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1.发明申请Method for Providing a Manufacturing Execution System (MES) Service to Third Parties 审中-公开向第三方提供制造执行系统（MES）服务的方法公开(公告)号：US20100070890A1
公开(公告)日：2010-03-18
申请号：US12209870
申请日：2008-09-12
申请人： Jakob Axt , Christian Becker , Hans-Juergen Eickelmann , Rainer Kaus Krause , Thorsten Muehge , Ralph Schoenhofer
发明人： Jakob Axt , Christian Becker , Hans-Juergen Eickelmann , Rainer Kaus Krause , Thorsten Muehge , Ralph Schoenhofer
IPC分类号： G06F3/048
摘要： A computer-implemented method for providing on-demand manufacturing execution systems for clients in which a response to a questionnaire from a client with information relative to identification of a business and production process, a determination of process steps, and an identification of process step requirements is evaluated by the service provider according to GUI requirements for each one of a number of individual process steps. Based on the evaluation, a GUI is defined for each of the individual process steps by the service provider and provided to the client for installation on client computing devices in a manufacturing line of the client. Data is collected for each of the individual process steps via each GUI and sent to the service provider for storage and evaluation.
摘要翻译： 一种计算机实现的方法，用于为客户提供按需制造执行系统，其中对来自客户的问卷的响应具有关于业务和生产过程的识别的信息，过程步骤的确定以及过程步骤要求的识别 由服务提供商根据GUI要求对多个单独处理步骤中的每一个进行评估。 基于评估，由服务提供商为每个单独的处理步骤定义GUI，并将其提供给客户机以在客户端的生产线中的客户端计算设备上安装。 通过每个GUI为每个单独的过程步骤收集数据，并发送到服务提供商进行存储和评估。
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公开(公告)号：US08631565B2
公开(公告)日：2014-01-21
申请号：US12203781
申请日：2008-09-03
申请人： Christian Becker , Hans-Juergen Eickelmann , Michael Haag , Rainer Klaus Krause , Thorsten Muehge , Markus Schmidt
发明人： Christian Becker , Hans-Juergen Eickelmann , Michael Haag , Rainer Klaus Krause , Thorsten Muehge , Markus Schmidt
IPC分类号： H05K3/30
CPC分类号： H01L31/0543 , H05K1/182 , Y02E10/52 , Y10T29/49108 , Y10T29/49117 , Y10T29/49126 , Y10T29/4913 , Y10T29/49133
摘要： A method for manufacturing a solar concentrator cell module assembly within an integrated circuit process, which solar concentrator cell module assembly includes at least one solar device and which solar device includes one printed circuit board and one Fresnel lens. A printed circuit board is assembled according to a pre-defined circuit board base design layout that allows pick and place of a single solar concentrator cell chip onto a circuit board base. Connections are provided for the solar concentrator cell chip in a serialized or a parallelized arrangement on the circuit board base, and a plurality of openings are formed in the circuit board base below a backside of the solar concentrator chip to enable attachment of cooling fingers. A solar device based on a solar device layout is assembled using the assembled circuit board base and one Fresnel lens, the solar device having a solar concentration ratio by modifying the solar device surface versus the solar cell surface and covering a full extension of the circuit board base, which circuit board base provides means for interconnecting a plurality of the solar devices to one another to form the solar concentrator cell module assembly.
