公开(公告)号：US08631565B2

公开(公告)日：2014-01-21

申请号：US12203781

申请日：2008-09-03

申请人： Christian Becker ,  Hans-Juergen Eickelmann ,  Michael Haag ,  Rainer Klaus Krause ,  Thorsten Muehge ,  Markus Schmidt

发明人： Christian Becker ,  Hans-Juergen Eickelmann ,  Michael Haag ,  Rainer Klaus Krause ,  Thorsten Muehge ,  Markus Schmidt

IPC分类号： H05K3/30

CPC分类号： H01L31/0543 ,  H05K1/182 ,  Y02E10/52 ,  Y10T29/49108 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49133

摘要： A method for manufacturing a solar concentrator cell module assembly within an integrated circuit process, which solar concentrator cell module assembly includes at least one solar device and which solar device includes one printed circuit board and one Fresnel lens. A printed circuit board is assembled according to a pre-defined circuit board base design layout that allows pick and place of a single solar concentrator cell chip onto a circuit board base. Connections are provided for the solar concentrator cell chip in a serialized or a parallelized arrangement on the circuit board base, and a plurality of openings are formed in the circuit board base below a backside of the solar concentrator chip to enable attachment of cooling fingers. A solar device based on a solar device layout is assembled using the assembled circuit board base and one Fresnel lens, the solar device having a solar concentration ratio by modifying the solar device surface versus the solar cell surface and covering a full extension of the circuit board base, which circuit board base provides means for interconnecting a plurality of the solar devices to one another to form the solar concentrator cell module assembly.

摘要翻译： 一种用于在集成电路过程中制造太阳能集中器电池模块组件的方法，所述太阳能集中器电池模块组件包括至少一个太阳能装置，并且所述太阳能装置包括一个印刷电路板和一个菲涅尔透镜。 根据预定义的电路板基本设计布局组装印刷电路板，其允许将单个太阳能集中器电池芯片拾取和放置到电路板基座上。 在电路板基座上以串联或并联装置为太阳能集中器电池芯片提供连接，并且在太阳能集中器芯片的背面下方的电路板基座中形成多个开口，以使得能够连接冷却指。 基于太阳能装置布局的太阳能装置使用组装的电路板基座和一个菲涅尔透镜组装，太阳能装置通过改变太阳能装置表面相对于太阳能电池表面并覆盖电路板的完整延伸而具有太阳能集中比 基座，该电路板基座提供用于将多个太阳能装置彼此互连以形成太阳能集中器电池模块组件的装置。

公开(公告)号：US20100037936A1

公开(公告)日：2010-02-18

申请号：US12189960

申请日：2008-08-12

申请人： Christian Becker ,  Hans-Juergen Eickelmann ,  Michael Haag ,  Rainer Klaus Krause ,  Markus Schmidt

发明人： Christian Becker ,  Hans-Juergen Eickelmann ,  Michael Haag ,  Rainer Klaus Krause ,  Markus Schmidt

IPC分类号： H01L31/058

CPC分类号： H01L31/022433 ,  H01L31/02008 ,  H01L31/022425 ,  H01L31/0475 ,  H01L31/048 ,  H01L31/0508 ,  H05K1/18 ,  H05K1/181 ,  H05K2201/10121 ,  H05K2201/10325 ,  Y02E10/50 ,  Y02P70/611

摘要： Solar cell assemblies and method of making solar cell assemblies. The method, including: fabricating solar cell chips on solar cell wafers; dicing the solar cell wafers into individual solar cell chips; packaging the individual solar cell chips in molded plastic packages to form solar cell chip packages; and mounting on and electrically connecting one or more of the solar cell chip packages to a printed circuit board. The assemblies including a printed circuit board; one or more solar cell chip packages mounted on and electrically connected to the printed circuit board, each of said one or more solar chip packages comprising a solar cell chip and a lead frame encapsulated in a molded plastic body, top surfaces the solar cell chips exposed in top surfaces of the molded plastic bodies.

