公开(公告)号：US20130008024A1

公开(公告)日：2013-01-10

申请号：US13620153

申请日：2012-09-14

申请人： Jin Seon PARK

发明人： Jin Seon PARK

IPC分类号： H05K3/10

CPC分类号： H05K1/185 ,  H01L21/4846 ,  H01L23/13 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/5389 ,  H01L24/24 ,  H01L2224/18 ,  H05K3/4602 ,  H05K2201/10674 ,  H05K2203/0191 ,  Y10T29/4913 ,  Y10T29/49139 ,  Y10T29/49146 ,  Y10T29/49155

摘要： Disclosed herein is a printed circuit board, including: a substrate including an insulation layer in which a cavity is formed; an electronic component mounted in the cavity of the substrate and having connection terminals; an insulation material layer formed on one side of the substrate to bury the electronic component; a first circuit layer formed on the other side of the substrate and including a connection pattern connecting with the connection terminals of the electronic component; and a second circuit layer formed on the insulation material layer. The printed circuit board is advantageous in that it can prevent the warpage thereof and ensure the reliability of electrical connection between an electronic component and a circuit layer by adjusting the thickness, thermal expansion coefficient and elastic modulus of insulation layer or the insulating material.

摘要翻译： 本文公开了一种印刷电路板，包括：基板，包括其中形成空腔的绝缘层; 安装在基板的空腔中并具有连接端子的电子部件; 绝缘材料层，形成在所述基板的一侧以埋置所述电子部件; 形成在所述基板的另一侧上并包括与所述电子部件的连接端子连接的连接图案的第一电路层; 以及形成在所述绝缘材料层上的第二电路层。 印刷电路板的优点在于可以通过调节绝缘层或绝缘材料的厚度，热膨胀系数和弹性模量来防止其翘曲并确保电子部件和电路层之间的电连接的可靠性。

公开(公告)号：US20110259630A1

公开(公告)日：2011-10-27

申请号：US12841809

申请日：2010-07-22

申请人： Jin Seon PARK

发明人： Jin Seon PARK

IPC分类号： H05K1/16 ,  H05K3/32

CPC分类号： H05K1/185 ,  H01L21/4846 ,  H01L23/13 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/5389 ,  H01L24/24 ,  H01L2224/18 ,  H05K3/4602 ,  H05K2201/10674 ,  H05K2203/0191 ,  Y10T29/4913 ,  Y10T29/49139 ,  Y10T29/49146 ,  Y10T29/49155

摘要： Disclosed herein is a printed circuit board, including: a substrate including an insulation layer in which a cavity is formed; an electronic component mounted in the cavity of the substrate and having connection terminals; an insulation material layer formed on one side of the substrate to bury the electronic component; a first circuit layer formed on the other side of the substrate and including a connection pattern connecting with the connection terminals of the electronic component; and a second circuit layer formed on the insulation material layer. The printed circuit board is advantageous in that it can prevent the warpage thereof and ensure the reliability of electrical connection between an electronic component and a circuit layer by adjusting the thickness, thermal expansion coefficient and elastic modulus of insulation layer or the insulating material.

摘要翻译： 本文公开了一种印刷电路板，包括：基板，包括其中形成空腔的绝缘层; 安装在基板的空腔中并具有连接端子的电子部件; 绝缘材料层，形成在所述基板的一侧以埋置所述电子部件; 形成在所述基板的另一侧上并包括与所述电子部件的连接端子连接的连接图案的第一电路层; 以及形成在所述绝缘材料层上的第二电路层。 印刷电路板的优点在于可以通过调节绝缘层或绝缘材料的厚度，热膨胀系数和弹性模量来防止其翘曲并确保电子部件和电路层之间的电连接的可靠性。

公开(公告)号：US20120075818A1

公开(公告)日：2012-03-29

申请号：US12972355

申请日：2010-12-17

申请人： Sang Chul LEE ,  Jung Soo BYUN ,  Jin Seon PARK ,  Doo Hwan LEE

发明人： Sang Chul LEE ,  Jung Soo BYUN ,  Jin Seon PARK ,  Doo Hwan LEE

IPC分类号： H05K1/18 ,  B32B37/22

CPC分类号： H05K1/185 ,  H01L21/568 ,  H01L24/24 ,  H01L24/96 ,  H01L2224/04105 ,  H01L2224/24137 ,  H01L2224/24227 ,  H01L2224/32145 ,  H01L2224/73267 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/14 ,  H01L2924/3511 ,  H05K3/4652 ,  H05K2203/063 ,  H05K2203/1469 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49155 ,  H01L2924/00

摘要： Disclosed is an embedded printed circuit board, in which electronic devices having different thicknesses can be embedded together, thus achieving highly dense electronic devices, and when electronic devices having considerably different thicknesses are embedded, two electronic devices which are comparatively thinner can be embedded in a perpendicular direction, thus reducing an embedding area and suppressing warping of the printed circuit board, and an insulating member the thickness of which is variably adjusted is interposed between base substrates, so that spaces between the electronic devices are completely filled therewith, thus solving the problem of void defects, resulting in reliable printed circuit boards, and, when a base substrate includes a core made of metal, the printed circuit board can less warp. Also a method of manufacturing the embedded printed circuit board is provided.

摘要翻译： 公开了一种嵌入式印刷电路板，其中可以将具有不同厚度的电子器件嵌入到一起，从而实现高密度电子器件，并且当嵌入具有相当不同厚度的电子器件时，可以将相对较薄的两个电子器件嵌入 垂直方向，从而减少了嵌入区域并抑制了印刷电路板的翘曲，并且将其厚度可变地调节的绝缘构件插入在基底之间，使得电子器件之间的空间被完全填充，从而解决了问题 的空隙缺陷，导致可靠的印刷电路板，并且当基底包括由金属制成的芯时，印刷电路板可以较少翘曲。 还提供了一种制造嵌入式印刷电路板的方法。

公开(公告)号：US20120073747A1

公开(公告)日：2012-03-29

申请号：US13214009

申请日：2011-08-19

申请人： Sang Chul LEE ,  Jung Soo BYUN ,  Jin Seon PARK ,  Doo Hwan LEE

发明人： Sang Chul LEE ,  Jung Soo BYUN ,  Jin Seon PARK ,  Doo Hwan LEE

IPC分类号： B32B37/00

CPC分类号： H05K1/185 ,  H01L21/568 ,  H01L24/24 ,  H01L24/96 ,  H01L2224/04105 ,  H01L2224/24137 ,  H01L2224/24227 ,  H01L2224/32145 ,  H01L2224/73267 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/14 ,  H01L2924/3511 ,  H05K3/4652 ,  H05K2203/063 ,  H05K2203/1469 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49155 ,  H01L2924/00

摘要： Disclosed is an embedded printed circuit board, in which electronic devices having different thicknesses can be embedded together, thus achieving highly dense electronic devices, and when electronic devices having considerably different thicknesses are embedded, two electronic devices which are comparatively thinner can be embedded in a perpendicular direction, thus reducing an embedding area and suppressing warping of the printed circuit board, and an insulating member the thickness of which is variably adjusted is interposed between base substrates, so that spaces between the electronic devices are completely filled therewith, thus solving the problem of void defects, resulting in reliable printed circuit boards, and, when a base substrate includes a core made of metal, the printed circuit board can less warp. Also a method of manufacturing the embedded printed circuit board is provided.