公开(公告)号：US20160027787A1

公开(公告)日：2016-01-28

申请号：US14847324

申请日：2015-09-08

申请人： Je-Min Park ,  Seok-Hyun Lim ,  Tae-Yong Song ,  Hyun-Chul Yoon ,  Yoo-Sang Hwang ,  Hyeon-Ok Jung

发明人： Je-Min Park ,  Seok-Hyun Lim ,  Tae-Yong Song ,  Hyun-Chul Yoon ,  Yoo-Sang Hwang ,  Hyeon-Ok Jung

IPC分类号： H01L27/108 ,  H01L21/3213

CPC分类号： H01L27/10855 ,  H01L21/0337 ,  H01L21/31144 ,  H01L21/32139 ,  H01L21/76895 ,  H01L21/76897 ,  H01L27/1085 ,  H01L27/10885 ,  H01L27/10894 ,  H01L27/10897

摘要： An electronic device may include a substrate, and a plurality of spaced apart pads on the substrate. Each of the pads may includes first, second, third, and fourth sides, the first and third sides may be opposite sides that are substantially straight, and the second and fourth sides may be opposite sides that are curved. Related methods, devices, and structures are also discussed.

摘要翻译： 电子器件可以包括衬底和衬底上的多个间隔开的衬垫。 每个垫可以包括第一，第二，第三和第四侧，第一和第三侧可以是基本上直的相对侧，并且第二和第四侧可以是相对的弯曲的侧面。 还讨论了相关方法，设备和结构。

公开(公告)号：US09461051B2

公开(公告)日：2016-10-04

申请号：US14847324

申请日：2015-09-08

申请人： Je-Min Park ,  Seok-Hyun Lim ,  Tae-Yong Song ,  Hyun-Chul Yoon ,  Yoo-Sang Hwang ,  Hyeon-Ok Jung

发明人： Je-Min Park ,  Seok-Hyun Lim ,  Tae-Yong Song ,  Hyun-Chul Yoon ,  Yoo-Sang Hwang ,  Hyeon-Ok Jung

IPC分类号： H01L27/108 ,  H01L21/3213 ,  H01L21/768 ,  H01L21/033 ,  H01L21/311

CPC分类号： H01L27/10855 ,  H01L21/0337 ,  H01L21/31144 ,  H01L21/32139 ,  H01L21/76895 ,  H01L21/76897 ,  H01L27/1085 ,  H01L27/10885 ,  H01L27/10894 ,  H01L27/10897

摘要： An electronic device may include a substrate, and a plurality of spaced apart pads on the substrate. Each of the pads may includes first, second, third, and fourth sides, the first and third sides may be opposite sides that are substantially straight, and the second and fourth sides may be opposite sides that are curved. Related methods, devices, and structures are also discussed.

摘要翻译： 电子器件可以包括衬底和衬底上的多个间隔开的衬垫。 每个垫可以包括第一，第二，第三和第四侧，第一和第三侧可以是基本上直的相对侧，并且第二和第四侧可以是相对的弯曲的侧面。 还讨论了相关方法，设备和结构。

公开(公告)号：US20140374809A1

公开(公告)日：2014-12-25

申请号：US14105581

申请日：2013-12-13

申请人： Je-Min Park ,  Seok-Hyun Lim ,  Tae-Yong Song ,  Hyun-Chul Yoon ,  Yoo-Sang Hwang ,  Hyeon-Ok Jung

发明人： Je-Min Park ,  Seok-Hyun Lim ,  Tae-Yong Song ,  Hyun-Chul Yoon ,  Yoo-Sang Hwang ,  Hyeon-Ok Jung

IPC分类号： H01L27/108 ,  H01L23/528

CPC分类号： H01L27/10855 ,  H01L21/0337 ,  H01L21/31144 ,  H01L21/32139 ,  H01L21/76895 ,  H01L21/76897 ,  H01L27/1085 ,  H01L27/10885 ,  H01L27/10894 ,  H01L27/10897

摘要： An electronic device may include a substrate, and a plurality of spaced apart pads on the substrate. Each of the pads may includes first, second, third, and fourth sides, the first and third sides may be opposite sides that are substantially straight, and the second and fourth sides may be opposite sides that are curved. Related methods, devices, and structures are also discussed.

摘要翻译： 电子器件可以包括衬底和衬底上的多个间隔开的衬垫。 每个垫可以包括第一，第二，第三和第四侧，第一和第三侧可以是基本上直的相对侧，并且第二和第四侧可以是相对的弯曲的侧面。 还讨论了相关方法，设备和结构。