公开(公告)号：US5136465A

公开(公告)日：1992-08-04

申请号：US605051

申请日：1990-10-29

申请人： Jeffrey W. Benck ,  Mohanlal S. Mansuria ,  Michael S. Miller ,  Richard D. Musa ,  Brian A. Trumbo

发明人： Jeffrey W. Benck ,  Mohanlal S. Mansuria ,  Michael S. Miller ,  Richard D. Musa ,  Brian A. Trumbo

IPC分类号： G06F1/20 ,  H05K7/20

CPC分类号： G06F1/20

摘要： This invention relates to personal computers in which provision is made for effective cooling of components capable of generating significant heat during operation, such as certain high performance microprocessors. The personal computer has an enclosure for enclosing operating components, a printed circuit board mounted within the enclosure for supporting and interconnecting operating components of the personal computer, heat generating components mounted on the printed circuit board for performing operating functions for the personal computer, a fan for inducing air to flow into the enclosure, a fan for expelling air from the enclosure, and an air flow directing baffle mounted within the enclosure in the path of air flow from one fan toward the other fan and adjacent the heat generating components for directing the flow of air through the enclosure to pass over and cool the heat generating components.

摘要翻译： 本发明涉及个人计算机，其中提供了用于有效冷却在操作期间能够产生显着热量的部件，例如某些高性能微处理器。 个人计算机具有用于封闭操作部件的外壳，安装在外壳内的印刷电路板，用于支撑和互连个人计算机的操作部件，安装在印刷电路板上的用于执行个人计算机的操作功能的发热元件，风扇 用于引导空气流入外壳，用于从外壳排出空气的风扇以及安装在外壳内的空气流导向挡板在空气流中从一个风扇流向另一个风扇并且靠近发热部件，用于引导 空气通过外壳流过并冷却发热部件。

公开(公告)号：US5032897A

公开(公告)日：1991-07-16

申请号：US486467

申请日：1990-02-28

申请人： Mohanlal S. Mansuria ,  Joseph M. Mosley ,  Richard D. Musa ,  William F. Shutler ,  Vito J. Tuozzolo

发明人： Mohanlal S. Mansuria ,  Joseph M. Mosley ,  Richard D. Musa ,  William F. Shutler ,  Vito J. Tuozzolo

IPC分类号： H01L23/38

CPC分类号： H01L23/38 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2924/15174 ,  Y10S257/93

摘要： A thermoelectrically cooled integrated circuit package including an insulative module which defines a cavity, a thermoelectric cooler within the cavity, and an integrated circuit chip connected to the thermoelectric cooler, thus providing an integrated circuit package in which the integrated circuit package itself dissipates thermal energy generated by the integrated circuit chip.

公开(公告)号：US5012325A

公开(公告)日：1991-04-30

申请号：US513655

申请日：1990-04-24

申请人： Mohanlal S. Mansuria ,  Joseph M. Mosley ,  Richard D. Musa ,  Vito J. Tuozzolo

发明人： Mohanlal S. Mansuria ,  Joseph M. Mosley ,  Richard D. Musa ,  Vito J. Tuozzolo

IPC分类号： H01L23/38

CPC分类号： H01L23/38 ,  H01L2224/16225 ,  Y10S257/93

摘要： A thermoelectrically cooled integrated circuit package is provided which includes a thermally conductive dielectric substrate, an input connecting portion and an output connecting portion supported by the dielectric substrate, and an integrated circuit chip including an input terminal and output terminal. The input terminal is electrically connected to the input connecting portion via a first conductive material, and the output terminal is electrically connected to the output connecting portion via a second conductive material. The first conductive material and the second conductive material thermoelectrically cool the integrated circuit chip when a signal passes through the first conductive material and the second conductive material.