公开(公告)号：US5032897A

公开(公告)日：1991-07-16

申请号：US486467

申请日：1990-02-28

申请人： Mohanlal S. Mansuria ,  Joseph M. Mosley ,  Richard D. Musa ,  William F. Shutler ,  Vito J. Tuozzolo

发明人： Mohanlal S. Mansuria ,  Joseph M. Mosley ,  Richard D. Musa ,  William F. Shutler ,  Vito J. Tuozzolo

IPC分类号： H01L23/38

CPC分类号： H01L23/38 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2924/15174 ,  Y10S257/93

摘要： A thermoelectrically cooled integrated circuit package including an insulative module which defines a cavity, a thermoelectric cooler within the cavity, and an integrated circuit chip connected to the thermoelectric cooler, thus providing an integrated circuit package in which the integrated circuit package itself dissipates thermal energy generated by the integrated circuit chip.

公开(公告)号：US5012325A

公开(公告)日：1991-04-30

申请号：US513655

申请日：1990-04-24

申请人： Mohanlal S. Mansuria ,  Joseph M. Mosley ,  Richard D. Musa ,  Vito J. Tuozzolo

发明人： Mohanlal S. Mansuria ,  Joseph M. Mosley ,  Richard D. Musa ,  Vito J. Tuozzolo

IPC分类号： H01L23/38

CPC分类号： H01L23/38 ,  H01L2224/16225 ,  Y10S257/93

摘要： A thermoelectrically cooled integrated circuit package is provided which includes a thermally conductive dielectric substrate, an input connecting portion and an output connecting portion supported by the dielectric substrate, and an integrated circuit chip including an input terminal and output terminal. The input terminal is electrically connected to the input connecting portion via a first conductive material, and the output terminal is electrically connected to the output connecting portion via a second conductive material. The first conductive material and the second conductive material thermoelectrically cool the integrated circuit chip when a signal passes through the first conductive material and the second conductive material.

公开(公告)号：US5490040A

公开(公告)日：1996-02-06

申请号：US172467

申请日：1993-12-22

申请人： Gene J. Gaudenzi ,  Joseph M. Mosley ,  Vito J. Tuozzolo ,  John C. Milliken

发明人： Gene J. Gaudenzi ,  Joseph M. Mosley ,  Vito J. Tuozzolo ,  John C. Milliken

IPC分类号： H05K1/18 ,  H01L23/12 ,  H01L23/498 ,  H05K3/34 ,  H01R9/09 ,  B23K31/02 ,  H01L23/48

CPC分类号： H01L23/49838 ,  H01L23/49811 ,  H01L23/49816 ,  H05K3/3415 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/15311 ,  H01L2924/16152 ,  H05K2201/10659 ,  H05K2201/10734 ,  H05K3/3447 ,  Y02P70/613

摘要： An electrical device for logic circuits having a package comprising a combination of controlled collapse electrical interconnections, such as solder balls and pin through-hole conductors, wherein the conductors are disposed outside the perimeter of an inter-array of solder balls, which when a maximum number of solder balls are disposed, the array is circular in shape, so as to provide an increased footprint for the electrical device beyond that, otherwise maximum footprint for solder balls alone, which footprint is otherwise limited in size due to failures which occur in solder balls when solder balls are exposed to thermal and mechanical stress levels at extended distances from the neutral or zero stress point of the array.

摘要翻译： 一种用于逻辑电路的电子装置，其具有包括诸如焊球和销通孔导体的受控塌缩电互连的组合的封装，其中所述导体设置在焊球间排列的周边之外，当最大值 焊球的数量被设置，该阵列的形状是圆形的，以便为电气设备提供增加的占地面积，否则最大限度地限制焊球的尺寸，否则由于焊料中发生的故障而限制了其尺寸 当焊球暴露于与阵列的中性点或零应力点相距较远距离的热和机械应力水平时的球。