STI pull-down to control SiGe facet growth
    2.
    发明授权
    STI pull-down to control SiGe facet growth 失效
    STI下拉以控制SiGe面增长

    公开(公告)号:US06936509B2

    公开(公告)日:2005-08-30

    申请号:US10665713

    申请日:2003-09-19

    CPC分类号: H01L29/66242 H01L29/7378

    摘要: A SiGe bipolar transistor including a semiconductor substrate having a collector and sub-collector region formed therein, wherein the collector and sub-collector are formed between isolation regions that are also present in the substrate is provided. Each isolation region includes a recessed surface and a non-recessed surface which are formed utilizing lithography and etching. A SiGe layer is formed on the substrate as well as the recessed non-recessed surfaces of each isolation region, the SiGe layer includes polycrystalline Si regions and a SiGe base region. A patterned insulator layer is formed on the SiGe base region; and an emitter is formed on the patterned insulator layer and in contact with the SiGe base region through an emitter window opening.

    摘要翻译: 提供一种SiGe双极晶体管,其包括其中形成有集电极和副集电极区的半导体衬底,其中集电极和副集电极形成在也存在于衬底中的隔离区之间。 每个隔离区域包括使用光刻和蚀刻形成的凹陷表面和非凹陷表面。 在衬底上形成SiGe层以及每个隔离区的凹入的非凹入表面,SiGe层包括多晶Si区和SiGe基区。 在SiGe基极区上形成图案化的绝缘体层; 并且在图案化的绝缘体层上形成发射极,并通过发射器窗口与SiGe基极区域接触。