof in contact with the conductive pattern.
摘要翻译： 提供了一种移动通信终端壳体，包括：具有第一表面和与第一表面相对的第二表面的移动通信终端的壳体，以及穿过第一表面和第二表面形成的通孔; 设置在壳体的第一表面上的导电图案; 载体膜，设置在所述壳体的所述第一表面上以覆盖所述导电图案; 和导电环氧树脂填充通孔并且其一端与导电图案接触。
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9.发明授权Case of electronic device having low frequency antenna pattern embedded therein, mold therefor and method of manufacturing thereof 有权具有嵌入其中的低频天线图案的电子设备的情况，其模具及其制造方法公开(公告)号：US08976074B2
公开(公告)日：2015-03-10
申请号：US13103297
申请日：2011-05-09
申请人： Jae Suk Sung , Ha Ryong Hong , Ki Won Chang , Hyun Sam Mun , Dae Kyo Lee , Byung Hwa Lee , Tae Sung Kim , Dae Ki Lim , Yong Shik Na , Duk Woo Lee
发明人： Jae Suk Sung , Ha Ryong Hong , Ki Won Chang , Hyun Sam Mun , Dae Kyo Lee , Byung Hwa Lee , Tae Sung Kim , Dae Ki Lim , Yong Shik Na , Duk Woo Lee
CPC分类号： H01Q1/243 , B29C45/0046 , B29C45/14065 , B29C45/14418 , B29C45/14639 , B29C45/1671 , B29C2045/0049 , B29K2105/16 , B29K2995/0008 , B29L2031/3431 , B29L2031/3456 , B29L2031/3481
摘要： There is provided an electronic device case having a low frequency antenna pattern embedded therein, the case including: a radiator frame injection molded using a polymer mixture containing a magnetic substance component so that a radiator including a low frequency antenna pattern part is formed on one surface thereof; a case frame injection molded upwardly of the radiator frame and provided with the radiator embedded between the radiator frame and the case frame; and a boundary part forming a boundary between the radiator frame and the case frame and having a groove formed inwardly of the case frame.
摘要翻译： 提供了一种嵌入其中的低频天线方向图的电子设备壳体，该壳体包括：使用含有磁性体成分的聚合物混合物注射成型的散热器框架，使得在一个表面上形成包括低频天线图案部分的散热器 的; 在所述散热器框架上向上模塑并且设置有散热器框架和所述壳体框架之间的散热器的壳体框架; 以及形成散热器框架和壳体框架之间的边界并且具有形成在壳体框架内侧的槽的边界部分。
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