-
公开(公告)号：US06878874B2
公开(公告)日：2005-04-12
申请号：US10166517
申请日：2002-06-10
申请人： Jay Kevin Osborn , Frazer Ely
发明人： Jay Kevin Osborn , Frazer Ely
CPC分类号： H05K7/20736 , H05K7/2019
摘要： A chassis for an electronic system. The chassis includes a recess therein for housing a plurality of cooling fans that are arranged in series and can be removed from the recess by sliding out of the recess in a direction across the direction of intended airflow. The assembly is arranged such that any of the fans can be removed and replaced without interrupting operation of the or any other fan. The recess and/or the fans have a seal to prevent or reduce bypass leakage of air around the fans.
摘要翻译： 电子系统的底盘。 底盘包括一个凹槽，用于容纳多个串联布置的冷却风扇，并且可以通过沿着预期气流的方向滑出凹部而从凹部移除。 组件布置成使得任何风扇可以被移除和更换而不中断其它风扇的操作。 凹槽和/或风扇具有密封件，以防止或减少风扇旁边的空气旁路泄漏。
-
公开(公告)号：US06961248B2
公开(公告)日：2005-11-01
申请号：US10166508
申请日：2002-06-10
CPC分类号： H05K7/20172 , H05K7/20736
摘要： A chassis for an electronics assembly comprises: (i) a frame (1); and (ii) a panel (31) located on a face of the frame, the panel comprising a plurality of cooling fans (22) and a holder (30) for the fans. The panel allows removal of individual fans from the panel and replacement of any fans while the panel is located on the frame, and the frame allows removal of the panel therefrom and replacement of the panel. The chassis thus allows replacement of any fans without the assembly being shut down, and also reduces downtime of the assembly if all the fans need replacing, for example for maintenance.
摘要翻译： 一种用于电子组件的底盘包括：（i）框架（1）; 和（ii）位于所述框架的表面上的面板（31），所述面板包括用于所述风扇的多个冷却风扇（22）和保持器（30）。 面板允许从面板上拆下单独的风扇，并在面板位于框架上时更换任何风扇，并且框架允许从其拆卸面板和更换面板。 因此，机架可以更换任何风扇，而不会关闭组件，并且如果所有风扇都需要更换（例如维护），也可以减少组装的停机时间。
-
公开(公告)号：US07894613B1
公开(公告)日：2011-02-22
申请号：US11432754
申请日：2006-05-10
IPC分类号： G10K11/16
CPC分类号： G10K11/178 , G10K2210/109 , G10K2210/11
摘要： Provided is an apparatus and method to control fan noise in a computer server room. An exemplary apparatus includes one or more transducers coupled to one or more walls of a plurality of system racks and one or more active noise control units, wherein the one or more active noise control units send control signals to the one or more transducers to emit a transducer acoustic wave. It also includes a microphone installed near a location in the computer server room where cooling fan noise needs to be controlled, wherein the microphone collects fan noise signals emitted from running fans on the plurality of system racks in the computer server room and sends the collected fan noise signals to the one or more active noise control units to allow the frequency and intensity of the transducer acoustic wave to be substantially equal to a frequency and an intensity of the fan noise and at about 180 degrees out of phase with the fan noise to reduce or to eliminate the fan noise.
摘要翻译： 提供了一种在计算机服务器室中控制风扇噪声的装置和方法。 示例性装置包括耦合到多个系统机架的一个或多个壁以及一个或多个有源噪声控制单元的一个或多个换能器，其中一个或多个有源噪声控制单元向一个或多个换能器发送控制信号以发射 换能器声波。 它还包括安装在计算机服务器室内靠近冷却风扇噪声需要控制的位置的麦克风，其中麦克风收集从计算机服务器室中的多个系统机架上的运行风扇发出的风扇噪声信号，并发送收集的风扇 噪声信号发送到一个或多个有源噪声控制单元，以允许换能器声波的频率和强度基本上等于风扇噪声的频率和强度，并且与风扇噪声约180度异相以减少 或消除风扇噪音。
-
公开(公告)号：US06680850B2
公开(公告)日：2004-01-20
申请号：US10166512
申请日：2002-06-10
IPC分类号： H05K700
CPC分类号： H05K7/1409
摘要： An electronics assembly comprises a frame (1) that contains a motherboard (8) and a plurality of daughterboards (10). The frame has an opening opposite the motherboard to allow insertion of the daughterboards into the frame or removal of the daughterboards from the frame. The frame also has an injector/ejector mechanism (16, 18) for each daughterboard that is located on the daughterboard or the frame and a flange (28) that extends adjacent to the opening and on which the injector/ejector mechanism of each daughterboard is attached or engages at different locations along the length thereof. The flange (28) is divided into separate sections (30) that correspond to the different locations to allow the flange to flex at any adjacent location during insertion of a daughterboard without the flexing affecting the position of any adjacent location of the flange with respect to the motherboard.