公开(公告)号：US20100297802A1

公开(公告)日：2010-11-25

申请号：US12849207

申请日：2010-08-03

申请人： Christian Becker ,  Hans-Juergen Eickelmann ,  Michael Haag ,  Rainer Klaus Krause ,  Markus Schmidt

发明人： Christian Becker ,  Hans-Juergen Eickelmann ,  Michael Haag ,  Rainer Klaus Krause ,  Markus Schmidt

IPC分类号： H01L31/18

CPC分类号： H01L31/022433 ,  H01L31/02008 ,  H01L31/022425 ,  H01L31/0475 ,  H01L31/048 ,  H01L31/0508 ,  H05K1/18 ,  H05K1/181 ,  H05K2201/10121 ,  H05K2201/10325 ,  Y02E10/50 ,  Y02P70/611

摘要： Solar cell assemblies and method of making solar cell assemblies. The method, including: fabricating solar cell chips on solar cell wafers; dicing the solar cell wafers into individual solar cell chips; packaging the individual solar cell chips in molded plastic packages to form solar cell chip packages; and mounting on and electrically connecting one or more of the solar cell chip packages to a printed circuit board. The assemblies including a printed circuit board; one or more solar cell chip packages mounted on and electrically connected to the printed circuit board, each of said one or more solar chip packages comprising a solar cell chip and a lead frame encapsulated in a molded plastic body, top surfaces the solar cell chips exposed in top surfaces of the molded plastic bodies.

摘要翻译： 太阳能电池组件及制造太阳能电池组件的方法。 该方法包括：在太阳能电池晶片上制造太阳能电池芯片; 将太阳能电池晶片切割成单个太阳能电池芯片; 将各个太阳能电池芯片封装在模制塑料封装中以形成太阳能电池芯片封装; 并且将一个或多个太阳能电池芯片封装安装在电连接到印刷电路板上。 组件包括印刷电路板; 一个或多个安装在印刷电路板上并电连接到印刷电路板的太阳能电池芯片封装，所述一个或多个太阳能芯片封装中的每一个包括太阳能电池芯片和封装在模制塑料体中的引线框架， 在模制塑料体的顶面。

公开(公告)号：US20100050428A1

公开(公告)日：2010-03-04

申请号：US12203781

申请日：2008-09-03

申请人： Christian Becker ,  Hans-Juergen Eickelmann ,  Michael Haag ,  Rainer Klaus Krause ,  Thorsten Muehge ,  Markus Schmidt

发明人： Christian Becker ,  Hans-Juergen Eickelmann ,  Michael Haag ,  Rainer Klaus Krause ,  Thorsten Muehge ,  Markus Schmidt

IPC分类号： H01R43/00

CPC分类号： H01L31/0543 ,  H05K1/182 ,  Y02E10/52 ,  Y10T29/49108 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49133

摘要： A method for manufacturing a solar concentrator cell module assembly within an integrated circuit process, which solar concentrator cell module assembly includes at least one solar device and which solar device includes one printed circuit board and one Fresnel lens. A printed circuit board is assembled according to a pre-defined circuit board base design layout that allows pick and place of a single solar concentrator cell chip onto a circuit board base. Connections are provided for the solar concentrator cell chip in a serialized or a parallelized arrangement on the circuit board base, and a plurality of openings are formed in the circuit board base below a backside of the solar concentrator chip to enable attachment of cooling fingers. A solar device based on a solar device layout is assembled using the assembled circuit board base and one Fresnel lens, the solar device having a solar concentration ratio by modifying the solar device surface versus the solar cell surface and covering a full extension of the circuit board base, which circuit board base provides means for interconnecting a plurality of the solar devices to one another to form the solar concentrator cell module assembly.

