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公开(公告)号:US20130168711A1
公开(公告)日:2013-07-04
申请号:US13732694
申请日:2013-01-02
申请人: Jeong Pil JEONG , Jung Hyun HWANG , Chong Cook KIM
发明人: Jeong Pil JEONG , Jung Hyun HWANG , Chong Cook KIM
IPC分类号: H01L33/32
CPC分类号: H01L33/32 , F21K9/232 , F21Y2115/10 , H01L33/04 , H01L33/20 , H01L33/382 , H01L33/42 , H01L33/44 , H01L2224/48091 , H01L2924/0002 , H01L2924/00014 , H01L2924/00
摘要: Disclosed are a light emitting device, a method of manufacturing the same, a light emitting device package, and a lighting system. The light emitting device includes: a substrate; a first conductive semiconductor layer on the substrate; an active layer on the first conductive semiconductor layer; a second conductive semiconductor layer; and a nitride semiconductor layer having a refractive index less than a refractive index of the second conductive semiconductor layer on the second conductive semiconductor layer.
摘要翻译: 公开了一种发光器件,其制造方法,发光器件封装和照明系统。 发光装置包括:基板; 在所述基板上的第一导电半导体层; 在第一导电半导体层上的有源层; 第二导电半导体层; 以及氮化物半导体层,其折射率小于第二导电半导体层上的第二导电半导体层的折射率。
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公开(公告)号:US20120187365A1
公开(公告)日:2012-07-26
申请号:US13358145
申请日:2012-01-25
申请人: Jong Pil JEONG , Jung Hyun HWANG , Chong Cook KIM , Sung Jin SON
发明人: Jong Pil JEONG , Jung Hyun HWANG , Chong Cook KIM , Sung Jin SON
IPC分类号: H01L33/04
CPC分类号: H01L33/145 , H01L33/025 , H01L33/04 , H01L33/10 , H01L33/32 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014
摘要: Provided are a light emitting device, a method of fabricating the light emitting device, a light emitting device package, and a lighting system. The light emitting device comprises a first conductive type semiconductor layer, a light emitting layer over the first conductive type semiconductor layer, an electron blocking layer over the light emitting layer, and a second conductive type semiconductor layer over the electron blocking layer. The electron blocking layer comprises a pattern having a height difference.
摘要翻译: 提供了发光器件,制造发光器件的方法,发光器件封装和照明系统。 发光器件包括第一导电类型半导体层,第一导电类型半导体层上的发光层,发光层上的电子阻挡层,以及电子阻挡层上的第二导电类型半导体层。 电子阻挡层包括具有高度差的图案。
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公开(公告)号:US20140034902A1
公开(公告)日:2014-02-06
申请号:US13837688
申请日:2013-03-15
申请人: Jung Hyun HWANG , Oh Min Kwon , Jong Hak Won
发明人: Jung Hyun HWANG , Oh Min Kwon , Jong Hak Won
IPC分类号: H01L33/14
摘要: Disclosed are a light emitting device and a light emitting device package. The light emitting device includes a first conductive semiconductor layer, an active layer on the first conductive semiconductor layer, and a second conductive semiconductor layer on the active layer. The active layer includes (T+1) barrier layers, T well layers between the (T+1) barrier layers, and a first dummy layer between N well layers adjacent to the second conductive semiconductor layer and N barrier layers adjacent to the N well layers, in which T>N≧1.
摘要翻译: 公开了一种发光器件和发光器件封装。 发光器件包括第一导电半导体层,第一导电半导体层上的有源层和有源层上的第二导电半导体层。 有源层包括(T + 1)势垒层,(T + 1)势垒层之间的T阱层和与第二导电半导体层相邻的N阱层之间的第一虚设层和与N阱相邻的N个势垒层 层,其中T> N> = 1。
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