PIEZOELECTRIC INKJET PRINTHEAD AND METHOD OF MANUFACTURING THE SAME
    1.
    发明申请
    PIEZOELECTRIC INKJET PRINTHEAD AND METHOD OF MANUFACTURING THE SAME 失效
    压电喷墨印刷机及其制造方法

    公开(公告)号:US20070171260A1

    公开(公告)日:2007-07-26

    申请号:US11468954

    申请日:2006-08-31

    IPC分类号: B41J2/045

    摘要: A piezoelectric inkjet printhead including an upper substrate formed of a single crystal silicon substrate or an SOI substrate and having an ink inlet therethrough, and a lower substrate formed of an SOI substrate having a sequentially stacked structure with a first silicon layer, an intervening oxide layer, and a second silicon layer in which a manifold, pressure chambers, and dampers are formed in the second silicon layer by wet or dry etching, and nozzles are formed through the intervening oxide layer and the first silicon layer by dry etching, and a method of manufacturing the same.

    摘要翻译: 一种压电喷墨打印头,包括由单晶硅衬底或SOI衬底形成的上衬底,并且具有墨入口,以及由具有第一硅层的顺序层叠结构的SOI衬底形成的下衬底,中间氧化物层 以及通过湿法或干蚀刻在第二硅层中形成歧管,压力室和阻尼器的第二硅层,并且通过干法蚀刻形成穿过中间氧化物层和第一硅层的喷嘴,以及方法 的制造相同。

    Piezoelectric inkjet printhead and method of manufacturing the same
    2.
    发明授权
    Piezoelectric inkjet printhead and method of manufacturing the same 有权
    压电喷墨打印头及其制造方法

    公开(公告)号:US08813363B2

    公开(公告)日:2014-08-26

    申请号:US12722843

    申请日:2010-03-12

    摘要: A method of manufacturing a piezoelectric inkjet printhead includes processing a lower silicon-on-insulator substrate having a sequentially stacked structure with a first silicon layer, an intervening oxide layer, and a second silicon layer, processing the lower silicon-on-insulator substrate by etching the second silicon layer to form a manifold, a plurality of pressure chambers arranged along at least one side of the manifold and connected with the manifold, and a plurality of dampers connected with the pressure chambers, and by etching the first silicon layer and the intervening oxide layer to form a plurality of vertical nozzles through the first silicon layer and the intervening oxide layer to corresponding ones of the plurality of dampers, stacking and bonding an upper substrate on the lower substrate, reducing the upper substrate to a predetermined thickness, and forming a piezoelectric actuator on the upper substrate.

    摘要翻译: 一种制造压电喷墨打印头的方法包括:通过第一硅层,中间氧化物层和第二硅层处理具有顺序层叠结构的下硅绝缘体上基板,通过以下方式处理下硅绝缘体上基板: 蚀刻所述第二硅层以形成歧管,沿所述歧管的至少一侧布置并与所述歧管连接的多个压力室以及与所述压力室连接的多个阻尼器,并且通过蚀刻所述第一硅层和所述第二硅层 形成多个垂直喷嘴,通过第一硅层和中间氧化物层到多个阻尼器中的相应的阻尼器,堆叠并结合下基板上的上基板,将上基板还原成预定厚度;以及 在上基板上形成压电致动器。

    PIEZOELECTRIC INKJET PRINTHEAD AND METHOD OF MANUFACTURING THE SAME
    3.
    发明申请
    PIEZOELECTRIC INKJET PRINTHEAD AND METHOD OF MANUFACTURING THE SAME 有权
    压电喷墨印刷机及其制造方法

    公开(公告)号:US20100167433A1

    公开(公告)日:2010-07-01

    申请号:US12722843

    申请日:2010-03-12

    IPC分类号: H01L21/306

    摘要: A piezoelectric inkjet printhead including an upper substrate formed of a single crystal silicon substrate or an SOI substrate and having an ink inlet therethrough, and a lower substrate formed of an SOI substrate having a sequentially stacked structure with a first silicon layer, an intervening oxide layer, and a second silicon layer in which a manifold, pressure chambers, and dampers are formed in the second silicon layer by wet or dry etching, and nozzles are formed through the intervening oxide layer and the first silicon layer by dry etching, and a method of manufacturing the same.

