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    Channeled substrates for integrated optical devices employing optical fibers
    1.
    发明授权
    Channeled substrates for integrated optical devices employing optical fibers 有权
    用于采用光纤的集成光学器件的通道衬底

    公开(公告)号：US08611716B2

    公开(公告)日：2013-12-17

    申请号：US12570523

    申请日：2009-09-30

    申请人： Jeffery Alan DeMeritt ,  Richard Robert Grzybowski ,  Brewster Roe Hemenway, Jr. ,  James Scott Sutherland

    发明人： Jeffery Alan DeMeritt ,  Richard Robert Grzybowski ,  Brewster Roe Hemenway, Jr. ,  James Scott Sutherland

    IPC分类号： G02B6/00

    CPC分类号： G02B6/4214 ,  G02B6/3636 ,  G02B6/4233 ,  G02B6/4249

    摘要： A channeled substrate for forming integrated optical devices that employ optical fibers and at least one active optical component is disclosed. The channeled substrate includes a substrate member having an upper surface one or more grooves formed therein, and a transparent sheet. The transparent sheet, which is preferably made of thin glass, is fixed to the substrate member upper surface to define, in combination with the one or more grooves, one or more channels. The channels are each sized to accommodate an optical fiber to allow for optical communication through the transparent sheet between the active optical component and the optical fibers. Channeled substrates formed by molding and by drawing are also presented. Integrated optical devices that employ the channeled substrate are also disclosed.

    摘要翻译： 公开了用于形成采用光纤和至少一个有源光学部件的集成光学器件的沟道衬底。 通道基板包括具有形成在其中的上表面一个或多个凹槽的衬底构件和透明片。 优选由薄玻璃制成的透明片材固定到基底构件上表面，以与一个或多个凹槽组合以限定一个或多个通道。 通道的尺寸分别适于容纳光纤以允许通过有源光学部件和光纤之间的透明片的光通信。 还提出了通过模制和绘图形成的引导衬底。 还公开了采用沟道衬底的集成光学器件。

    Modular active board subassemblies and printed wiring boards comprising the same
    2.
    发明授权
    Modular active board subassemblies and printed wiring boards comprising the same 有权
    模块化的有源板子组件和包括其的印刷电路板

    公开(公告)号：US07949211B1

    公开(公告)日：2011-05-24

    申请号：US12714021

    申请日：2010-02-26

    申请人： Richard Robert Grzybowski ,  Brewster Roe Hemenway, Jr. ,  James Scott Sutherland

    发明人： Richard Robert Grzybowski ,  Brewster Roe Hemenway, Jr. ,  James Scott Sutherland

    IPC分类号： G02B6/12

    CPC分类号： G02B6/4292 ,  G02B6/4201 ,  G02B6/4246

    摘要： A modular active board subassembly for coupling a waveguide array to an electrical component on a printed wiring board may include a substrate board with a sidewall extending around at least a portion of an attachment surface of the substrate board and forming a component cavity on the attachment surface. A transceiver may be disposed in the component cavity proximate an inboard edge of the substrate board. The transceiver may be electrically coupled to conductors on the attachment surface and electrically coupled to electrical contacts on an upper surface of the sidewall. A waveguide may be positioned in the component cavity and extend from the outboard edge of the substrate to the transceiver. The waveguide may be coupled to the transceiver.

    摘要翻译： 用于将波导阵列耦合到印刷线路板上的电气部件的模块化有源板子组件可以包括：衬底板，其具有围绕衬底板的附接表面的至少一部分延伸的侧壁，并在附接表面上形成组件空腔 。 收发器可以靠近基板的内侧边缘设置在部件空腔中。 收发器可以电耦合到附接表面上的导体并且电耦合到侧壁的上表面上的电触点。 波导可以被定位在组件空腔中并且从衬底的外侧边缘延伸到收发器。 波导可以耦合到收发器。