公开(公告)号：US20120075818A1

公开(公告)日：2012-03-29

申请号：US12972355

申请日：2010-12-17

申请人： Sang Chul LEE ,  Jung Soo BYUN ,  Jin Seon PARK ,  Doo Hwan LEE

发明人： Sang Chul LEE ,  Jung Soo BYUN ,  Jin Seon PARK ,  Doo Hwan LEE

IPC分类号： H05K1/18 ,  B32B37/22

CPC分类号： H05K1/185 ,  H01L21/568 ,  H01L24/24 ,  H01L24/96 ,  H01L2224/04105 ,  H01L2224/24137 ,  H01L2224/24227 ,  H01L2224/32145 ,  H01L2224/73267 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/14 ,  H01L2924/3511 ,  H05K3/4652 ,  H05K2203/063 ,  H05K2203/1469 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49155 ,  H01L2924/00

摘要： Disclosed is an embedded printed circuit board, in which electronic devices having different thicknesses can be embedded together, thus achieving highly dense electronic devices, and when electronic devices having considerably different thicknesses are embedded, two electronic devices which are comparatively thinner can be embedded in a perpendicular direction, thus reducing an embedding area and suppressing warping of the printed circuit board, and an insulating member the thickness of which is variably adjusted is interposed between base substrates, so that spaces between the electronic devices are completely filled therewith, thus solving the problem of void defects, resulting in reliable printed circuit boards, and, when a base substrate includes a core made of metal, the printed circuit board can less warp. Also a method of manufacturing the embedded printed circuit board is provided.

摘要翻译： 公开了一种嵌入式印刷电路板，其中可以将具有不同厚度的电子器件嵌入到一起，从而实现高密度电子器件，并且当嵌入具有相当不同厚度的电子器件时，可以将相对较薄的两个电子器件嵌入 垂直方向，从而减少了嵌入区域并抑制了印刷电路板的翘曲，并且将其厚度可变地调节的绝缘构件插入在基底之间，使得电子器件之间的空间被完全填充，从而解决了问题 的空隙缺陷，导致可靠的印刷电路板，并且当基底包括由金属制成的芯时，印刷电路板可以较少翘曲。 还提供了一种制造嵌入式印刷电路板的方法。

公开(公告)号：US20120073747A1

公开(公告)日：2012-03-29

申请号：US13214009

申请日：2011-08-19

申请人： Sang Chul LEE ,  Jung Soo BYUN ,  Jin Seon PARK ,  Doo Hwan LEE

发明人： Sang Chul LEE ,  Jung Soo BYUN ,  Jin Seon PARK ,  Doo Hwan LEE

IPC分类号： B32B37/00

CPC分类号： H05K1/185 ,  H01L21/568 ,  H01L24/24 ,  H01L24/96 ,  H01L2224/04105 ,  H01L2224/24137 ,  H01L2224/24227 ,  H01L2224/32145 ,  H01L2224/73267 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/14 ,  H01L2924/3511 ,  H05K3/4652 ,  H05K2203/063 ,  H05K2203/1469 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49155 ,  H01L2924/00

摘要： Disclosed is an embedded printed circuit board, in which electronic devices having different thicknesses can be embedded together, thus achieving highly dense electronic devices, and when electronic devices having considerably different thicknesses are embedded, two electronic devices which are comparatively thinner can be embedded in a perpendicular direction, thus reducing an embedding area and suppressing warping of the printed circuit board, and an insulating member the thickness of which is variably adjusted is interposed between base substrates, so that spaces between the electronic devices are completely filled therewith, thus solving the problem of void defects, resulting in reliable printed circuit boards, and, when a base substrate includes a core made of metal, the printed circuit board can less warp. Also a method of manufacturing the embedded printed circuit board is provided.

公开(公告)号：US20130119553A1

公开(公告)日：2013-05-16

申请号：US13438483

申请日：2012-04-03

申请人： Tae Sung JEONG ,  Jung Soo BYUN ,  Yul Kyo CHUNG ,  Doo Hwan LEE

发明人： Tae Sung JEONG ,  Jung Soo BYUN ,  Yul Kyo CHUNG ,  Doo Hwan LEE

IPC分类号： H01L23/498 ,  H01L21/78

CPC分类号： H01L29/0657 ,  H01L23/13 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/20 ,  H01L2224/21 ,  H01L2224/211 ,  H01L2224/214 ,  H01L2924/10155 ,  H01L2924/12042 ,  H01L2924/15156 ,  H05K1/185 ,  H05K3/4602 ,  H05K2201/09827 ,  H01L2924/00

摘要： Disclosed herein is a semiconductor package including an electrical device having a first lateral surface; and a core substrate including a cavity in which the electrical device is positioned, wherein the core substrate is inclined in a thickness direction of the core substrate and has a second lateral surface that defines the cavity.

