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公开(公告)号:US20120073747A1
公开(公告)日:2012-03-29
申请号:US13214009
申请日:2011-08-19
申请人: Sang Chul LEE , Jung Soo BYUN , Jin Seon PARK , Doo Hwan LEE
发明人: Sang Chul LEE , Jung Soo BYUN , Jin Seon PARK , Doo Hwan LEE
IPC分类号: B32B37/00
CPC分类号: H05K1/185 , H01L21/568 , H01L24/24 , H01L24/96 , H01L2224/04105 , H01L2224/24137 , H01L2224/24227 , H01L2224/32145 , H01L2224/73267 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/14 , H01L2924/3511 , H05K3/4652 , H05K2203/063 , H05K2203/1469 , Y10T29/49126 , Y10T29/4913 , Y10T29/49146 , Y10T29/49155 , H01L2924/00
摘要: Disclosed is an embedded printed circuit board, in which electronic devices having different thicknesses can be embedded together, thus achieving highly dense electronic devices, and when electronic devices having considerably different thicknesses are embedded, two electronic devices which are comparatively thinner can be embedded in a perpendicular direction, thus reducing an embedding area and suppressing warping of the printed circuit board, and an insulating member the thickness of which is variably adjusted is interposed between base substrates, so that spaces between the electronic devices are completely filled therewith, thus solving the problem of void defects, resulting in reliable printed circuit boards, and, when a base substrate includes a core made of metal, the printed circuit board can less warp. Also a method of manufacturing the embedded printed circuit board is provided.
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公开(公告)号:US20120075818A1
公开(公告)日:2012-03-29
申请号:US12972355
申请日:2010-12-17
申请人: Sang Chul LEE , Jung Soo BYUN , Jin Seon PARK , Doo Hwan LEE
发明人: Sang Chul LEE , Jung Soo BYUN , Jin Seon PARK , Doo Hwan LEE
CPC分类号: H05K1/185 , H01L21/568 , H01L24/24 , H01L24/96 , H01L2224/04105 , H01L2224/24137 , H01L2224/24227 , H01L2224/32145 , H01L2224/73267 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/14 , H01L2924/3511 , H05K3/4652 , H05K2203/063 , H05K2203/1469 , Y10T29/49126 , Y10T29/4913 , Y10T29/49146 , Y10T29/49155 , H01L2924/00
摘要: Disclosed is an embedded printed circuit board, in which electronic devices having different thicknesses can be embedded together, thus achieving highly dense electronic devices, and when electronic devices having considerably different thicknesses are embedded, two electronic devices which are comparatively thinner can be embedded in a perpendicular direction, thus reducing an embedding area and suppressing warping of the printed circuit board, and an insulating member the thickness of which is variably adjusted is interposed between base substrates, so that spaces between the electronic devices are completely filled therewith, thus solving the problem of void defects, resulting in reliable printed circuit boards, and, when a base substrate includes a core made of metal, the printed circuit board can less warp. Also a method of manufacturing the embedded printed circuit board is provided.
摘要翻译: 公开了一种嵌入式印刷电路板,其中可以将具有不同厚度的电子器件嵌入到一起,从而实现高密度电子器件,并且当嵌入具有相当不同厚度的电子器件时,可以将相对较薄的两个电子器件嵌入 垂直方向,从而减少了嵌入区域并抑制了印刷电路板的翘曲,并且将其厚度可变地调节的绝缘构件插入在基底之间,使得电子器件之间的空间被完全填充,从而解决了问题 的空隙缺陷,导致可靠的印刷电路板,并且当基底包括由金属制成的芯时,印刷电路板可以较少翘曲。 还提供了一种制造嵌入式印刷电路板的方法。
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公开(公告)号:US20130119553A1
公开(公告)日:2013-05-16
申请号:US13438483
申请日:2012-04-03
申请人: Tae Sung JEONG , Jung Soo BYUN , Yul Kyo CHUNG , Doo Hwan LEE
发明人: Tae Sung JEONG , Jung Soo BYUN , Yul Kyo CHUNG , Doo Hwan LEE
IPC分类号: H01L23/498 , H01L21/78
CPC分类号: H01L29/0657 , H01L23/13 , H01L23/5389 , H01L24/19 , H01L24/20 , H01L2224/21 , H01L2224/211 , H01L2224/214 , H01L2924/10155 , H01L2924/12042 , H01L2924/15156 , H05K1/185 , H05K3/4602 , H05K2201/09827 , H01L2924/00
摘要: Disclosed herein is a semiconductor package including an electrical device having a first lateral surface; and a core substrate including a cavity in which the electrical device is positioned, wherein the core substrate is inclined in a thickness direction of the core substrate and has a second lateral surface that defines the cavity.
摘要翻译: 本文公开了一种半导体封装,其包括具有第一侧表面的电气装置; 以及包括其中定位所述电气装置的空腔的芯基板,其中所述芯基板在所述芯基板的厚度方向上倾斜并且具有限定所述空腔的第二侧表面。
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