公开(公告)号：US06543880B1

公开(公告)日：2003-04-08

申请号：US09648567

申请日：2000-08-25

申请人： Mohammad Akhavain ,  Robert-Scott Melendrino Lopez ,  Brian J. Keefe ,  Janis Horvath ,  Joseph E. Scheffelin ,  David K. Mc Elfresh

发明人： Mohammad Akhavain ,  Robert-Scott Melendrino Lopez ,  Brian J. Keefe ,  Janis Horvath ,  Joseph E. Scheffelin ,  David K. Mc Elfresh

IPC分类号： B41J2155

CPC分类号： B41J2/1632 ,  B41J2/14024 ,  B41J2/14072 ,  B41J2/155 ,  B41J2/1603 ,  B41J2202/18 ,  B41J2202/20 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48465 ,  H01L2224/8592 ,  H01L2924/15184 ,  H01L2924/00014 ,  H01L2924/00

摘要： A method of forming an inkjet printhead assembly includes providing a substrate, disposing a planarization layer on a face of the substrate such that a first surface of the planarization layer contacts the face of the substrate, mechanically planarizing a second surface of the planarization layer opposite the first surface, including reducing a thickness of at least a portion of the first planarization layer, and mounting a plurality of printhead dies on the second surface of the planarization layer.

摘要翻译： 形成喷墨打印头组件的方法包括提供基板，在基板的表面上设置平坦化层，使得平坦化层的第一表面接触基板的表面，将平坦化层的与第一表面相对的第二表面机械平坦化 第一表面，包括减小第一平坦化层的至少一部分的厚度，以及将多个打印头管芯安装在平坦化层的第二表面上。

公开(公告)号：US06409307B1

公开(公告)日：2002-06-25

申请号：US09783676

申请日：2001-02-14

申请人： Mohammad Akhavain ,  Robert-Scott Melendrino Lopez ,  Dale Dean Timm, Jr. ,  Janis Horvath ,  Noah Carl Lassar ,  David McElfresh ,  Brian J. Keefe ,  Joseph E. Scheffelin

发明人： Mohammad Akhavain ,  Robert-Scott Melendrino Lopez ,  Dale Dean Timm, Jr. ,  Janis Horvath ,  Noah Carl Lassar ,  David McElfresh ,  Brian J. Keefe ,  Joseph E. Scheffelin

IPC分类号： B41J2155

CPC分类号： B41J2/14024 ,  B41J2/155 ,  B41J2202/19 ,  B41J2202/20

摘要： An inkjet printhead assembly includes a substrate having a non-planar surface and a plurality of adhesive quantities each disposed on the non-planar surface of the substrate. As such, a plurality of printhead dies are each adhered to the non-planar surface of the substrate by one of the adhesive quantities. A thickness of at least one of the adhesive quantities varies from the thickness of another of the adhesive quantities such that the thickness of the adhesive quantities compensates for the non-planar surface of the substrate. Thus, the adhesive quantities support the printhead dies and establish a substantially coplanar relationship among the printhead dies.

摘要翻译： 喷墨打印头组件包括具有非平面表面和多个粘合剂量的基底，每个粘合剂量均设置在基底的非平面表面上。 这样，通过粘合剂量之一将多个打印头模具各自粘附到基板的非平面表面。 粘合剂量中的至少一个的厚度与另一个粘合剂量的厚度不同，使得粘合剂量的厚度补偿了基材的非平面表面。 因此，粘合剂量支撑打印头芯片并且在打印头芯片之间建立基本上共面的关系。

公开(公告)号：US06476346B2

公开(公告)日：2002-11-05

申请号：US09862686

申请日：2001-05-21

申请人： Mohammad Akhavain ,  Say-Teng Lai ,  Robert-Scott Melendrino Lopez

发明人： Mohammad Akhavain ,  Say-Teng Lai ,  Robert-Scott Melendrino Lopez

IPC分类号： B23K2600

CPC分类号： B23K26/22 ,  B23K2101/42 ,  B23K2103/12 ,  B23K2103/14 ,  B23K2103/18 ,  B41J2/1603 ,  B41J2/1623 ,  B41J2/1626 ,  B41J2/1631 ,  B41J2/1634 ,  B41J2/1643 ,  B41J2/1646 ,  H01L24/80 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01057 ,  H01L2924/0106 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01R43/02 ,  H01R43/0221 ,  H05K3/328 ,  H05K2201/0108 ,  H05K2201/0112 ,  H05K2201/10681 ,  H05K2203/107 ,  H01L2924/00

摘要： The disclosure describes a method for predicting and avoiding bad bonds or connections when performing electrical connection of two electrical conductors by using a laser light beam attached to an optical fiber system which directs the light to the spot to be bonded. The method provides for rapid detection of damaged optical fibers before bad bonds or connections occur. Disclosed is a method for predicting and avoiding bad bonds or connections when performing solderless electrical connection of two contact elements by using a laser light beam attached to a optical fiber system which directs the light to the spot to be bonded.

