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1.发明授权Electronic package assembly with protective encapsulant material on opposing sides not having conductive leads 失效具有保护性密封剂材料的电子封装组件，不具有导电引线
公开(公告)号：US5469333A
公开(公告)日：1995-11-21
申请号：US252488
申请日：1994-06-01
CPC分类号： H05K3/284 , H05K3/3421 , H01L2924/0002 , H05K2201/10689 , H05K2201/10977 , Y02P70/613 , Y10T29/49144 , Y10T29/49146
摘要： An electronic package assembly wherein a low profile package is soldered to an organic (e.g., epoxy resin) substrate (e.g., printed circuit board). The assembly's projecting conductive leads are soldered. An encapsulant material (e.g., polymer resin) is used to provide reinforcement for the solder-lead connections, the encapsulant material being dispensed only along opposing sides of the package's housing which do not include projecting leads (and which are oriented substantially normal to the stresses imposed on the package during operation wherein high temperatures are attained). This dispensing may follow solder reflow and solidification. The invention is particularly useful with thin, small outline package (TSOP) structures which occupy a minimum of height on the substrate surface.
摘要翻译： 一种电子封装组件，其中将低外形封装焊接到有机（例如环氧树脂）衬底（例如印刷电路板）上。 组件的突出导电引线被焊接。 密封剂材料（例如聚合物树脂）用于为焊料 - 引线连接提供增强，所述密封剂材料仅沿着封装壳体的相对侧分配，其不包括突出引线（并且基本上垂直于应力 在实现高温的操作期间施加在包装上）。 该分配可以遵循焊料回流和固化。 本发明对于在衬底表面上占据最小高度的薄的小外形封装（TSOP）结构特别有用。
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2.发明授权Removable interlockable first and second connectors having engaging flexible members and process of making same 失效可拆卸互锁的第一和第二连接器具有接合的柔性构件及其制造方法公开(公告)号：US06179625B2
公开(公告)日：2001-01-30
申请号：US09275756
申请日：1999-03-25
IPC分类号： H05K100
CPC分类号： H01R12/52 , H05K3/325 , Y10T29/49126 , Y10T29/49165 , Y10T29/49453
摘要： A removably interlockable connector assembly and process for making the assembly that include a first connector having a head on a mesa and a second connector having an opening that receives the head on the first connector. The head on the first connector and the material defining the opening in the second connector are flexible and sized, so that the head on the first connector and the material defining the opening in the second connector flex as the head on the first connector is inserted into the opening in the second connector.
摘要翻译： 一种用于制造所述组件的可拆卸地互锁的连接器组件和过程，所述组件包括具有台面上的头部的第一连接器和具有在所述第一连接器上接收所述头部的开口的第二连接器。 第一连接器上的头部和限定第二连接器中的开口的材料是柔性和尺寸的，使得当第一连接器上的头部被插入时，第一连接器上的头部和限定第二连接器中的开口的材料弯曲 第二个连接器的开口。
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公开(公告)号：US06332267B1
公开(公告)日：2001-12-25
申请号：US09693395
申请日：2000-10-20
IPC分类号： H05K336
CPC分类号： H01R12/52 , H05K3/325 , Y10T29/49126 , Y10T29/49165 , Y10T29/49453
摘要： A process for making a removably interlockable connector assembly that includes a first connector having a head on a mesa and a second connector having an opening that receives the head on the first connector. The head on the mesa of the first connector and the material defining the opening in the second connector are flexible and sized, so that the head on the mesa of the first connector and the material defining the opening in the second connector flex as the head on the mesa of the first connector is inserted into the opening in the second connector. The head on the mesa of the first connector is formed by selectively etching portions of a first pad layer through openings in an etch resistant layer.
摘要翻译： 一种用于制造可拆卸地互锁的连接器组件的方法，其包括具有台面上的头部的第一连接器和具有在第一连接器上接纳头部的开口的第二连接器。 第一连接器的台面上的头部和限定第二连接器中的开口的材料是柔性的和尺寸的，使得第一连接器的台面上的头部和限定第二连接器中的开口的材料作为头部弯曲 第一连接器的台面插入第二连接器的开口中。 通过在耐蚀刻层中的开口选择性地蚀刻第一焊盘层的部分来形成第一连接器的台面上的头部。
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