摘要翻译： 本文公开了一种半导体封装，其包括具有第一侧表面的电气装置; 以及包括其中定位所述电气装置的空腔的芯基板，其中所述芯基板在所述芯基板的厚度方向上倾斜并且具有限定所述空腔的第二侧表面。

公开(公告)号：US20120160550A1

公开(公告)日：2012-06-28

申请号：US13252777

申请日：2011-10-04

申请人： Tae Sung JEONG ,  Doo Hwan LEE ,  Seung Eun LEE

发明人： Tae Sung JEONG ,  Doo Hwan LEE ,  Seung Eun LEE

IPC分类号： H05K1/09 ,  H05K1/16 ,  H05K1/02 ,  H05K3/30

CPC分类号： H05K1/185 ,  H01L23/5389 ,  H01L24/19 ,  H01L2224/04105 ,  H05K2201/0355 ,  H05K2201/10674 ,  H05K2203/0152 ,  H05K2203/063 ,  H05K2203/1152 ,  H05K2203/1189 ,  H05K2203/1469 ,  Y10T29/4913

摘要： Disclosed is a printed circuit board having an embedded electronic component, which includes a first insulating layer, an electronic component disposed in an opening formed in a thickness direction of the first insulating layer and having a metal bump, a polymer layer formed on one side of the first insulating layer and on which the electronic component is seated so that the metal bump of the electronic component perforates the polymer layer, a second insulating layer formed on the other side of the first insulating layer so as to embed the electronic component, a first circuit layer formed on the second insulating layer, and a second circuit layer formed on the polymer layer so as to be directly electrically connected to the metal bump that perforates the polymer layer, and in which roughness is formed on the polymer layer so that the force of adhesion of the polymer layer to a plating layer is enhanced, thus ensuring reliability of the electrical connection of a circuit layer which is subsequently formed.

摘要翻译： 公开了一种具有嵌入式电子部件的印刷电路板，其包括第一绝缘层，设置在沿第一绝缘层的厚度方向形成的开口中并具有金属凸块的电子部件，形成在第一绝缘层的一侧的聚合物层 第一绝缘层，并且电子部件就座于其上，使得电子部件的金属凸块穿透聚合物层;第二绝缘层，形成在第一绝缘层的另一侧上以嵌入电子部件;第一绝缘层， 形成在第二绝缘层上的电路层和形成在聚合物层上的第二电路层，以直接电连接到穿透聚合物层的金属凸块，并且在聚合物层上形成粗糙度，使得力 增强了聚合物层对镀层的粘附性，从而确保电路层的电连接的可靠性， 随后形成。

公开(公告)号：US20130081863A1

公开(公告)日：2013-04-04

申请号：US13607971

申请日：2012-09-10

申请人： Doo Hwan LEE ,  Tae Sung JEONG ,  Jin Won LEE ,  Moon Il KIM

发明人： Doo Hwan LEE ,  Tae Sung JEONG ,  Jin Won LEE ,  Moon Il KIM

IPC分类号： H05K1/16 ,  H05K3/10 ,  H05K1/09

CPC分类号： H01L23/5389 ,  H01L21/568 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/04105 ,  H01L2224/24195 ,  H01L2924/12042 ,  H05K1/188 ,  H05K3/4602 ,  H05K2201/10674 ,  H05K2203/308 ,  Y10T156/1052 ,  Y10T156/1082 ,  H01L2924/00

摘要： Provided are a substrate with built-in electronic component and a method for manufacturing the same. The method for manufacturing a substrate with built-in electronic component includes: forming conductive temporary bumps which penetrate and protrude through a prepreg sheet; mounting and attaching an electronic component on the protruding temporary bumps; forming an embedded substrate by laminating other prepreg sheet on the attached electronic component layer, laminating a metal sheet on a bottom of a laminate or on a bottom and top of the laminate, and pressing the prepreg sheets and the metal sheet; forming contact grooves by removing partial regions of the metal sheet and by removing the temporary bumps exposed by the removal of the metal sheet regions; and filling the contact grooves with a conductive metal and forming a circuit pattern.