摘要翻译： 一种用于在集成电路过程中制造太阳能集中器电池模块组件的方法，所述太阳能集中器电池模块组件包括至少一个太阳能装置，并且所述太阳能装置包括一个印刷电路板和一个菲涅尔透镜。 根据预定义的电路板基本设计布局组装印刷电路板，其允许将单个太阳能集中器电池芯片拾取和放置到电路板基座上。 在电路板基座上以串联或并联装置为太阳能集中器电池芯片提供连接，并且在太阳能集中器芯片的背面下方的电路板基座中形成多个开口，以使得能够连接冷却指。 基于太阳能装置布局的太阳能装置使用组装的电路板基座和一个菲涅尔透镜组装，太阳能装置通过改变太阳能装置表面相对于太阳能电池表面并覆盖电路板的完整延伸而具有太阳能集中比 基座，该电路板基座提供用于将多个太阳能装置彼此互连以形成太阳能集中器电池模块组件的装置。
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公开(公告)号：US20100050428A1
公开(公告)日：2010-03-04
申请号：US12203781
申请日：2008-09-03
申请人： Christian Becker , Hans-Juergen Eickelmann , Michael Haag , Rainer Klaus Krause , Thorsten Muehge , Markus Schmidt
发明人： Christian Becker , Hans-Juergen Eickelmann , Michael Haag , Rainer Klaus Krause , Thorsten Muehge , Markus Schmidt
IPC分类号： H01R43/00
CPC分类号： H01L31/0543 , H05K1/182 , Y02E10/52 , Y10T29/49108 , Y10T29/49117 , Y10T29/49126 , Y10T29/4913 , Y10T29/49133
摘要： A method for manufacturing a solar concentrator cell module assembly within an integrated circuit process, which solar concentrator cell module assembly includes at least one solar device and which solar device includes one printed circuit board and one Fresnel lens. A printed circuit board is assembled according to a pre-defined circuit board base design layout that allows pick and place of a single solar concentrator cell chip onto a circuit board base. Connections are provided for the solar concentrator cell chip in a serialized or a parallelized arrangement on the circuit board base, and a plurality of openings are formed in the circuit board base below a backside of the solar concentrator chip to enable attachment of cooling fingers. A solar device based on a solar device layout is assembled using the assembled circuit board base and one Fresnel lens, the solar device having a solar concentration ratio by modifying the solar device surface versus the solar cell surface and covering a full extension of the circuit board base, which circuit board base provides means for interconnecting a plurality of the solar devices to one another to form the solar concentrator cell module assembly.
摘要翻译： 一种用于在集成电路过程中制造太阳能集中器电池模块组件的方法，所述太阳能集中器电池模块组件包括至少一个太阳能装置，并且所述太阳能装置包括一个印刷电路板和一个菲涅尔透镜。 根据预定义的电路板基本设计布局组装印刷电路板，其允许将单个太阳能集中器电池芯片拾取和放置到电路板基座上。 在电路板基座上以串联或并联装置为太阳能集中器电池芯片提供连接，并且在太阳能集中器芯片的背面下方的电路板基座中形成多个开口，以使得能够连接冷却指。 基于太阳能装置布局的太阳能装置使用组装的电路板基座和一个菲涅尔透镜组装，太阳能装置通过改变太阳能装置表面相对于太阳能电池表面并覆盖电路板的完整延伸而具有太阳能集中比 基座，该电路板基座提供用于将多个太阳能装置彼此互连以形成太阳能集中器电池模块组件的装置。
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公开(公告)号：US20110100451A1
公开(公告)日：2011-05-05
申请号：US12866737
申请日：2009-01-13
IPC分类号： H01L31/0224 , H01L31/18
CPC分类号： H01L31/022433 , H01L31/0475 , H01L31/0508 , Y02E10/50
摘要： A silicon solar cell is manufactured by providing a carrier plate, and by applying a first contact pattern to the carrier plate. The first contact pattern includes a set of first laminar contacts. The silicon solar cell is further manufactured by applying a multitude of silicon slices to the first contact pattern, and by applying a second contact pattern to the multitude of silicon slices. Each first laminar contact of the set of first laminar contacts is in spatial laminar contact with maximally two silicon slices. The second contact pattern includes a set of second laminar contacts. Each second laminar contact of the set of second laminar contacts is in spatial laminar contact with maximally two silicon slices.
摘要翻译： 硅太阳能电池通过提供载体板并且通过向载体板施加第一接触图案来制造。 第一接触图案包括一组第一层状接触。 硅太阳能电池进一步通过将多个硅片施加到第一接触图案并且通过向多个硅片施加第二接触图案而制造。 该组第一层状接触件的每个第一层状接触件与最多两个硅片片层叠接触。 第二接触图案包括一组第二层状接触。 该组第二层状接触件的每个第二层状接触件与最多两个硅片片层叠接触。
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公开(公告)号：US20100132760A1
公开(公告)日：2010-06-03
申请号：US12594146
申请日：2008-04-08
申请人： Rainer Krause , Gerd Pfeiffer , Thorsten Muehge , Hans-Juergen Eickelmann , Michael Haag , Markus Schmidt
发明人： Rainer Krause , Gerd Pfeiffer , Thorsten Muehge , Hans-Juergen Eickelmann , Michael Haag , Markus Schmidt
IPC分类号： H01L31/042 , H01L31/18
CPC分类号： H01L31/022441 , H01L31/02008 , H01L31/022425 , H01L31/0504 , H01L31/0682 , H01L31/1804 , Y02E10/547 , Y02P70/521
摘要： A method of backside contacting of thin layer photovoltaic cells having Si elements as well as thin film cells, like CIGS, is provided, including the following steps: providing a p-n-junction including a thin n-doped Si layer and a thin p-doped Si layer bonded on top of said n-doped Si layer; bonding said p-n-junction to a glass substrate; preparing contact points on said structured thin p-doped Si layer and said thin n-doped Si layer; and creating contact pins on said structured thin p-doped Si layer and said thin n-doped Si layer.
