摘要:
A mounting bracket for securing a mezzanine card in a stacked single board computer includes a main body that includes a first end, an opposite second end, a first side surface, and an opposite second side surface. The main body is sized to be positioned along a side surface of the mezzanine card, wherein the first side surface or the second side surface contacts the side surface of the mezzanine card to facilitate securing the side surface of the mezzanine card with respect to a top PCB. The mounting bracket also includes a first arm formed at the first end of the main body, a second arm formed at the second end of the main body, and at least one top rail coupled to the main body, wherein the top rail is configured to secure a top surface of the mezzanine card with respect to a top PCB.
摘要:
A method for coupling a battery within an embedded system is described. The method includes creating a hole extending through a printed circuit board (PCB), inserting a portion of the battery into the hole, and electrically coupling the battery to at least one contact.
摘要:
The present disclosure is related to creating blocks of aluminum and/or copper material having embedded TPG elements for forming heatsinks. The metal blocks have an improved thermal conductivity in the X-Y plane. Furthermore, the TPG-embedded heatsinks can be created using methods capable of being performed using various machines and equipment in many various facilities.
摘要:
The present disclosure is related to a heatsink and a method for forming a heatsink. In one embodiment, a method for forming the heatsink includes forming at least one thermo pyrolytic graphite element. The at least one TPG element includes a first side having a wedge-shaped surface and a second side having a flat surface. The method further includes layering a metal material over the at least one TPG element, the metal configured to be complementary to the first side of the at least one TPG element, and applying pressure to fasten the metal material to the at least one TPG element.
摘要:
The present disclosure is related to a heatsink and a method for forming a heatsink. In one embodiment, a method for forming the heatsink includes forming at least one thermo pyrolytic graphite element. The at least one TPG element includes a first side having a wedge-shaped surface and a second side having a flat surface. The method further includes layering a metal material over the at least one TPG element, the metal configured to be complementary to the first side of the at least one TPG element, and applying pressure to fasten the metal material to the at least one TPG element.
摘要:
A method for coupling a battery within an embedded system is described. The method includes creating a hole extending through a printed circuit board (PCB), inserting a portion of the battery into the hole, and electrically coupling the battery to at least one contact.
摘要:
The present disclosure is related to methods for bonding TPG elements to at least a first metal material for forming a heatsink. The heatsinks have an improved thermal conductivity in the X-Y plane.
摘要:
A method for coupling a battery within an embedded system is described. The method includes creating a hole extending through a printed circuit board (PCB), inserting a portion of the battery into the hole, and electrically coupling the battery to at least one contact.