Semiconductor devices having fuses and methods of forming the same
    4.
    发明授权
    Semiconductor devices having fuses and methods of forming the same 有权
    具有保险丝的半导体器件及其形成方法

    公开(公告)号:US07510914B2

    公开(公告)日:2009-03-31

    申请号:US11447944

    申请日:2006-06-07

    IPC分类号: H01L21/82

    摘要: Semiconductor devices having a plurality of fuses and methods of forming the same are provided. The semiconductor device having a fuse including a substrate having a cell region and/or a fuse box region. A first insulation interlayer may be formed on the substrate. A first etch stop layer may be formed on the first insulation interlayer. A metal wiring including a barrier layer, a metal layer and/or a capping layer may be formed on the first etch stop layer of the cell region. Fuses, spaced apart from each other, may be formed on the first etch stop layer of the fuse box region. Each fuse may include the barrier layer and/or the metal layer. A second insulation interlayer having an opening exposing the fuse box region may be formed on the metal wiring and/or the first etch stop layer. The etch stop layer may allow the fuses to be formed more uniformly and decrease the probability of breaking the fuses.

    摘要翻译: 提供具有多个保险丝的半导体器件及其形成方法。 该半导体器件具有包括具有单元区域和/或保险丝盒区域的衬底的熔丝。 可以在基板上形成第一绝缘中间层。 可以在第一绝缘中间层上形成第一蚀刻停止层。 可以在单元区域的第一蚀刻停止层上形成包括阻挡层,金属层和/或覆盖层的金属布线。 彼此间隔开的保险丝可以形成在保险丝盒区域的第一蚀刻停止层上。 每个熔断器可以包括阻挡层和/或金属层。 具有暴露熔丝盒区域的开口的第二绝缘夹层可以形成在金属布线和/或第一蚀刻停止层上。 蚀刻停止层可以允许保险丝更均匀地形成并且降低断开保险丝的可能性。