SEMICONDUCTOR CHIP AND METHOD FOR GENERATING PULSE EDGES, ASSIGNED SYNCHRONOUSLY TO THE MOVEMENT OF A MECHANICAL PART
    1.
    发明申请
    SEMICONDUCTOR CHIP AND METHOD FOR GENERATING PULSE EDGES, ASSIGNED SYNCHRONOUSLY TO THE MOVEMENT OF A MECHANICAL PART 有权
    用于产生脉冲边缘的半导体芯片和方法,与机械部件的运动同步分配

    公开(公告)号:US20110291650A1

    公开(公告)日:2011-12-01

    申请号:US13117668

    申请日:2011-05-27

    IPC分类号: G01R33/06 G01R33/02

    CPC分类号: G01D5/145

    摘要: In a method for generating pulse edges, assigned synchronously to the movement of a mechanical part, a magnetic field is generated. At least two measuring signals phase-shifted to one another for the magnetic field are detected. The magnetic field is changed as a function of the movement of the mechanical part in such a way that the measuring signals are modulated. A first measuring signal is compared with at least one first reference value. A second measuring signal is compared with at least one second reference value and/or the value of the first measuring signal is compared with the value of the second measuring signal. When at least one of these comparisons produces an agreement or the result of the relevant comparison changes its sign, a pulse edge is generated.

    摘要翻译: 在用于产生与机械部件的运动同步地分配的脉冲边缘的方法中,产生磁场。 检测到相对于磁场相移的至少两个测量信号。 作为机械部件的移动的函数,磁场以测量信号被调制的方式改变。 将第一测量信号与至少一个第一参考值进行比较。 将第二测量信号与至少一个第二参考值进行比较,和/或将第一测量信号的值与第二测量信号的值进行比较。 当这些比较中的至少一个产生协议或相关比较的结果改变其符号时,产生脉冲边缘。

    INTEGRATED CURRENT SENSOR
    2.
    发明申请
    INTEGRATED CURRENT SENSOR 有权
    集成电流传感器

    公开(公告)号:US20130015839A1

    公开(公告)日:2013-01-17

    申请号:US13548824

    申请日:2012-07-13

    申请人: Joerg FRANKE

    发明人: Joerg FRANKE

    IPC分类号: G01R19/00

    摘要: An integrated current sensor is provided, having a semiconductor body arranged on a metal substrate, having a first surface with a passivation layer embodied on the first surface and a magnetic field concentrator embodied in a flat manner under the semiconductor body, a first Hall-effect sensor embodied under the passivation layer in the semiconductor body, a second Hall-effect sensor embodied under the passivation layer in the semiconductor body, wherein a first conductor is provided embodied on the first surface between the first Hall-effect sensor and the second Hall-effect sensor, and the magnetic field concentrator is embodied under the first Hall-effect sensor and under the second Hall-effect sensor and under the first conductor.

    摘要翻译: 提供了一种集成电流传感器,其具有布置在金属基板上的半导体本体,具有在第一表面上具有钝化层的第一表面和在半导体本体下方以平坦方式体现的磁场聚光器,第一霍尔效应 传感器,其被实施在半导体主体内的钝化层下方,第二霍尔效应传感器被实施在半导体主体内的钝化层下方,其中第一导体被提供在第一霍尔效应传感器和第二霍尔效应传感器之间的第一表面上, 效应传感器,并且磁场集中器体现在第一霍尔效应传感器下面和第二霍尔效应传感器下方以及第一导体下。

    INTEGRATED PASSIVE COMPONENT
    3.
    发明申请
    INTEGRATED PASSIVE COMPONENT 有权
    集成被动组件

    公开(公告)号:US20120256283A1

    公开(公告)日:2012-10-11

    申请号:US13440567

    申请日:2012-04-05

    申请人: Joerg FRANKE

    发明人: Joerg FRANKE

    IPC分类号: H01L27/22

    摘要: An integrated passive component having a semiconductor body, arranged on a metal substrate and having a first surface, and a plurality of metal surfaces formed on the surface, and an integrated circuit formed on the surface of the semiconductor body, whereby the integrated circuit is connected by traces to the metal surfaces, and having a dielectric passivation layer formed on the surface, and the metal surfaces are connected to pins by bonding wires, and a first coil former, formed above the dielectric layer, with a winding, whereby the winding has a first connector and a second connector, and whereby the winding is formed as a wire or litz wire and the first connector of the winding is connected to a first metal surface and the second connector to a second metal surface.