摘要翻译： 电子组件包括一个包含主板（8）和多个子板（10）的框架（1）。 框架具有与母板相对的开口，以允许将子板插入框架或从框架移除子板。 框架还具有用于位于子板或框架上的每个子板的喷射器/喷射器机构（16,18）和邻近开口延伸的凸缘（28），每个子板的喷射器/喷射器机构 沿其长度附接或接合在不同位置。 凸缘（28）被分成对应于不同位置的分开的部分（30），以允许凸缘在插入子板期间在任何相邻位置处弯曲，而不会影响凸缘的任何相邻位置相对于 主板。
-
公开(公告)号：US20120092285A1
公开(公告)日：2012-04-19
申请号：US12906025
申请日：2010-10-15
IPC分类号： G06F3/045
CPC分类号： G06F3/044
摘要： Touch pad structures are provided that gather touch sensor data. The data may be used to control a computer or other electronic device. The touch pad structures may be integrated into a computer or other computing equipment or may be provided as a stand-alone accessory. The touch pad structures may include a touch sensor array. The touch sensor array may include rows and columns of touch sensor electrodes, interconnect lines, and other conductive structures. The conductive structures on the touch sensor array may be formed from patterned layers of ink. Interconnect line segments in different layer of ink may be connected in rectangular contact regions. The touch sensor array may have a tail. A layer of insulator may be removed from the substrate across a tip portion of the tail to allow the line segments to be connected.
摘要翻译： 提供了触摸板结构，可以收集触摸传感器数据。 数据可以用于控制计算机或其他电子设备。 触摸板结构可以集成到计算机或其他计算设备中，或者可以作为独立附件提供。 触摸板结构可以包括触摸传感器阵列。 触摸传感器阵列可以包括行和列的触摸传感器电极，互连线和其它导电结构。 触摸传感器阵列上的导电结构可以由图案化的油墨层形成。 不同层墨水中的互连线段可以连接在矩形接触区域中。 触摸传感器阵列可以具有尾部。 绝缘体层可以穿过尾部的尖端部分从衬底移除，以允许线段被连接。
-
公开(公告)号：US06858796B1
公开(公告)日：2005-02-22
申请号：US10673695
申请日：2003-09-29
CPC分类号： H05K3/308 , H05K2201/10371 , H05K2201/1059 , H05K2201/10787 , H05K2201/10878
摘要： An electromagnetic (EM) shielding assembly includes an electrically conductive shielding portion and one or more electrically conductive protrusions for engaging with respective conductive apertures in a circuit board. The electrically conductive protrusions can be in electrical communication with the EM shielding portion. The protrusions can enable the EM shielding assembly to be attached to a circuit board in a computer system while also providing an electrical connection to logical ground. Further components, for example a heat sink that may be in electrical communication with the EM shielding portion, may thereby also be connected to logical ground.