    摘要翻译: 一种压电喷墨打印头,包括由单晶硅衬底或SOI衬底形成的上衬底,并且具有墨入口,以及由具有第一硅层的顺序层叠结构的SOI衬底形成的下衬底,中间氧化物层 以及通过湿法或干蚀刻在第二硅层中形成歧管,压力室和阻尼器的第二硅层,并且通过干法蚀刻形成穿过中间氧化物层和第一硅层的喷嘴,以及方法 的制造相同。

    Piezoelectric inkjet printhead and method of manufacturing the same
    4.
    发明授权
    Piezoelectric inkjet printhead and method of manufacturing the same 失效
    压电喷墨打印头及其制造方法

    公开(公告)号:US07695118B2

    公开(公告)日:2010-04-13

    申请号:US11468954

    申请日:2006-08-31

    IPC分类号: B41J2/045

    摘要: A piezoelectric inkjet printhead including an upper substrate formed of a single crystal silicon substrate or an SOI substrate and having an ink inlet therethrough, and a lower substrate formed of an SOI substrate having a sequentially stacked structure with a first silicon layer, an intervening oxide layer, and a second silicon layer in which a manifold, pressure chambers, and dampers are formed in the second silicon layer by wet or dry etching, and nozzles are formed through the intervening oxide layer and the first silicon layer by dry etching, and a method of manufacturing the same.

    摘要翻译: 一种压电喷墨打印头,包括由单晶硅衬底或SOI衬底形成的上衬底,并且具有墨入口,以及由具有第一硅层的顺序层叠结构的SOI衬底形成的下衬底,中间氧化物层 以及通过湿法或干蚀刻在第二硅层中形成歧管,压力室和阻尼器的第二硅层,并且通过干法蚀刻形成穿过中间氧化物层和第一硅层的喷嘴,以及方法 的制造相同。

    Piezoelectric inkjet printhead and method of manufacturing the same
    5.
    发明授权
    Piezoelectric inkjet printhead and method of manufacturing the same 失效
    压电喷墨打印头及其制造方法

    公开(公告)号:US07703895B2

    公开(公告)日:2010-04-27

    申请号:US11333540

    申请日:2006-01-18

    IPC分类号: B41J2/045

    摘要: A piezoelectric inkjet printhead including an upper substrate, having an ink inlet, a manifold connected with the ink inlet, and a plurality of pressure chambers arranged along at least one side of the manifold, wherein the ink inlet passes through the upper substrate, and the manifold and the pressure chambers are formed in a lower surface of the upper substrate, a lower substrate disposed directly adjacent the upper substrate, the lower substrate having a plurality of restrictors each connecting the manifold with one end of each of the pressure chambers, and a plurality of nozzles each being formed in a position of the lower substrate that corresponds to the other end of each of the pressure chambers to vertically pass through the lower substrate, wherein the plurality of restrictors are formed in an upper surface of the lower substrate, and a plurality of piezoelectric actuators.

    摘要翻译: 一种压电喷墨打印头,包括具有墨入口,与墨入口连接的歧管的上基板和沿着歧管的至少一侧布置的多个压力室,其中墨入口穿过上基板, 歧管和压力室形成在上基板的下表面中,下基板直接邻近上基板设置,下基板具有多个限制器,每个限制器将歧管与每个压力室的一端连接,并且 多个喷嘴各自形成在下基板的对应于每个压力室的另一端的位置以垂直地穿过下基板,其中多个限制器形成在下基板的上表面中,以及 多个压电致动器。

    Piezoelectric inkjet printhead and method of manufacturing the same
    6.
    发明申请
    Piezoelectric inkjet printhead and method of manufacturing the same 失效
    压电喷墨打印头及其制造方法

    公开(公告)号:US20060181580A1

    公开(公告)日:2006-08-17

    申请号:US11333540

    申请日:2006-01-18

    IPC分类号: B41J2/045

    摘要: A piezoelectric inkjet printhead including an upper substrate, having an ink inlet, a manifold connected with the ink inlet, and a plurality of pressure chambers arranged along at least one side of the manifold, wherein the ink inlet passes through the upper substrate, and the manifold and the pressure chambers are formed in a lower surface of the upper substrate, a lower substrate disposed directly adjacent the upper substrate, the lower substrate having a plurality of restrictors each connecting the manifold with one end of each of the pressure chambers, and a plurality of nozzles each being formed in a position of the lower substrate that corresponds to the other end of each of the pressure chambers to vertically pass through the lower substrate, wherein the plurality of restrictors are formed in an upper surface of the lower substrate, and a plurality of piezoelectric actuators.

