Method and system for an auction based on reducing BID
    1.
    发明授权
    Method and system for an auction based on reducing BID 有权
    基于减少BID的拍卖方法和系统

    公开(公告)号:US07853484B2

    公开(公告)日:2010-12-14

    申请号:US11550889

    申请日:2006-10-19

    申请人: Jeff Yang Wen-Hui Kuo

    发明人: Jeff Yang Wen-Hui Kuo

    IPC分类号: G06Q30/00

    CPC分类号: G06Q30/08 G06Q40/04

    摘要: The present invention provides an auction method and system, that is, a seller proposes an expected selling price of an item in a tender offered by the seller and the item is announced and bid on the auction system provided by the manager of auction system, and a end time and a number of bids are set. Many buyers make bids by haggling the price down and a certain tendered bid with every bid is paid, and a bid-winner is a buyer who makes a “lowest price” and “only one” bid when the tender is concluded. The bid-winner is satisfied by buying the item at a low price, the selling price of the item offered by the seller and a commission of the auction system manager are obtained from total tendered bids of total bids and a bidding price by the bid-winner to satisfy three parties, such as the bid-winner, seller and auction system manager.

    摘要翻译: 本发明提供一种拍卖方法和系统,即卖方提出卖方所提供的投标中的商品的预期售价,并且该项目被宣告并且由拍卖系统的经理提供的拍卖系统出价,以及 设置结束时间和多个出价。 许多买家通过调低价格进行投标,并且每次投标都要支付一定的招标投标,竞标者是在投标结束时作出“最低价格”和“只有一个”出价的买方。 投标人以低价购买物品,卖方提供的物品的售价和拍卖系统经理的佣金由总投标总投标和投标价格按投标价格获得, 获胜者满足三方,如中标者,卖家和拍卖系统经理。

    METHOD AND SYSTEM FOR AN AUCTION BASED ON REDUCING BID
    2.
    发明申请
    METHOD AND SYSTEM FOR AN AUCTION BASED ON REDUCING BID 有权
    基于减少投标的拍卖方法和系统

    公开(公告)号:US20070094123A1

    公开(公告)日:2007-04-26

    申请号:US11550889

    申请日:2006-10-19

    申请人: Jeff Yang Wen-Hui Kuo

    发明人: Jeff Yang Wen-Hui Kuo

    IPC分类号: G06Q40/00

    CPC分类号: G06Q30/08 G06Q40/04

    摘要: The present invention provides an auction method and system, that is, a seller proposes an expected selling price of an item in a tender offered by the seller and the item is announced and bid on the auction system provided by the manager of auction system, and a end time and a number of bids are set. Many buyers make bids by haggling the price down and a certain tendered bid with every bid is paid, and a bid-winner is a buyer who makes a “lowest price” and “only one” bid when the tender is concluded. The bid-winner is satisfied by buying the item at a low price, the selling price of the item offered by the seller and a commission of the auction system manager are obtained from total tendered bids of total bids and a bidding price by the bid-winner to satisfy three parties, such as the bid-winner, seller and auction system manager.

    摘要翻译: 本发明提供一种拍卖方法和系统,即卖方提出卖方所提供的投标中的商品的预期售价,并且该项目被宣告并且由拍卖系统的经理提供的拍卖系统出价,以及 设置结束时间和多个出价。 许多买家通过调低价格进行投标,并且每次投标都要支付一定的招标投标,竞标者是在投标结束时作出“最低价格”和“只有一个”出价的买方。 投标人以低价购买物品,卖方提供的物品的售价和拍卖系统经理的佣金由总投标总投标和投标价格按投标价格获得, 获胜者满足三方,如中标者,卖家和拍卖系统经理。

    Pre-treatment to eliminate the defects formed during electrochemical plating
    3.
    发明申请
    Pre-treatment to eliminate the defects formed during electrochemical plating 审中-公开
    预处理以消除电化学电镀期间形成的缺陷

    公开(公告)号:US20070080067A1

    公开(公告)日:2007-04-12

    申请号:US11245559

    申请日:2005-10-07

    IPC分类号: C23C28/00 C25D5/34

    摘要: Embodiments of the invention provide methods for reducing formation of void-type defects on the surface of a substrate during electrochemical plating. Embodiments of the invention provide methods to improve the wetting of a substrate surface prior to immersion and thereby minimize adhesion of bubbles to the substrate surface during immersion. A thin uniform metal oxide is formed on a metal layer on the substrate immediately prior to substrate immersion. In one aspect, exposing the substrate to an oxygen-containing gas, e.g. air, forms the metal oxide. The oxygen-containing gas may be flowed over the substrate or the substrate may be rotated at a high rate in the presence of an oxygen-containing gas. In another aspect, non-uniform metal oxides are first removed from the substrate in an anneal process and a thin uniform metal oxide is subsequently re-formed. An optimized substrate immersion method may also be used to further reduce void defects.

    摘要翻译: 本发明的实施例提供了用于在电化学电镀期间减少基板表面上的空隙型缺陷的形成的方法。 本发明的实施例提供了在浸渍之前改善衬底表面的润湿并因此使浸入期间气泡与衬底表面的粘附最小化的方法。 在基板浸渍之前,在基板上的金属层上形成薄均匀的金属氧化物。 在一个方面,将基底暴露于含氧气体,例如, 空气形成金属氧化物。 含氧气体可以在衬底上流动,或者衬底可以在含氧气体存在下以高速旋转。 在另一方面,在退火工艺中首先从衬底上除去不均匀的金属氧化物,随后重新形成均匀的均匀金属氧化物。 也可以使用优化的底物浸渍方法来进一步减少空隙缺陷。

    Computer mainframe
    4.
    外观设计
    Computer mainframe 失效
    电脑主机

    公开(公告)号:USD442949S1

    公开(公告)日:2001-05-29

    申请号:US29127192

    申请日:2000-07-28

    申请人: Jeff Yang

    设计人: Jeff Yang