公开(公告)号：US5041519A

公开(公告)日：1991-08-20

申请号：US281069

申请日：1988-12-08

Applicant: Jing-Pin Pan ,  Ker-Ming Chen

Inventor： Jing-Pin Pan ,  Ker-Ming Chen

IPC: C08G59/40 ,  C08G59/56 ,  C08L63/00 ,  H05K1/03

CPC classification number: H05K1/0346 ,  C08G59/4042 ,  C08G59/56 ,  C08L63/00

Abstract: This invention relates to a resin composition which is used for the production of printed circuit boards. The feature of said resin composition is to add barbituric acid or its derivatives to a bismaleimide resin, and mixed in a solvent or solvent system. The mixture is then added with epoxy resin and suitable amount of curing agent to form the required resin composition. The resin composition has high glass transition temperature and good toughness and other physical and electrical properties. Meanwhile, it would not cause phase separation, so is a high-performance material for the production of printed circuit boards.

Abstract translation: 本发明涉及一种用于生产印刷电路板的树脂组合物。 所述树脂组合物的特征是将巴比妥酸或其衍生物加入到双马来酰亚胺树脂中，并在溶剂或溶剂体系中混合。 然后将混合物加入环氧树脂和适量的固化剂以形成所需的树脂组合物。 树脂组合物具有高玻璃化转变温度和良好的韧性等物理和电学性能。 同时，不会导致相分离，因此用于生产印刷电路板的高性能材料也是如此。

公开(公告)号：US5326794A

公开(公告)日：1994-07-05

申请号：US911692

申请日：1992-07-10

Applicant: Jing-Pin Pan ,  Chuen-Chyr Chen ,  Gwo-Yuh Shiau ,  Ker-Ming Chen

Inventor： Jing-Pin Pan ,  Chuen-Chyr Chen ,  Gwo-Yuh Shiau ,  Ker-Ming Chen

IPC: C08L63/00 ,  C08L79/08 ,  H05K1/03 ,  C08L63/02 ,  C08K5/07 ,  C08L63/04 ,  C08L63/06

CPC classification number: H05K1/0353 ,  C08L63/00 ,  C08L79/085

Abstract: A process for manufacturing a high glass transition temperature printed circuit board comprising blending a modified bismaleimide resin into a modified epoxy resin is disclosed. Particularly the material is manufactured by blending a bismaleimide resin reacted with barbituric acid and its derivative thereof and an epoxy resin with an oxazolidone ring resulting from the reaction of a polyisocyanate and an epoxy resin modified with a secondary diamine and followed by curing. The resultant product has a high glass transition temperature, a good adhesion, flame retardancy, and a low bromine content.

Abstract translation: 公开了一种制造高玻璃化转变温度印刷电路板的方法，其包括将改性双马来酰亚胺树脂掺混到改性环氧树脂中。 特别地，该材料通过将与巴比妥酸及其衍生物反应的双马来酰亚胺树脂与环氧树脂与由多异氰酸酯和经二胺改性的环氧树脂反应得到的恶唑烷酮环并随后固化而制得。 所得产物具有高玻璃化转变温度，良好的粘合性，阻燃性和低溴含量。

公开(公告)号：US5342736A

公开(公告)日：1994-08-30

申请号：US821632

申请日：1992-01-16

Applicant: Ker-Ming Chen ,  Tsung-Hsiung Wang ,  Shing-Shing King ,  Tzong-Ming Lee

Inventor： Ker-Ming Chen ,  Tsung-Hsiung Wang ,  Shing-Shing King ,  Tzong-Ming Lee

IPC: H05K1/00 ,  H05K1/03 ,  H05K3/00 ,  H05K3/46 ,  G03C1/93

CPC classification number: H05K3/002 ,  H05K1/0346 ,  H05K2201/0166 ,  H05K2201/0195 ,  H05K2201/09845 ,  H05K3/4644 ,  H05K3/4676

Abstract: A method of wet etching of polyimide comprising the steps of(a) cleaning a substrate for coating;(b) coating a polyamic acid varnish onto said cleaned substrate;(c) thermal curing the varnish in (b) to form a polyimide layer on the substrate;(d) coating a polyamide-imide varnish onto the layer in (c);(e) curing the varnish in (d),(f) coating a layer of photoresist onto the coated substrate;(g) masked exposing;(h) image developing on said substrate; and(i) wet etching the unprotected portion in the layers of polyimide and polyamide-imide to form a staircase pattern on the substrate.