摘要翻译： 一种用于在集成电路过程中制造太阳能集中器电池模块组件的方法，所述太阳能集中器电池模块组件包括至少一个太阳能装置，并且所述太阳能装置包括一个印刷电路板和一个菲涅尔透镜。 根据预定义的电路板基本设计布局组装印刷电路板，其允许将单个太阳能集中器电池芯片拾取和放置到电路板基座上。 在电路板基座上以串联或并联装置为太阳能集中器电池芯片提供连接，并且在太阳能集中器芯片的背面下方的电路板基座中形成多个开口，以使得能够连接冷却指。 基于太阳能装置布局的太阳能装置使用组装的电路板基座和一个菲涅尔透镜组装，太阳能装置通过改变太阳能装置表面相对于太阳能电池表面并覆盖电路板的完整延伸而具有太阳能集中比 基座，该电路板基座提供用于将多个太阳能装置彼此互连以形成太阳能集中器电池模块组件的装置。

公开(公告)号：US20100304519A1

公开(公告)日：2010-12-02

申请号：US12849448

申请日：2010-08-03

申请人： Hans-Juergen Eickelmann ,  Michael Haag ,  Harold J. Hovel ,  Rainer Klaus Krause ,  Markus Schmidt ,  Xiaoyan Shao ,  Steven Erik Steen

发明人： Hans-Juergen Eickelmann ,  Michael Haag ,  Harold J. Hovel ,  Rainer Klaus Krause ,  Markus Schmidt ,  Xiaoyan Shao ,  Steven Erik Steen

IPC分类号： H01L31/18 ,  H01L21/027 ,  H01L21/283

CPC分类号： H01L31/068 ,  H01L31/02168 ,  H01L31/022425 ,  H01L31/022433 ,  H01L31/1804 ,  H01L31/1868 ,  Y02E10/547 ,  Y02P70/521

摘要： A method of fabricating solar cell chips. The method includes creating an integrated circuit chip process route for fabricating integrated circuit chips using integrated circuit wafers in an integrated circuit fabrication facility; creating a solar cell process route for fabricating solar cells using solar cell wafers in the integrated circuit fabrication facility; releasing integrated circuit chip wafers and solar cell wafers into tool queues of tools of the an integrated circuit fabrication facility; and processing the solar cell wafers on at least some tools of the integrated circuit fabrication facility used to process the integrated circuit wafers. Also the process used to fabricate the solar cell chips.

摘要翻译： 制造太阳能电池芯片的方法。 该方法包括在集成电路制造设备中创建用于使用集成电路晶片制造集成电路芯片的集成电路芯片工艺路线; 在集成电路制造设备中创建使用太阳能电池晶片制造太阳能电池的太阳能电池工艺路线; 将集成电路芯片晶片和太阳能电池晶片释放到集成电路制造设备的工具的工具队列中; 以及在用于处理集成电路晶片的集成电路制造设备的至少一些工具上处理太阳能电池晶片。 也是制造太阳能电池芯片的过程。

公开(公告)号：US07897434B2

公开(公告)日：2011-03-01

申请号：US12189911

申请日：2008-08-12

申请人： Hans-Juergen Eickelmann ,  Michael Haag ,  Harold J. Hovel ,  Rainer Klaus Krause ,  Markus Schmidt ,  Xiaoyan Shao ,  Steven Erik Steen

发明人： Hans-Juergen Eickelmann ,  Michael Haag ,  Harold J. Hovel ,  Rainer Klaus Krause ,  Markus Schmidt ,  Xiaoyan Shao ,  Steven Erik Steen

IPC分类号： H01L21/00

CPC分类号： H01L31/068 ,  H01L31/02168 ,  H01L31/022425 ,  H01L31/022433 ,  H01L31/1804 ,  H01L31/1868 ,  Y02E10/547 ,  Y02P70/521

摘要： A method of fabricating solar cell chips. The method includes creating an integrated circuit chip process route for fabricating integrated circuit chips using integrated circuit wafers in an integrated circuit fabrication facility; creating a solar cell process route for fabricating solar cells using solar cell wafers in the integrated circuit fabrication facility; releasing integrated circuit chip wafers and solar cell wafers into tool queues of tools of the an integrated circuit fabrication facility; and processing the solar cell wafers on at least some tools of the integrated circuit fabrication facility used to process the integrated circuit wafers. Also the process used to fabricate the solar cell chips.