    摘要翻译: 一种压电喷墨打印头,包括具有墨入口,与墨入口连接的歧管的上基板和沿着歧管的至少一侧布置的多个压力室,其中墨入口穿过上基板, 歧管和压力室形成在上基板的下表面中,下基板直接邻近上基板设置,下基板具有多个限制器,每个限制器将歧管与每个压力室的一端连接,并且 多个喷嘴各自形成在下基板的对应于每个压力室的另一端的位置以垂直地穿过下基板,其中多个限制器形成在下基板的上表面中,以及 多个压电致动器。

    Silicon wet etching method using parylene mask and method of manufacturing nozzle plate of inkjet printhead using the same
    7.
    发明申请
    Silicon wet etching method using parylene mask and method of manufacturing nozzle plate of inkjet printhead using the same 审中-公开
    使用聚对二苯乙烯掩模的硅湿式蚀刻方法和使用其制造喷墨打印头的喷嘴板的方法

    公开(公告)号:US20070134928A1

    公开(公告)日:2007-06-14

    申请号:US11505416

    申请日:2006-08-17

    IPC分类号: H01L21/302

    摘要: A silicon wet etching method to form at least two elements having different shapes in a silicon substrate using at least two wet etching processes includes forming a first etch mask made of parylene on a surface of the silicon substrate, forming a first element in the substrate by wet etching the silicon substrate for a first time using the first etch mask, forming a second etch mask made of a silicon oxide layer on the surface of the silicon substrate, and forming a second element by wet etching the silicon substrate for a second time using the second etch mask.

    摘要翻译: 使用至少两个湿蚀刻工艺在硅衬底中形成具有不同形状的至少两种元件的硅湿式蚀刻方法包括在硅衬底的表面上形成由聚对二甲苯制成的第一蚀刻掩模,在衬底中形成第一元件,通过 使用第一蚀刻掩模第一次湿蚀刻硅衬底,在硅衬底的表面上形成由氧化硅层制成的第二蚀刻掩模,并且通过湿法蚀刻硅衬底第二次来形成第二元件,第二次使用 第二蚀刻掩模。

    Silicon direct bonding method
    8.
    发明申请
    Silicon direct bonding method 有权
    硅直接键合法

    公开(公告)号:US20070155056A1

    公开(公告)日:2007-07-05

    申请号:US11505420

    申请日:2006-08-17

    IPC分类号: H01L21/00

    CPC分类号: H01L21/187 H01L21/2007

    摘要: A silicon direct bonding (SDB) method by which void formation caused by gases is suppressed. The SDB method includes: preparing two silicon substrates having corresponding bonding surfaces; forming trenches having a predetermined depth in at least one bonding surface of the two silicon substrates; forming gas discharge outlets connected to the trenches on at least one of the two silicon substrates to vertically penetrate the bonding surface; cleaning the two silicon substrates; closely contacting the two silicon substrates to each other; and thermally treating the two substrates to bond them to each other. The trenches are formed along at least a part of a plurality of dicing lines, and both ends of the trenches are clogged. Gases generated during a thermal treatment process can be smoothly and easily discharged through the trenches and the gas discharge outlet such that a void is prevented from being formed in the junctions of the two silicon substrates due to the gases.

    摘要翻译: 抑制由气体引起的空隙形成的硅直接接合(SDB)方法。 SDB方法包括:制备具有相应粘合表面的两个硅衬底; 在所述两个硅衬底的至少一个接合表面中形成具有预定深度的沟槽; 形成连接到所述两个硅衬底中的至少一个上的沟槽的气体放电出口,以垂直地穿透所述接合表面; 清洁两个硅衬底; 使两个硅衬底彼此紧密接触; 并对两个基板进行热处理以将它们彼此粘合。 沟槽沿着多个切割线的至少一部分形成,并且沟槽的两端被堵塞。 在热处理过程中产生的气体可以通过沟槽和气体排出口平滑且容易地排出,从而防止由于气体而在两个硅衬底的接合处形成空隙。

