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    Plasma display panel and method of manufacturing the same
    1.
    发明授权
    Plasma display panel and method of manufacturing the same 失效
    等离子显示面板及其制造方法

    公开(公告)号：US07377831B2

    公开(公告)日：2008-05-27

    申请号：US10950665

    申请日：2004-09-28

    申请人： Je Seok Kim ,  Jin Hyung Ryu

    发明人： Je Seok Kim ,  Jin Hyung Ryu

    IPC分类号： H01J17/49 ,  G03C5/00

    CPC分类号： H01J11/24 ,  H01J9/02 ,  H01J11/12 ,  H01J2211/444

    摘要： The present invention relates to a plasma display panel, and more particularly, to a plasma display panel and method of manufacturing the same in which a manufacturing process is simple. To this end, in a plasma display panel according to an embodiment of the present invention, metal electrodes are composed of a green tape having a black electrode formed at the bottom and a silver electrode formed at the top, and are formed by exposing the green tape to ultraviolet rays of different wavelengths consecutively. Therefore, it is possible to simplify a manufacturing process of a plasma display panel and to reduce manufacturing cost.

    摘要翻译： 等离子体显示面板技术领域本发明涉及等离子体显示面板，更具体地，涉及一种制造方法简单的等离子体显示面板及其制造方法。 为此，在根据本发明实施例的等离子体显示面板中，金属电极由形成在底部的黑色电极和形成在顶部的银电极的生带构成，并且通过使绿色 胶带连续不同波长的紫外线。 因此，能够简化等离子体显示面板的制造工序，降低制造成本。

    Semiconductor package and method of making a semiconductor package
    2.
    发明授权
    Semiconductor package and method of making a semiconductor package 有权
    半导体封装以及制造半导体封装的方法

    公开(公告)号：US07564131B2

    公开(公告)日：2009-07-21

    申请号：US10453503

    申请日：2003-06-04

    申请人： Jin Hyung Ryu ,  Sam Je Cho

    发明人： Jin Hyung Ryu ,  Sam Je Cho

    IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L23/498 ,  H01L23/12 ,  H01L23/15 ,  H05K3/34 ,  H05K3/46 ,  H05K1/03

    CPC分类号： H05K3/3452 ,  H01L23/15 ,  H01L23/49816 ,  H01L23/49827 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0306 ,  H05K3/4611 ,  H05K3/4629 ,  H05K2201/017 ,  H01L2924/00

    摘要： Disclosed is a semiconductor package and method for package a semiconductor that has high reliability. A semiconductor package according to the present invention comprises a first substrate on which a circuit pattern and an electrode pad are formed; a second substrate which is adhered to the first substrate and on which a hole is formed; and a solder ball adhered to the electrode pad through the hole formed on the second substrate. Then, the second substrate is used as a solder resist. Accordingly, since the first substrate and the second substrate are formed of same material, the BGA package can be prevented from being cracked and being nonuniform when fired.

    摘要翻译： 公开了一种具有高可靠性的用于封装半导体的半导体封装和方法。 根据本发明的半导体封装包括其上形成有电路图案和电极焊盘的第一基板; 第二基板，其粘附到所述第一基板并且在其上形成有孔; 并且焊球通过形成在第二基板上的孔粘附到电极焊盘。 然后，将第二基板用作阻焊剂。 因此，由于第一基板和第二基板由相同的材料形成，因此可以防止BGA封装在烧制时破裂和不均匀。