摘要翻译： 提供了具有Si元素的薄层光伏电池以及诸如CIGS的薄膜电池的背面接触的方法，包括以下步骤：提供包括薄的n掺杂Si层和薄p掺杂的pn结 Si层结合在所述n掺杂Si层的顶部; 将所述p-n结键合到玻璃基板上; 在所述结构化的薄p掺杂Si层和所述薄n掺杂Si层上制备接触点; 以及在所述结构化的薄p掺杂Si层和所述薄n掺杂Si层上产生接触引脚。
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公开(公告)号：US08772079B2
公开(公告)日：2014-07-08
申请号：US12594146
申请日：2008-04-08
申请人： Rainer Krause , Gerd Pfeiffer , Thorsten Muehge , Hans-Juergen Eickelmann , Michael Haag , Markus Schmidt
发明人： Rainer Krause , Gerd Pfeiffer , Thorsten Muehge , Hans-Juergen Eickelmann , Michael Haag , Markus Schmidt
IPC分类号： H01L31/18 , H01L31/0224
CPC分类号： H01L31/022441 , H01L31/02008 , H01L31/022425 , H01L31/0504 , H01L31/0682 , H01L31/1804 , Y02E10/547 , Y02P70/521
摘要： A method of backside contacting of thin layer photovoltaic cells having Si elements as well as thin film cells, like CIGS, is provided, including the following steps: providing a p-n-junction including a thin n-doped Si layer and a thin p-doped Si layer bonded on top of said n-doped Si layer; bonding said p-n-junction to a glass substrate; preparing contact points on said structured thin p-doped Si layer and said thin n-doped Si layer; and creating contact pins on said structured thin p-doped Si layer and said thin n-doped Si layer.
摘要翻译： 提供了具有Si元素的薄层光伏电池以及诸如CIGS的薄膜电池的背面接触的方法，包括以下步骤：提供包括薄的n掺杂Si层和薄p掺杂的pn结 Si层结合在所述n掺杂Si层的顶部; 将所述p-n结键合到玻璃基板上; 在所述结构化的薄p掺杂Si层和所述薄n掺杂Si层上制备接触点; 以及在所述结构化的薄p掺杂Si层和所述薄n掺杂Si层上产生接触引脚。
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公开(公告)号：US08735212B2
公开(公告)日：2014-05-27
申请号：US12866737
申请日：2009-01-13
IPC分类号： H01L31/0224
CPC分类号： H01L31/022433 , H01L31/0475 , H01L31/0508 , Y02E10/50
摘要： A silicon solar cell is manufactured by providing a carrier plate, and by applying a first contact pattern to the carrier plate. The first contact pattern includes a set of first laminar contacts. The silicon solar cell is further manufactured by applying a multitude of silicon slices to the first contact pattern, and by applying a second contact pattern to the multitude of silicon slices. Each first laminar contact of the set of first laminar contacts is in spatial laminar contact with maximally two silicon slices. The second contact pattern includes a set of second laminar contacts. Each second laminar contact of the set of second laminar contacts is in spatial laminar contact with maximally two silicon slices.
