Electrical circuit for printhead assembly
    4.
    发明授权
    Electrical circuit for printhead assembly 有权
    打印头组装电路

    公开(公告)号:US06843552B2

    公开(公告)日:2005-01-18

    申请号:US10429617

    申请日:2003-05-05

    摘要: A printhead assembly includes a carrier having a first side and a second side contiguous with the first side, a plurality of printhead dies each mounted on the first side of the carrier, an electrical circuit including a first portion disposed on the first side of the carrier and a second portion disposed on the second side of the carrier, and a plurality of electrical connectors each electrically coupled to the first portion of the electrical circuit and one of the printhead dies. The electrical circuit has a plurality of openings defined in the first portion thereof such that each of the openings are sized to accommodate one of the printhead dies, and has a first side facing the carrier and a second side opposite the first side thereof such that each of the electrical connectors are electrically coupled to the second side of the electrical circuit and one of the printhead dies.

    摘要翻译: 打印头组件包括具有与第一侧邻接的第一侧和第二侧的载体,每个安装在载体的第一侧上的多个打印头模具,电路包括设置在载体的第一侧上的第一部分 以及设置在所述载体的第二侧上的第二部分,以及多个电连接器,每个电连接器电耦合到所述电路的所述第一部分和所述打印头芯之一。 电路具有限定在其第一部分中的多个开口,使得每个开口的尺寸适于容纳一个打印头模具,并且具有面向托架的第一侧和与其第一侧相对的第二侧,使得每个 的电连接器电耦合到电路的第二侧和打印头之一中。

    Joining of different materials of carrier for fluid ejection devices
    5.
    发明授权
    Joining of different materials of carrier for fluid ejection devices 失效
    连接不同材料的载体用于流体喷射装置

    公开(公告)号:US06575559B2

    公开(公告)日:2003-06-10

    申请号:US09999531

    申请日:2001-10-31

    IPC分类号: B41J215

    摘要: A carrier for a plurality of fluid ejection devices includes a substrate and a substructure. The substrate includes a first material and has a first side adapted to receive the fluid ejection devices and a second side opposite the first side, and the substructure is formed of a second material and joined to the second side of the substrate with a lap joint. The lap joint includes a first portion formed by a portion of one of the substrate and the substructure, a second portion formed by a portion of the other of the substrate and the substructure, and a third material interposed between the first portion and the second portion.

    摘要翻译: 用于多个流体喷射装置的载体包括基底和子结构。 衬底包括第一材料并且具有适于容纳流体喷射装置的第一侧和与第一侧相对的第二侧,并且底部结构由第二材料形成并且用搭接接头连接到衬底的第二侧。 搭接接头包括由基板和子结构中的一个的一部分形成的第一部分,由基板和子结构中的另一个的一部分形成的第二部分,以及插入在第一部分和第二部分之间的第三材料 。