公开(公告)号：US6034589A

公开(公告)日：2000-03-07

申请号：US213148

申请日：1998-12-17

申请人： Jeffrey D. Montgomery ,  Xiangming Li ,  Daniel H. Chang ,  Kenneth M. Wallace ,  Kenneth X. Kuang

发明人： Jeffrey D. Montgomery ,  Xiangming Li ,  Daniel H. Chang ,  Kenneth M. Wallace ,  Kenneth X. Kuang

IPC分类号： H01H69/02 ,  H01H85/041 ,  H01H85/046 ,  H01H85/06 ,  H01H85/12 ,  H01H85/055 ,  H01H85/08 ,  H01H85/38

CPC分类号： H01H85/0411 ,  H01H2085/0414 ,  H01H2085/388 ,  H01H69/022 ,  H01H85/046 ,  H01H85/06 ,  H01H85/12 ,  Y10T29/49107

摘要： A surface mount fuse includes a plurality of substrate/arc suppressive layers, a plurality of fusible elements positioned between the substrate/arc suppressive layers and terminations connected to the ends of the fusible elements, such that the fusible elements are electrically connected in parallel. The surface mount fuse has greater amperage and voltage ratings than similarly sized conventional surface mount fuses. Additionally, the surface mount fuse has increased interrupt breaking capacity and superior mechanical properties.

摘要翻译： 表面贴装保险丝包括多个基板/电弧抑制层，多个可熔元件，位于基板/电弧抑制层之间，以及连接到可熔元件的端部的端子，使得可熔元件并联电连接。 表面贴装保险丝具有比类似尺寸的常规表面贴装保险丝更大的电流和电压额定值。 此外，表面贴装保险丝具有增加的中断分断能力和优异的机械性能。

公开(公告)号：US5759331A

公开(公告)日：1998-06-02

申请号：US706982

申请日：1996-09-03

申请人： Kenneth M. Wallace

发明人： Kenneth M. Wallace

IPC分类号： B23K26/38 ,  H01L21/48 ,  H05K1/03 ,  H05K3/00 ,  H05K3/40 ,  H05K3/46 ,  B32B31/18

CPC分类号： H05K3/4061 ,  B23K26/382 ,  B23K26/40 ,  B23K26/402 ,  B32B38/0004 ,  H01L21/486 ,  B23K2203/16 ,  B23K2203/42 ,  B23K2203/52 ,  H05K1/0306 ,  H05K2203/0156 ,  H05K2203/0191 ,  H05K2203/066 ,  H05K2203/1178 ,  H05K3/0029 ,  H05K3/4611 ,  H05K3/4629 ,  Y10T156/1056

摘要： A ceramic slurry is deposited onto a plastic carrier tape and allowed to dry before the tape is inverted for further processing. The plastic carrier tape remains with the ceramic during subsequent via hole punching and printing steps. The carrier tape also remains with the dried ceramic to support the same when the via holes are filled with conductive material which helps retain the material within the via holes. The carrier tape is peeled off as each layer of ceramic is built up to form a laminated multi-layer ceramic component. This provides a smooth, uniform surface at the top of each conductive-filled via hole. In order to ensure that the conductive properties of each conductive-filled via are not compromised a preparatory step of creating a hole in the plastic carrier tape that is very small in comparison to the via hole placed in the ceramic tape is included. The small hole in the plastic carrier serves as a bleed hole for air trapped in the conductive paste. The conductive paste in the plastic layer is also made easier to remove because the small area of the paste in the small hole decreases its tensile strength relative to the paste in the ceramic layer. This decreased strength increases the likelihood that it will fracture under a shear stress and separate from the paste in the ceramic layer.

摘要翻译： 将陶瓷浆料沉积在塑料载带上，并允许其在带反转之前干燥以进一步处理。 在随后的通孔冲压和印刷步骤期间，塑料载带保留在陶瓷上。 当通孔填充有助于将材料保持在通孔内的导电材料时，载带也保留在干燥的陶瓷上以支撑它们。 随着每层陶瓷的形成，形成层叠的多层陶瓷部件，载带被剥离。 这在每个导电填充的通孔的顶部提供了平滑，均匀的表面。 为了确保每个导电填充的通孔的导电性能不受损害，包括在与放置在陶瓷带中的通孔相比非常小的塑料载体带上形成孔的准备步骤。 塑料载体中的小孔用作捕获在导电浆料中的空气的放气孔。 塑料层中的导电糊还易于去除，因为小孔中的小糊状区域相对于陶瓷层中的糊料降低其拉伸强度。 这种降低的强度增加了其在剪切应力下断裂并与陶瓷层中的糊料分离的可能性。