    摘要翻译: 一种具有半导体本体的集成无源部件,配置在金属基板上,具有第一面,形成在该表面上的多个金属面,以及形成在半导体本体的表面上的集成电路,由此使该集成电路连接 通过轨迹到金属表面,并且具有形成在表面上的电介质钝化层,并且金属表面通过接合线连接到引脚,以及形成在电介质层上方的第一线圈形成器,其中绕组具有 第一连接器和第二连接器,并且由此绕组形成为线或绞合线,并且绕组的第一连接器连接到第一金属表面,而第二连接器连接到第二金属表面。

    INTEGRATED PASSIVE COMPONENT
    4.
    发明申请
    INTEGRATED PASSIVE COMPONENT 审中-公开
    集成被动组件

    公开(公告)号:US20120280341A1

    公开(公告)日:2012-11-08

    申请号:US13464304

    申请日:2012-05-04

    申请人: Joerg FRANKE

    发明人: Joerg FRANKE

    IPC分类号: H01L29/82

    摘要: An integrated passive component having a semiconductor body, arranged on a metal substrate and having a first surface, and a plurality of metal surfaces formed on the surface, a passivation layer formed on the surface, an integrated circuit formed near the surface of the semiconductor body, whereby the integrated circuit is connected to metal surfaces via traces formed below the passivation layer, a part of the metal surfaces is connected to pins via bonding wires, a first part of a first coil, the part formed in part above the semiconductor body, whereby the first coil with a plurality of turns has a longitudinal axis formed substantially parallel to the surface of the semiconductor body, and a second part of the first coil is formed below the semiconductor body.

    摘要翻译: 一种具有半导体本体的集成无源部件,其布置在金属基板上并具有第一表面,以及形成在该表面上的多个金属表面,形成在该表面上的钝化层,在该半导体本体的表面附近形成的集成电路 由此集成电路通过形成在钝化层下面的迹线连接到金属表面,金属表面的一部分通过接合线连接到引脚,第一线圈的第一部分,部分形成在半导体主体上方, 由此具有多个匝的第一线圈具有基本上平行于半导体本体的表面形成的纵向轴线,并且第一线圈的第二部分形成在半导体本体的下方。

    INTEGRATED PASSIVE COMPONENT
    5.
    发明申请
    INTEGRATED PASSIVE COMPONENT 有权
    集成被动组件

    公开(公告)号:US20120280342A1

    公开(公告)日:2012-11-08

    申请号:US13464327

    申请日:2012-05-04

    申请人: Joerg FRANKE

    发明人: Joerg FRANKE

    IPC分类号: H01L29/82

    摘要: An integrated passive component having a semiconductor body, arranged on a metal substrate and having a first surface, and a plurality of metal surfaces formed on the surface, a passivation layer formed on the surface, an integrated circuit formed near the surface of the semiconductor body, whereby the integrated circuit is connected to metal surfaces via traces formed below the passivation layer, a part of the metal surfaces is connected to pins via bonding wires, and a first coil formed above the passivation layer, whereby the first coil with a plurality of turns has a longitudinal axis formed substantially parallel to the surface of the semiconductor body, and in a lower part of the first coil, said part which is formed substantially parallel to the longitudinal axis of the coil on the surface of the semiconductor body, parts of a plurality of turns are formed as sections of traces.

    摘要翻译: 一种具有半导体本体的集成无源部件,其布置在金属基板上并具有第一表面,以及形成在该表面上的多个金属表面,形成在该表面上的钝化层,在该半导体本体的表面附近形成的集成电路 ,由此集成电路通过形成在钝化层下方的迹线连接到金属表面,金属表面的一部分通过接合线连接到引脚,以及形成在钝化层上方的第一线圈,由此第一线圈具有多个 匝具有基本上平行于半导体本体的表面形成的纵向轴线,并且在第一线圈的下部中,所述部分形成为基本上平行于半导体主体的表面上的线圈的纵向轴线, 多个匝形成为轨迹部分。