    Silicon direct bonding method
    9.
    发明授权
    Silicon direct bonding method 有权
    硅直接键合法

    公开(公告)号:US07442622B2

    公开(公告)日:2008-10-28

    申请号:US11505420

    申请日:2006-08-17

    IPC分类号: H01L21/30

    CPC分类号: H01L21/187 H01L21/2007

    摘要: A silicon direct bonding (SDB) method by which void formation caused by gases is suppressed. The SDB method includes: preparing two silicon substrates having corresponding bonding surfaces; forming trenches having a predetermined depth in at least one bonding surface of the two silicon substrates; forming gas discharge outlets connected to the trenches on at least one of the two silicon substrates to vertically penetrate the bonding surface; cleaning the two silicon substrates; closely contacting the two silicon substrates to each other; and thermally treating the two substrates to bond them to each other. The trenches are formed along at least a part of a plurality of dicing lines, and both ends of the trenches are clogged. Gases generated during a thermal treatment process can be smoothly and easily discharged through the trenches and the gas discharge outlet such that a void is prevented from being formed in the junctions of the two silicon substrates due to the gases.

    摘要翻译: 抑制由气体引起的空隙形成的硅直接接合(SDB)方法。 SDB方法包括:制备具有相应粘合表面的两个硅衬底; 在所述两个硅衬底的至少一个接合表面中形成具有预定深度的沟槽; 形成连接到所述两个硅衬底中的至少一个上的沟槽的气体放电出口,以垂直地穿透所述接合表面; 清洁两个硅衬底; 使两个硅衬底彼此紧密接触; 并对两个基板进行热处理以将它们彼此粘合。 沟槽沿着多个切割线的至少一部分形成,并且沟槽的两端被堵塞。 在热处理过程中产生的气体可以通过沟槽和气体排出口平滑且容易地排出,从而防止由于气体而在两个硅衬底的接合处形成空隙。

    Piezoelectric actuator inkjet head and method of forming the same
    10.
    发明申请
    Piezoelectric actuator inkjet head and method of forming the same 失效
    压电致动器喷墨头及其形成方法

    公开(公告)号:US20070195134A1

    公开(公告)日:2007-08-23

    申请号:US11581333

    申请日:2006-10-17

    IPC分类号: B41J2/045

    摘要: A piezoelectric actuator of an inkjet head and a method of forming the piezoelectric actuator. The piezoelectric actuator is formed on a vibration plate to provide a driving force to each of a plurality of pressure chambers. The piezoelectric actuator includes a lower electrode formed on the vibration plate, a piezoelectric layer formed on the lower electrode at a position corresponding to each of the pressure chambers, a supporting pad formed on the lower electrode, the supporting pad contacting one end of the piezoelectric layer and extending away from the one end of the piezoelectric layer, and an upper electrode extending from a top surface of the piezoelectric layer to a top surface of the supporting pad. The upper electrode is bonded to a driving circuit above the supporting pad to receive a voltage from the driving circuit. The piezoelectric layer may have substantially the same length as the pressure chamber. The supporting pad may be formed of a photosensitive polymer and may have substantially the same height as the piezoelectric layer. The upper electrode may include a first portion formed on the piezoelectric layer and a second portion formed on the supporting pad, and the second portion may be wider than the first portion.

    摘要翻译: 喷墨头的压电致动器和形成压电致动器的方法。 压电致动器形成在振动板上以向多个压力室中的每一个提供驱动力。 压电致动器包括形成在振动板上的下电极,形成在下电极上的与每个压力室对应的位置处的压电层,形成在下电极上的支撑焊盘,支撑焊盘接触压电体的一端 并且离开压电层的一端延伸,以及从压电层的顶表面延伸到支撑衬垫的顶表面的上电极。 上电极接合到支撑焊盘上方的驱动电路,以接收来自驱动电路的电压。 压电层可以具有与压力室大致相同的长度。 支撑垫可以由光敏聚合物形成,并且可以具有与压电层基本相同的高度。 上部电极可以包括形成在压电层上的第一部分和形成在支撑垫上的第二部分,并且第二部分可以比第一部分更宽。