Abstract translation: 一种湿法蚀刻聚酰亚胺的方法，包括以下步骤：（a）清洗用于涂布的基材; （b）将聚酰胺酸清漆涂布在所述清洁的基材上; （c）（b）中的清漆热固化以在基材上形成聚酰亚胺层; （d）在（c）中的层上涂布聚酰胺 - 酰亚胺清漆; （e）在（d）中固化清漆，（f）将一层光致抗蚀剂涂覆在涂覆的基材上; （g）屏蔽曝光; （h）在所述衬底上显影; 和（i）湿式蚀刻聚酰亚胺和聚酰胺 - 酰亚胺层中的未保护部分以在基材上形成阶梯图案。

公开(公告)号：US5112926A

公开(公告)日：1992-05-12

申请号：US682407

申请日：1991-04-08

Applicant: Tzong-Ming Lee ,  Ker-Ming Chen

Inventor： Tzong-Ming Lee ,  Ker-Ming Chen

IPC: C08G59/06 ,  C08G59/10 ,  C08G59/32 ,  C08G59/38 ,  C08L63/00 ,  H05K1/03

CPC classification number: H05K1/0346 ,  C08G59/066 ,  C08G59/10 ,  C08G59/3245 ,  C08G59/38 ,  C08L63/00 ,  H05K1/0326 ,  H05K1/0333 ,  H05K1/034

Abstract: This invention provides a epoxy resin composition for structual substrate of PCB comprising a triazine-modified bisphenol A epoxy resin reacted with a multi-functional epoxy resin, a brominated epoxy resin, a curing agent and a curing promoter to form a cured product with excellent thermal resistance (Tg is about 170.degree.-220.degree. C. and mostly higher than 180.degree. C.) as well as good drilling properties and good toughness.Besides, it has comparable electrical and physical properties as the commercially available FR-4 printed circuit boards.

Abstract translation: 本发明提供了一种用于PCB的结构基材的环氧树脂组合物，其包含与多官能环氧树脂反应的三嗪改性双酚A环氧树脂，溴化环氧树脂，固化剂和固化促进剂，以形成具有优异热稳定性的固化产物 电阻（Tg约为170°-220℃，大部分高于180℃），钻井性能好，韧性好。 此外，它具有与市售的FR-4印刷电路板相当的电气和物理性能。

公开(公告)号：US5217599A

公开(公告)日：1993-06-08

申请号：US790260

申请日：1991-11-08

Applicant: Ker-Ming Chen ,  Syh-Ming Ho ,  Tsung-Hsiung Wang ,  Richard P. Cheng ,  Aina Hung

Inventor： Ker-Ming Chen ,  Syh-Ming Ho ,  Tsung-Hsiung Wang ,  Richard P. Cheng ,  Aina Hung

IPC: B32B15/08 ,  C25D3/02 ,  H05K1/03 ,  H05K3/38

CPC classification number: B32B15/08 ,  C25D3/02 ,  H05K1/0346 ,  H05K3/384 ,  H05K2201/0154 ,  H05K2201/0212 ,  H05K2201/0355 ,  H05K2201/2063 ,  H05K2203/0723

Abstract: Disclosed is a method for electroplating a metal sheet adapted for being used in electronic packaging material, such as printed circuit boards. Bismaleimide and its derivative are added into the plated solution so as to form insoluble particles of bismaleimide and its derivatives on the surface of the metal sheet. The resulting metal sheet is particularly adapted for being bonded to a polyimide film for the preparation of, for example, a printed circuit board. Also disclosed is a method of bonding the metal sheet of the present invention to a polyimide substrate. Precursor of polyimide are coated on the surface of the plate metal sheet and then thermal imidizing of the precursors takes place. No additional adhesives are needed for this bonding.