摘要翻译： 制造太阳能电池芯片的方法。 该方法包括在集成电路制造设备中创建用于使用集成电路晶片制造集成电路芯片的集成电路芯片工艺路线; 在集成电路制造设备中创建使用太阳能电池晶片制造太阳能电池的太阳能电池工艺路线; 将集成电路芯片晶片和太阳能电池晶片释放到集成电路制造设备的工具的工具队列中; 以及在用于处理集成电路晶片的集成电路制造设备的至少一些工具上处理太阳能电池晶片。 也是制造太阳能电池芯片的过程。

公开(公告)号：US20100037939A1

公开(公告)日：2010-02-18

申请号：US12189911

申请日：2008-08-12

申请人： Hans-Juergen Eickelmann ,  Michael Haag ,  Harold J. Hovel ,  Rainer Klaus Krause ,  Markus Schmidt ,  Xiaoyan Shao ,  Steven Erik Steen

发明人： Hans-Juergen Eickelmann ,  Michael Haag ,  Harold J. Hovel ,  Rainer Klaus Krause ,  Markus Schmidt ,  Xiaoyan Shao ,  Steven Erik Steen

IPC分类号： H01L31/00

CPC分类号： H01L31/068 ,  H01L31/02168 ,  H01L31/022425 ,  H01L31/022433 ,  H01L31/1804 ,  H01L31/1868 ,  Y02E10/547 ,  Y02P70/521

摘要： A method of fabricating solar cell chips. The method includes creating an integrated circuit chip process route for fabricating integrated circuit chips using integrated circuit wafers in an integrated circuit fabrication facility; creating a solar cell process route for fabricating solar cells using solar cell wafers in the integrated circuit fabrication facility; releasing integrated circuit chip wafers and solar cell wafers into tool queues of tools of the an integrated circuit fabrication facility; and processing the solar cell wafers on at least some tools of the integrated circuit fabrication facility used to process the integrated circuit wafers. Also the process used to fabricate the solar cell chips.

摘要翻译： 制造太阳能电池芯片的方法。 该方法包括在集成电路制造设备中创建用于使用集成电路晶片制造集成电路芯片的集成电路芯片工艺路线; 在集成电路制造设备中创建使用太阳能电池晶片制造太阳能电池的太阳能电池工艺路线; 将集成电路芯片晶片和太阳能电池晶片释放到集成电路制造设备的工具的工具队列中; 以及在用于处理集成电路晶片的集成电路制造设备的至少一些工具上处理太阳能电池晶片。 也是制造太阳能电池芯片的过程。

公开(公告)号：US20100132760A1

公开(公告)日：2010-06-03

申请号：US12594146

申请日：2008-04-08

申请人： Rainer Krause ,  Gerd Pfeiffer ,  Thorsten Muehge ,  Hans-Juergen Eickelmann ,  Michael Haag ,  Markus Schmidt

发明人： Rainer Krause ,  Gerd Pfeiffer ,  Thorsten Muehge ,  Hans-Juergen Eickelmann ,  Michael Haag ,  Markus Schmidt

IPC分类号： H01L31/042 ,  H01L31/18

CPC分类号： H01L31/022441 ,  H01L31/02008 ,  H01L31/022425 ,  H01L31/0504 ,  H01L31/0682 ,  H01L31/1804 ,  Y02E10/547 ,  Y02P70/521

摘要： A method of backside contacting of thin layer photovoltaic cells having Si elements as well as thin film cells, like CIGS, is provided, including the following steps: providing a p-n-junction including a thin n-doped Si layer and a thin p-doped Si layer bonded on top of said n-doped Si layer; bonding said p-n-junction to a glass substrate; preparing contact points on said structured thin p-doped Si layer and said thin n-doped Si layer; and creating contact pins on said structured thin p-doped Si layer and said thin n-doped Si layer.

