Heat-shielded low power PCM-based reprogrammable eFUSE device
    1.
    发明授权
    Heat-shielded low power PCM-based reprogrammable eFUSE device 失效
    基于热屏蔽的低功耗基于PCM的可编程eFUSE设备

    公开(公告)号:US07491965B2

    公开(公告)日:2009-02-17

    申请号:US12127994

    申请日:2008-05-28

    IPC分类号: H01L47/00

    摘要: An electrically re-programmable fuse (eFUSE) device for use in integrated circuit devices includes an elongated heater element, an electrically insulating liner surrounding an outer surface of the elongated heater element, corresponding to a longitudinal axis thereof, leaving opposing ends of the elongated heater element in electrical contact with first and second heater electrodes. A phase change material (PCM) surrounds a portion of an outer surface of the electrically insulating liner, a thermally and electrically insulating layer surrounds an outer surface of the PCM, with first and second fuse electrodes in electrical contact with opposing ends of the PCM. The PCM is encapsulated within the electrically insulating liner, the thermally and electrically insulating layer, and the first and second fuse electrodes.

    摘要翻译: 用于集成电路器件的电可重新编程保险丝(eFUSE)器件包括细长的加热器元件,围绕细长加热器元件的外表面的电绝缘衬垫,其对应于其纵向轴线,留下细长加热器的相对端 元件与第一和第二加热器电极电接触。 相变材料(PCM)围绕电绝缘衬垫的外表面的一部分,热和电绝缘层围绕PCM的外表面,其中第一和第二熔丝电极与PCM的相对端电接触。 PCM被封装在电绝缘衬垫,热和电绝缘层以及第一和第二熔丝电极中。

    Heat-shielded low power PCM-based reprogrammable EFUSE device
    3.
    发明授权
    Heat-shielded low power PCM-based reprogrammable EFUSE device 有权
    隔热低功耗基于PCM的可编程EFUSE设备

    公开(公告)号:US07394089B2

    公开(公告)日:2008-07-01

    申请号:US11467294

    申请日:2006-08-25

    IPC分类号: H01L47/00

    摘要: An electrically re-programmable fuse (eFUSE) device for use in integrated circuit devices includes an elongated heater element, an electrically insulating liner surrounding an outer surface of the elongated heater element, corresponding to a longitudinal axis thereof, leaving opposing ends of the elongated heater element in electrical contact with first and second heater electrodes. A phase change material (PCM) surrounds a portion of an outer surface of the electrically insulating liner, a thermally and electrically insulating layer surrounds an outer surface of the PCM, with first and second fuse electrodes in electrical contact with opposing ends of the PCM. The PCM is encapsulated within the electrically insulating liner, the thermally and electrically insulating layer, and the first and second fuse electrodes.

    摘要翻译: 用于集成电路器件的电可重新编程保险丝(eFUSE)器件包括细长的加热器元件,围绕细长加热器元件的外表面的电绝缘衬垫,其对应于其纵向轴线,留下细长加热器的相对端 元件与第一和第二加热器电极电接触。 相变材料(PCM)围绕电绝缘衬垫的外表面的一部分,热和电绝缘层围绕PCM的外表面,其中第一和第二熔丝电极与PCM的相对端电接触。 PCM被封装在电绝缘衬垫,热和电绝缘层以及第一和第二熔丝电极中。

    Mechanically robust metal/low-κ interconnects
    9.
    发明授权
    Mechanically robust metal/low-κ interconnects 有权
    机械坚固的金属/低压 互连

    公开(公告)号:US08017522B2

    公开(公告)日:2011-09-13

    申请号:US11626550

    申请日:2007-01-24

    IPC分类号: H01L21/44 H01L21/311

    摘要: A mechanically robust semiconductor structure with improved adhesion strength between a low-k dielectric layer and a dielectric-containing substrate is provided. In particular, the present invention provides a structure that includes a dielectric-containing substrate having an upper region including a treated surface layer which is chemically and physically different from the substrate; and a low-k dielectric material located on a the treated surface layer of the substrate. The treated surface layer and the low-k dielectric material form an interface that has an adhesion strength that is greater than 60% of the cohesive strength of the weaker material on either side of the interface. The treated surface is formed by treating the surface of the substrate with at least one of actinic radiation, a plasma and e-beam radiation prior to forming of the substrate the low-k dielectric material.

    摘要翻译: 提供了具有改善的低k电介质层和含电介质衬底之间的粘附强度的机械稳固的半导体结构。 特别地,本发明提供了一种结构,其包括含电介质的衬底,其具有包括化学和物理上不同于衬底的经处理的表面层的上部区域; 以及位于所述基板的经处理的表面层上的低k电介质材料。 经处理的表面层和低k电介质材料形成界面,该界面的粘合强度大于界面两侧的较弱材料的内聚强度的60%。 经处理的表面通过在形成低k电介质材料之前用光化辐射,等离子体和电子束辐射中的至少一种来处理衬底的表面而形成。