摘要翻译： 硅太阳能电池通过提供载体板并且通过向载体板施加第一接触图案来制造。 第一接触图案包括一组第一层状接触。 硅太阳能电池进一步通过将多个硅片施加到第一接触图案并且通过向多个硅片施加第二接触图案而制造。 该组第一层状接触件的每个第一层状接触件与最多两个硅片片层叠接触。 第二接触图案包括一组第二层状接触。 该组第二层状接触件的每个第二层状接触件与最多两个硅片片层叠接触。
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公开(公告)号：US20100037936A1
公开(公告)日：2010-02-18
申请号：US12189960
申请日：2008-08-12
申请人： Christian Becker , Hans-Juergen Eickelmann , Michael Haag , Rainer Klaus Krause , Markus Schmidt
发明人： Christian Becker , Hans-Juergen Eickelmann , Michael Haag , Rainer Klaus Krause , Markus Schmidt
IPC分类号： H01L31/058
CPC分类号： H01L31/022433 , H01L31/02008 , H01L31/022425 , H01L31/0475 , H01L31/048 , H01L31/0508 , H05K1/18 , H05K1/181 , H05K2201/10121 , H05K2201/10325 , Y02E10/50 , Y02P70/611
摘要： Solar cell assemblies and method of making solar cell assemblies. The method, including: fabricating solar cell chips on solar cell wafers; dicing the solar cell wafers into individual solar cell chips; packaging the individual solar cell chips in molded plastic packages to form solar cell chip packages; and mounting on and electrically connecting one or more of the solar cell chip packages to a printed circuit board. The assemblies including a printed circuit board; one or more solar cell chip packages mounted on and electrically connected to the printed circuit board, each of said one or more solar chip packages comprising a solar cell chip and a lead frame encapsulated in a molded plastic body, top surfaces the solar cell chips exposed in top surfaces of the molded plastic bodies.
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9.发明申请公开(公告)号：US20100297802A1
公开(公告)日：2010-11-25
申请号：US12849207
申请日：2010-08-03
申请人： Christian Becker , Hans-Juergen Eickelmann , Michael Haag , Rainer Klaus Krause , Markus Schmidt
发明人： Christian Becker , Hans-Juergen Eickelmann , Michael Haag , Rainer Klaus Krause , Markus Schmidt
IPC分类号： H01L31/18
CPC分类号： H01L31/022433 , H01L31/02008 , H01L31/022425 , H01L31/0475 , H01L31/048 , H01L31/0508 , H05K1/18 , H05K1/181 , H05K2201/10121 , H05K2201/10325 , Y02E10/50 , Y02P70/611
摘要： Solar cell assemblies and method of making solar cell assemblies. The method, including: fabricating solar cell chips on solar cell wafers; dicing the solar cell wafers into individual solar cell chips; packaging the individual solar cell chips in molded plastic packages to form solar cell chip packages; and mounting on and electrically connecting one or more of the solar cell chip packages to a printed circuit board. The assemblies including a printed circuit board; one or more solar cell chip packages mounted on and electrically connected to the printed circuit board, each of said one or more solar chip packages comprising a solar cell chip and a lead frame encapsulated in a molded plastic body, top surfaces the solar cell chips exposed in top surfaces of the molded plastic bodies.
摘要翻译： 太阳能电池组件及制造太阳能电池组件的方法。 该方法包括：在太阳能电池晶片上制造太阳能电池芯片; 将太阳能电池晶片切割成单个太阳能电池芯片; 将各个太阳能电池芯片封装在模制塑料封装中以形成太阳能电池芯片封装; 并且将一个或多个太阳能电池芯片封装安装在电连接到印刷电路板上。 组件包括印刷电路板; 一个或多个安装在印刷电路板上并电连接到印刷电路板的太阳能电池芯片封装，所述一个或多个太阳能芯片封装中的每一个包括太阳能电池芯片和封装在模制塑料体中的引线框架， 在模制塑料体的顶面。
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公开(公告)号：US20130226652A1
公开(公告)日：2013-08-29
申请号：US13407627
申请日：2012-02-28
申请人： Ubaldo G. Bilello , Hans-Juergen Eickelmann , Ricardo L. Fabrize , Louis R. Ferretti, JR. , Udo Kleemann , Jeffrey W. Miles , Michael S. O'Leary , Sharmila S. Tilwalli , Karen N. Toger
发明人： Ubaldo G. Bilello , Hans-Juergen Eickelmann , Ricardo L. Fabrize , Louis R. Ferretti, JR. , Udo Kleemann , Jeffrey W. Miles , Michael S. O'Leary , Sharmila S. Tilwalli , Karen N. Toger
IPC分类号： G06Q10/06
CPC分类号： G06Q10/0635
摘要： Embodiments of the invention relate to identification of risks in a brand commodity supply chain. Risks are centrally assessed and a single holistic image of the risk assessment is provided. Specifically, risks are assessed vertically and horizontally across the supply chain, brand, and commodity. Risk identification techniques may be applied to the identified risks to reduce supply chain disruption and to enable continued manufacturing.
摘要翻译： 本发明的实施例涉及识别品牌商品供应链中的风险。 对风险进行集中评估，并提供风险评估的单一整体形象。 具体来说，跨供应链，品牌和商品横向评估风险。 可以将风险识别技术应用于已识别的风险，以减少供应链中断并实现持续制造。
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