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公开(公告)号:US20120074595A1
公开(公告)日:2012-03-29
申请号:US13191843
申请日:2011-07-27
申请人: JeongOh Ha , Heungkyu Kwon , YunSeok Choi , Jong-Won Lee
发明人: JeongOh Ha , Heungkyu Kwon , YunSeok Choi , Jong-Won Lee
IPC分类号: H01L23/522
CPC分类号: H01L25/105 , H01L23/5386 , H01L24/48 , H01L24/73 , H01L2224/16225 , H01L2224/32225 , H01L2224/48225 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2225/1023 , H01L2225/1058 , H01L2924/00014 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要: A semiconductor package includes a first substrate on which a first semiconductor chip is mounted, a second substrate spaced apart from the first substrate and on which a second semiconductor chip is mounted, first pads disposed on the first substrate, second pads disposed on the second substrate to be opposite to the first pads, and connection patterns electrically connecting the opposite first and second pads to each other, respectively. The first pads are disposed asymmetrically with respect to the central axis of the first substrate.
摘要翻译: 半导体封装包括:第一衬底,其上安装有第一半导体芯片;第二衬底,与第一衬底间隔开并且安装有第二半导体芯片;第一焊盘,设置在第一衬底上;第二焊盘,设置在第二衬底上; 与第一焊盘相对,以及将相对的第一焊盘和第二焊盘彼此电连接的连接图案。 第一衬垫相对于第一衬底的中心轴非对称地设置。