Abstract:
An electrostatic discharge (ESD) protection device includes a diode located in a substrate and an N-type metal oxide semiconductor (NMOS) device located in the substrate adjacent the diode, wherein both the diode and the NMOS are coupled to an input device, and at least a portion of the diode and at least a portion of the NMOS device collectively form an ESD protection device.
Abstract:
The present invention discloses a power transistor device and a low dropout regulator (LDO) with electrostatic discharge protection. The power transistor device includes: a P-type metal oxide semiconductor (PMOS) field effect transistor (FET), having a source and a drain electrically connected to a voltage input terminal and a voltage output terminal respectively; and an electrostatic discharge protection device, electrically connected to the voltage input terminal and the voltage output terminal, for providing an electrostatic discharge path to protect the PMOSFET.
Abstract:
An integrated circuit includes at least one transistor over a substrate. A first guard ring is disposed around the at least one transistor. The first guard ring has a first type dopant. A second guard ring is disposed around the first guard ring. The second guard ring has a second type dopant. A first doped region is disposed adjacent to the first guard ring. The first doped region has the second type dopant. A second doped region is disposed adjacent to the second guard ring. The second doped region has the first type dopant. The first guard ring, the second guard ring, the first doped region, and the second doped region are capable of being operable as a first silicon controlled rectifier (SCR) to substantially release an electrostatic discharge (ESD).