摘要翻译： 本公开描述了一种用于通过使用连接到将光引导到待粘合点的光纤系统的激光束来执行电连接两个电导体时预测和避免不良键或连接的方法。 该方法提供在发生坏的连接或连接之前快速检测损坏的光纤。 公开了一种用于通过使用附接到将光导向待结合点的光纤系统的激光束来执行两个接触元件的无焊接电连接来预测和避免不良键合或连接的方法。

公开(公告)号：US06236015B1

公开(公告)日：2001-05-22

申请号：US09183957

申请日：1998-10-31

申请人： Mohammad Akhavain ,  Say-Teng Lai ,  Robert-Scott Melendrino Lopez

发明人： Mohammad Akhavain ,  Say-Teng Lai ,  Robert-Scott Melendrino Lopez

IPC分类号： B23K2600

CPC分类号： B23K26/22 ,  B23K2101/42 ,  B23K2103/12 ,  B23K2103/14 ,  B23K2103/18 ,  B41J2/1603 ,  B41J2/1623 ,  B41J2/1626 ,  B41J2/1631 ,  B41J2/1634 ,  B41J2/1643 ,  B41J2/1646 ,  H01L24/80 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01057 ,  H01L2924/0106 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01R43/02 ,  H01R43/0221 ,  H05K3/328 ,  H05K2201/0108 ,  H05K2201/0112 ,  H05K2201/10681 ,  H05K2203/107 ,  H01L2924/00

摘要： The disclosure describes a method for predicting and avoiding bad bonds or connections when performing electrical connection of two electrical conductors by using a laser light beam attached to an optical fiber system which directs the light to the spot to be bonded. The method provides for rapid detection of damaged optical fibers before bad bonds or connections occur. Disclosed is a method for predicting and avoiding bad bonds or connections when performing solderless electrical connection of two contact elements by using a laser light beam attached to a optical fiber system which directs the light to the spot to be bonded. The method of the present invention performs optical fiber push laser bonding operations on electric conductor leads includes providing an optical fiber push laser bonding system having an optical fiber for directing a laser beam, positioning first and second electrical leads in a bonding position, holding the first and second electrical leads in contact at a bond surface with an optical fiber, bonding the first and second electrical leads at the bond surface by directing the laser beam through the optical fiber, repeating said positioning, holding and bonding steps for a plurality of bonds, interrupting the aforesaid laser bonding operations in order to examine the condition of the fiber; wherein the following procedures occur during said interrupting directing the laser beam through the optical fiber, capturing the spatial energy distribution of the laser beam exiting the optical fiber and analyzing the spatial energy distribution of the laser beam to determine condition of the optical fiber in order to determine the need for corrective action.

摘要翻译： 本公开描述了一种用于通过使用连接到将光引导到待粘合点的光纤系统的激光束来执行电连接两个电导体时预测和避免不良键或连接的方法。 该方法提供在发生坏的连接或连接之前快速检测损坏的光纤。 公开了一种用于通过使用附接到将光导向待结合点的光纤系统的激光束来执行两个接触元件的无焊接电连接来预测和避免不良键合或连接的方法。 本发明的方法对导电引线进行光纤激光激光焊接操作包括提供具有用于引导激光束的光纤的光纤推动激光焊接系统，将第一和第二电引线定位在接合位置，保持第一 以及在与光纤的接合表面处接触的第二电引线，通过将激光束引导通过光纤，将第一和第二电引线接合在接合表面，重复多个键的定位，保持和结合步骤， 中断上述激光焊接操作以检查纤维的状况; 其中在所述中断期间发生以下过​​程：激光束通过光纤，捕获离开光纤的激光束的空间能量分布，并分析激光束的空间能量分布，以确定光纤的状态，以便 确定需要采取纠正措施。