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    Pad conditioner for chemical mechanical polishing apparatus
    4.
    发明申请
    Pad conditioner for chemical mechanical polishing apparatus 有权
    化学机械抛光装置垫垫调节剂

    公开(公告)号：US20060199482A1

    公开(公告)日：2006-09-07

    申请号：US11368704

    申请日：2006-03-07

    申请人： Sung-Taek Moon ,  Dong-Jun Lee ,  Jae-Hyun So ,  Kyoung-Moon Kang ,  Bong-Su Ahn

    发明人： Sung-Taek Moon ,  Dong-Jun Lee ,  Jae-Hyun So ,  Kyoung-Moon Kang ,  Bong-Su Ahn

    IPC分类号： B24B29/00

    CPC分类号： B24B53/017 ,  B24D7/14

    摘要： A pad conditioner may include a surface having a first region including a portion having relatively irregular shaped and friable polishing particles, and a second region including a portion having relatively regular shaped and tough polishing particles. The relatively regular shaped and tough polishing particles may be provided on the edge portion of the surface and the relatively irregular shaped and friable polishing particles may be provided on the center portion of the surface.

    摘要翻译： 垫调节剂可以包括具有包括具有相对不规则形状和易碎的抛光颗粒的部分的第一区域的表面，以及包括具有相对规则形状和韧性抛光颗粒的部分的第二区域。 可以在表面的边缘部分设置相对规则形状和韧性的抛光颗粒，并且可以在表面的中心部分上设置相对不规则形状且易碎的抛光颗粒。

    Polishing pad, method of manufacturing the polishing pad, and chemical mechanical polishing apparatus comprising the polishing pad
    5.
    发明申请
    Polishing pad, method of manufacturing the polishing pad, and chemical mechanical polishing apparatus comprising the polishing pad 审中-公开
    研磨垫，抛光垫的制造方法以及包含该抛光垫的化学机械抛光装置

    公开(公告)号：US20070037486A1

    公开(公告)日：2007-02-15

    申请号：US11500512

    申请日：2006-08-08

    申请人： Kyoung-Moon Kang ,  Bong-Su Ahn ,  Dong-Jun Lee ,  Nam-Soo Kim ,  Jae-Hyun So

    发明人： Kyoung-Moon Kang ,  Bong-Su Ahn ,  Dong-Jun Lee ,  Nam-Soo Kim ,  Jae-Hyun So

    IPC分类号： B24B51/00 ,  B24B7/30 ,  B24B29/00

    CPC分类号： B24B37/26 ,  B24D7/14

    摘要： A polishing pad of a CMP apparatus has a plurality of pores. A characteristic associated with the pores, such as average size or pore density, varies substantially from region to region of the pad across the pad in a diametral direction of the pad. The polishing pad can be designed and manufactured using sample pads whose pore characteristics differ from each other. CMP test processes are performed in which the sample pads are used to polish test wafers, and the rates at which the test wafers are polished are measured and stored in a database. The polishing pad is fabricated using data from the database so that a chemical mechanical polishing apparatus employing the pad will polish wafers with a high degree of uniformity. The database can be used to select sample pads from a stockpile. Sections of the sample pads are cut out, respectively, and fastened to one another.

    摘要翻译： CMP设备的抛光垫具有多个孔。 与孔相关的特征，例如平均尺寸或孔密度，在焊盘的沿直径方向穿过焊盘的区域与区域之间显着变化。 可以使用其孔特性彼此不同的样品垫来设计和制造抛光垫。 进行CMP测试过程，其中使用样品垫来抛光测试晶片，并测量抛光测试晶片的速率并将其存储在数据库中。 使用来自数据库的数据制造抛光垫，使得使用该垫的化学机械抛光装置将以高度均匀度抛光晶片。 数据库可用于从库存中选择样品垫。 样品垫的切片分别切割并彼此紧固。