摘要翻译： 提供了具有Si元素的薄层光伏电池以及诸如CIGS的薄膜电池的背面接触的方法，包括以下步骤：提供包括薄的n掺杂Si层和薄p掺杂的pn结 Si层结合在所述n掺杂Si层的顶部; 将所述p-n结键合到玻璃基板上; 在所述结构化的薄p掺杂Si层和所述薄n掺杂Si层上制备接触点; 以及在所述结构化的薄p掺杂Si层和所述薄n掺杂Si层上产生接触引脚。

公开(公告)号：US20100279454A1

公开(公告)日：2010-11-04

申请号：US12432293

申请日：2009-04-29

申请人： Hans-Juergen Eickelmann ,  Michael Haag ,  Harold John Hovel ,  Rainer Krause ,  Markus Schmidt ,  Steven Erik Steen

发明人： Hans-Juergen Eickelmann ,  Michael Haag ,  Harold John Hovel ,  Rainer Krause ,  Markus Schmidt ,  Steven Erik Steen

IPC分类号： H01L31/0232

CPC分类号： H01L31/03529 ,  H01L31/022425 ,  H01L31/068 ,  H01L31/1804 ,  Y02E10/547

摘要： A method of manufacturing a solar cell. The method includes the steps of providing a substrate, applying a first dopant to a first surface, applying a second dopant to a second surface, covering the doped first surface with a hard mask, applying a third dopant to the substrate side, removing the hard mask, applying a pattern of first electrical contacts to the doping pattern, and applying a pattern of second electrical contacts to the doped second surface, the pattern of second electrical contacts and the doping pattern being straight-lined opposed.

摘要翻译： 一种制造太阳能电池的方法。 该方法包括以下步骤：提供衬底，向第一表面施加第一掺杂剂，向第二表面施加第二掺杂剂，用硬掩模覆盖掺杂的第一表面，向衬底侧施加第三掺杂剂，除去硬的 掩模，将第一电触点的图案施加到掺杂图案，以及将第二电触点的图案施加到所述掺杂的第二表面，所述第二电触点的图案和所述掺杂图案是直线对置的。

公开(公告)号：US08772079B2

公开(公告)日：2014-07-08

申请号：US12594146

申请日：2008-04-08

申请人： Rainer Krause ,  Gerd Pfeiffer ,  Thorsten Muehge ,  Hans-Juergen Eickelmann ,  Michael Haag ,  Markus Schmidt

发明人： Rainer Krause ,  Gerd Pfeiffer ,  Thorsten Muehge ,  Hans-Juergen Eickelmann ,  Michael Haag ,  Markus Schmidt

IPC分类号： H01L31/18 ,  H01L31/0224

CPC分类号： H01L31/022441 ,  H01L31/02008 ,  H01L31/022425 ,  H01L31/0504 ,  H01L31/0682 ,  H01L31/1804 ,  Y02E10/547 ,  Y02P70/521

摘要： A method of backside contacting of thin layer photovoltaic cells having Si elements as well as thin film cells, like CIGS, is provided, including the following steps: providing a p-n-junction including a thin n-doped Si layer and a thin p-doped Si layer bonded on top of said n-doped Si layer; bonding said p-n-junction to a glass substrate; preparing contact points on said structured thin p-doped Si layer and said thin n-doped Si layer; and creating contact pins on said structured thin p-doped Si layer and said thin n-doped Si layer.

摘要翻译： 提供了具有Si元素的薄层光伏电池以及诸如CIGS的薄膜电池的背面接触的方法，包括以下步骤：提供包括薄的n掺杂Si层和薄p掺杂的pn结 Si层结合在所述n掺杂Si层的顶部; 将所述p-n结键合到玻璃基板上; 在所述结构化的薄p掺杂Si层和所述薄n掺杂Si层上制备接触点; 以及在所述结构化的薄p掺杂Si层和所述薄n掺杂Si层上产生接触引脚。