摘要翻译： 提供了具有内置电子部件的基板及其制造方法。 用于制造具有内置电子部件的基板的方法包括：形成穿透并突出穿过预浸片的导电性临时凸块; 在突出的临时凸块上安装和附接电子部件; 通过将附着的电子元件层上的其它预浸渍片层叠在一起形成嵌入式基板，在层叠体的底部或层叠体的底部和顶部层压金属片，并且对预浸料片和金属片进行加压; 通过去除金属片的部分区域并且通过去除通过去除金属片区域暴露的临时凸块来形成接触槽; 并用导电金属填充接触槽并形成电路图案。

公开(公告)号：US20110287807A1

公开(公告)日：2011-11-24

申请号：US13050289

申请日：2011-03-17

申请人： Ho Jin JUNG ,  Doo Hwan LEE ,  Seon Jun KIM ,  Young Hak PARK

发明人： Ho Jin JUNG ,  Doo Hwan LEE ,  Seon Jun KIM ,  Young Hak PARK

IPC分类号： H04M1/00

CPC分类号： H04B1/0064 ,  H04B1/3805 ,  H04B1/3816 ,  H04B1/401 ,  H04W88/06

摘要： A communication method and apparatus of a dual standby mode mobile terminal for improving the emission performance are provided. The mobile terminal includes a master switch for connecting a master antenna to a master Radio Frequency (RF) unit for communication with a first network, a slave switch for connecting a slave antenna to a slave RF unit for communication with a second network, a slave control unit for controlling communication with the second network and for detecting attachment of a slave Subscriber Identity Module (SIM), and a master control unit for controlling communication with the first network, for detecting attachment of a master SIM, and for controlling the master and slave switches to establish/release either the connection between the master antenna and the master RF unit or the connection between the slave antenna and the slave RF unit.

摘要翻译： 提供了一种用于提高排放性能的双待机模式移动终端的通信方法和装置。 移动终端包括用于将主天线连接到用于与第一网络通信的主射频（RF）单元的主开关，用于将从天线连接到用于与第二网络通信的从RF单元的从设备开关，从站 控制单元，用于控制与第二网络的通信并且用于检测从用户识别模块（SIM）的附接;以及主控制单元，用于控制与第一网络的通信，用于检测主SIM卡的附件，以及用于控制主站和 从站交换机建立/释放主天线和主RF单元之间的连接或从天线和从RF单元之间的连接。

公开(公告)号：US20120061833A1

公开(公告)日：2012-03-15

申请号：US12972310

申请日：2010-12-17

申请人： Tae Sung JEONG ,  Doo Hwan LEE ,  Seung Eun LEE

发明人： Tae Sung JEONG ,  Doo Hwan LEE ,  Seung Eun LEE

IPC分类号： H01L23/485 ,  H01L21/60

CPC分类号： H01L24/11 ,  H01L23/49827 ,  H01L23/5389 ,  H01L24/32 ,  H01L24/48 ,  H01L24/83 ,  H01L24/85 ,  H01L24/92 ,  H01L2224/2919 ,  H01L2224/32155 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/83001 ,  H01L2224/838 ,  H01L2224/85 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： Disclosed herein are an embedded ball grid array substrate and a manufacturing method thereof. The embedded ball grid array includes: a core layer having a cavity therein; a semiconductor device embedded in the cavity of the core layer; a first circuit layer having a circuit pattern including a wire bonding pad formed thereon; a second circuit layer having a circuit pattern including a solder ball pattern formed thereon; and a wire electrically connecting the semiconductor device to the wire bonding pad.

摘要翻译： 本文公开了嵌入式球栅阵列基板及其制造方法。 嵌入式球栅阵列包括：其中具有空腔的芯层; 嵌入在芯层的空腔中的半导体器件; 第一电路层，具有包括在其上形成的引线接合焊盘的电路图案; 第二电路层，其具有包括形成在其上的焊球图案的电路图案; 以及将半导体器件电连接到引线接合焊盘的线。