Abstract:
A roll-on liquid applicator having an applicator ball disposed within a dispensing chamber and a spring element with a valve head portion. The spring element effects a distally-directed force to press the valve head against the valve opening to maintain a sealing closure of the valve opening against flow of the liquid from the feed chamber into the dispensing chamber. The valve head has a ball support structure which extends distally through the valve opening to contact with the applicator ball so that when the ball is inwardly displaced by force applied thereto, the valve head moves axially inward from the closed-valve position to the open-valve position, thereby moving the valve head from the closed-valve position in contact with the valve opening toward the open-valve position which allows liquid from the feed chamber to enter the dispensing chamber.
Abstract:
A suck-back valve selectively actuatable for dispensing liquid in its open condition from an associated liquid storage container, and for avoiding continued presence of excess dispensed liquid about the exit orifice in the closed condition of the valve, is formed at least in part of a spring member and a pin. The spring member includes a distal web that defines a valve seat and a dispensed liquid exit orifice, a proximal web, and a plurality of flexibly elastic bands helically connecting the distal and proximal webs. The pin includes an elongated shaft having a proximal end secured to the proximal web and carrying a substantially hollow frustoconical cone at its distal end. The cone has an outer valving surface for releasable abutment with the valve seat and the shaft has a bore of predetermined cross-sectional extent defined longitudinally along and within the shaft to create a continuous fluid passageway through and along the pin. Dispensed liquid remaining proximate the exit orifice is sucked back into the liquid container through the shaft bore as the valve returns from its open to its closed condition under the return urgency of the elastic bands.
Abstract:
Methods for fabricating a semiconductor memory cell that has a spacer layer are disclosed. A method includes forming a plurality of source/drain regions in a substrate where the plurality of source/drain regions are formed between trenches, forming a first oxide layer above the plurality of source/drain regions and in the trenches, forming a charge storage layer above the oxide layer and separating the charge storage layer in the trenches where a space is formed between separated portions of the charge storage layer. The method further includes forming a spacer layer to fill the space between the separated portions of the charge storage layer and to rise a predetermined distance above the space. A second oxide layer is formed above the charge storage layer and the spacer layer and a polysilicon layer is formed above the second oxide layer.
Abstract:
Methods for fabricating a semiconductor memory cell that has a spacer layer are disclosed. A method includes forming a plurality of source/drain regions in a substrate where the plurality of source/drain regions are formed between trenches, forming a first oxide layer above the plurality of source/drain regions and in the trenches, forming a charge storage layer above the oxide layer and separating the charge storage layer in the trenches where a space is formed between separated portions of the charge storage layer. The method further includes forming a spacer layer to fill the space between the separated portions of the charge storage layer and to rise a predetermined distance above the space. A second oxide layer is formed above the charge storage layer and the spacer layer and a polysilicon layer is formed above the second oxide layer.
Abstract:
A method of forming multiple conductive structures in a semiconductor device includes forming spacers adjacent side surfaces of a mask, where the mask and the spacers are formed on a conductive layer. The method also includes etching at least one trench in a portion of the conductive layer not covered by the spacers or the mask. The method may further include depositing a material over the semiconductor device, removing the mask and etching the conductive layer to remove portions of the conductive layer not covered by the spacers or the material, where remaining portions of the conductive layer form the conductive structures.