Abstract translation: 公开了一种适用于电子封装材料如印刷电路板的金属片的电镀方法。 将双马来酰亚胺及其衍生物加入到镀液中，以在金属片的表面上形成双马来酰亚胺及其衍生物的不溶性颗粒。 所得到的金属片材特别适用于与用于制备例如印刷电路板的聚酰亚胺膜结合。 还公开了将本发明的金属板粘合到聚酰亚胺基板上的方法。 将聚酰亚胺的前体涂布在板金属片的表面上，然后进行前体的热亚胺化。 这种粘合不需要额外的粘合剂。

公开(公告)号：US5130407A

公开(公告)日：1992-07-14

申请号：US643711

申请日：1991-01-18

Applicant: Tzong-Ming Lee ,  Ker-Ming Chen

Inventor： Tzong-Ming Lee ,  Ker-Ming Chen

IPC: C08G59/10 ,  C08G59/26 ,  C08G59/38 ,  H05K1/03

CPC classification number: C08G59/10 ,  C08G59/26 ,  C08G59/38 ,  H05K1/0326

Abstract: A modified epoxy resin composition for use in making a printed circuit board comprising: (1) a modified epoxy resin obtained by reacting (a) a low molecular weight epoxy resin having at least two epoxy groups which has the following formula, ##STR1## (b) an N-heterocyclic fatty amino chain-extending agent at least two active hydrogen atoms and represented by the formulas, ##STR2## and (c) at least one catalyst for catalyzing the reaction between components (a) and (b).

Abstract translation: 一种用于制造印刷电路板的改性环氧树脂组合物，包括：（1）通过使（a）具有下式的至少两个环氧基的低分子量环氧树脂，（IMAGE）+ （b）至少两个活性氢原子并由下式表示的N-杂环脂肪氨基增量剂，（c）至少一种用于催化组分（a）和 （b）。

公开(公告)号：US5414059A

公开(公告)日：1995-05-09

申请号：US905046

申请日：1992-06-25

Applicant: Chuen-Chyr Chen ,  Ker-Ming Chen

Inventor： Chuen-Chyr Chen ,  Ker-Ming Chen

IPC: C08G18/58 ,  C08G59/56 ,  H05K1/03 ,  C08G59/14 ,  C08K5/07 ,  C08L63/02 ,  C08L63/04

CPC classification number: H05K1/034 ,  C08G18/584 ,  C08G59/56

Abstract: A resinous material for the manufacture of printed circuit boards is obtained by (a) treating a mixture of bromine- and nonbromine-containing epoxy resins with a secondary diamine such as 5,5-dimethyl hydantion or barbituric acid in the presence of a tertiary amine catalyst to form a modified epoxy resin; (b) heating the modified epoxy resin and a polyisocyanate in the presence of an encyclization catalyst; and (c) dissolving the resulting product in a solvent with a curing agent to form a B-stage prepreg varnish.

Abstract translation: 通过（a）在叔胺存在下处理含溴和非溴的环氧树脂与二胺如5,5-二甲基水合或巴比妥酸的混合物获得用于制造印刷电路板的树脂材料 催化剂形成改性环氧树脂; （b）在环化催化剂存在下加热改性环氧树脂和多异氰酸酯; 和（c）将所得产物用固化剂溶解在溶剂中以形成B阶预浸料清漆。

公开(公告)号：US5006615A

公开(公告)日：1991-04-09

申请号：US538904

申请日：1990-06-15

Applicant: Tzong-Ming Lee ,  Ker-Ming Chen

Inventor： Tzong-Ming Lee ,  Ker-Ming Chen

IPC: C08G59/10 ,  C08G59/26 ,  C08G59/38 ,  H05K1/03

CPC classification number: C08G59/26 ,  C08G59/10 ,  C08G59/38 ,  H05K1/0326

Abstract: A modified epoxy resin composition for use in making a printed circuit board comprising: (1) a modified epoxy resin obtained by reacting (a) a low molecular weight epoxy resin having at least two epoxy groups which have the following formula, ##STR1## (b) a mono-nucleus chain extending agent containing N-heterocyclic fatty groups and at least two active hydrogen atoms and represented by the formulas, ##STR2## and (c) at least one catalyst for catalyzing the reaction between components (a) and (b).

Abstract translation: 一种用于制造印刷电路板的改性环氧树脂组合物，包括：（1）通过使（a）具有下式的至少两个环氧基的低分子量环氧树脂，（a）具有下式的 （b）包含N-杂环脂肪基团和至少两个活性氢原子并由下式表示的单核链增长剂，（IMA）和（c）至少一种催化组分之间的反应的催化剂（a ）和（b）。