摘要翻译： 电磁（EM）屏蔽组件包括导电屏蔽部分和一个或多个导电突起，用于与电路板中的各个导电孔接合。 导电突起可以与EM屏蔽部分电连通。 突起可使EM屏蔽组件能够连接到计算机系统中的电路板，同时还提供与逻辑接地的电连接。 其它部件，例如可能与EM屏蔽部分电气连通的散热器，因此也可以连接到逻辑接地。
-
公开(公告)号：US10185446B2
公开(公告)日：2019-01-22
申请号：US12906025
申请日：2010-10-15
IPC分类号： G06F3/044
摘要： Touch pad structures are provided that gather touch sensor data. The data may be used to control a computer or other electronic device. The touch pad structures may be integrated into a computer or other computing equipment or may be provided as a stand-alone accessory. The touch pad structures may include a touch sensor array. The touch sensor array may include rows and columns of touch sensor electrodes, interconnect lines, and other conductive structures. The conductive structures on the touch sensor array may be formed from patterned layers of ink. Interconnect line segments in different layer of ink may be connected in rectangular contact regions. The touch sensor array may have a tail. A layer of insulator may be removed from the substrate across a tip portion of the tail to allow the line segments to be connected.
-
公开(公告)号：US07027299B2
公开(公告)日：2006-04-11
申请号：US10643811
申请日：2003-08-19
IPC分类号： H05K7/20
CPC分类号： G06F1/20 , H05K7/20727
摘要： An electronics assembly, for example a computer that may be employed as a network server, has an enclosure, and a plurality of heat-generating components such as microprocessors located inside the enclosure. One or more fans may be provided for maintaining a through flow of air for cooling the components of the assembly. The heat-generating components are located within the enclosure in line with the direction of the flow of air, and the heat-sinks have a configuration such that the air flows over them in parallel. The heat-sinks may each have a flat base for mounting on the component, and a cantilevered portion having one end located on the base, and another end that extends beyond the base and over the base of the other heat-sink, but not in contact with it.
摘要翻译： 电子组件，例如可以用作网络服务器的计算机，具有外壳，以及多个发热组件，例如位于外壳内的微处理器。 可以提供一个或多个风扇以保持用于冷却组件的部件的空气流。 发热部件位于外壳内，与空气流动的方向一致，并且散热器具有使得空气平行流过它们的构造。 散热器可以各自具有用于安装在部件上的平坦基部，以及具有位于基部上的一端的悬臂部分，以及延伸超过基部并在另一个散热器的基部之上的另一端，但不在 与它联系。
-
公开(公告)号：US06999312B1
公开(公告)日：2006-02-14
申请号：US10403668
申请日：2003-03-31
IPC分类号： G06F1/20
CPC分类号： H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： There is provided a computing apparatus. The computing apparatus has first and second computing elements and a heatsink thermally coupled to each of the first and second computing elements. A portion of the heatsink thermally coupled to the first computing element is thermally separated from a portion of the heatsink thermally coupled to the second computing element by a region having a reduced thermal conductivity.
摘要翻译： 提供了一种计算装置。 计算设备具有第一和第二计算元件以及热耦合到第一和第二计算元件中的每一个的散热器。 热耦合到第一计算元件的散热器的一部分通过热导率降低的区域与散热器的热耦合到第二计算元件的部分热分离。
-
公开(公告)号：US07232332B2
公开(公告)日：2007-06-19
申请号：US10337500
申请日：2003-01-07
IPC分类号： H01R13/00
CPC分类号： H01L23/4006 , H01L23/552 , H01L2924/0002 , H01L2924/00
摘要： Various embodiments of a heat sink assembly are disclosed. In one embodiment, the heat sink assembly includes a processor mounted onto a circuit board; a heat sink located in thermal contact with the processor at the side of the processor opposite circuit board; and an electromagnetic shielding member located between the circuit board and the heat sink. The electromagnetic shielding member is releasably attached to the circuit board. Additionally, or in the alternative, the heat sink is biased toward the processor by a load spring and the electromagnetic shielding member is configured to provide a spring force between the circuit board and the heat sink, counter directional to the bias from the load spring.
摘要翻译： 公开了散热器组件的各种实施例。 在一个实施例中，散热器组件包括安装在电路板上的处理器; 散热器，位于与处理器相对的电路板处的处理器热接触; 以及位于电路板和散热器之间的电磁屏蔽构件。 电磁屏蔽构件可释放地附接到电路板。 另外，或者替代地，散热器通过负载弹簧被偏置到处理器，并且电磁屏蔽构件构造成在电路板和散热器之间提供与来自负载弹簧的偏压相反的弹簧力。
-
-
-
-
-
-
-
-
-
搜索结果
12 条记录 (耗时 0.016 秒)
