摘要:
A field emission source comprising a first conductive region, a layer of nanotubes deposited on the first conductive region, and a second conductive region placed over and spaced from the nanotube coated first conductive region. After the device structure is fabricated, a laser beam is used to dislodge one end of the nanotube from the first conductive surface and an electric field is simultaneously applied to point the freed end of the nanotube at the second conductive region.
摘要:
A field emission display (100) includes a cathode plate (110) having a plurality of electron emitters (114), an anode plate (122) having an anode (124) connected to a potential source (126), and an anode voltage pull-down circuit (127) having an input (106) and an output (104). Output (104) is connected to anode (124), and input (106) is connected to potential source (126). Preferably, anode voltage pull-down circuit (127) causes an anode voltage (120) at anode (124) to drop to about ground potential prior to generation of a discharge current by electron emitters (114) for neutralizing positively electrostatically charged surfaces (137, 138) within field emission display (100).
摘要:
A method for reducing charge accumulation in a field emission display (100) includes the steps of causing a plurality of electron emitters (114) to emit electrons (132) to reduce the potential at an anode (124) of the field emission display (100). Upon the reduction of the potential at the anode (124), the electrons (132) neutralize a positively electrostatically charged surface (129) of a spacer (130). The anode potential is dropped by providing a resistor (127) in series with a voltage source (126) connected to the anode (124). The anode potential is reduced by causing the electron emitters (114) to emit simultaneously to provide a pull-down current (128) at the anode (124). The voltage at the anode (124) is reduced to a value that causes a sufficient flux of electrons (132) to be attracted to the charged surfaces (129) for neutralizing them.
摘要:
A field emission display (100) includes a dielectric layer (132) having a plurality of emitter wells (134), a plurality of electron emitters (136) disposed one each within the plurality of emitter wells (134), a plurality of conductive rows (138, 140, 142) disposed on the dielectric layer (132) and having sacrificial portions (154), an ion shield (139) disposed on the dielectric layer (132) and spaced apart from the sacrificial portions (154) of the plurality of conductive rows (138, 140, 142), and an anode (121) opposing the plurality of electron emitters (136) and defining a projected area (122) at the plurality of conductive rows (138, 140, 142). The sacrificial portions (154) of the plurality of conductive rows (138, 140, 142) extend beyond the projected area (122) of the anode (121).
摘要:
A field emission device (100, 200) includes an anode (190); a substrate (110); a plurality of spaced apart cathodes (120); a dielectric layer (124) disposed on the cathodes (120); a plurality of spacer pads (130, 230) disposed on the substrate (110) between adjacent cathodes (120) and including a spacer contact layer (142, 185) that defines the surfaces of the spacer pads (130, 230); a spacer (150) having a first edge (157), a second edge (155), and a conductive layer (152) disposed on the second edge (155), the first edge (157) contacting the anode (190), the conductive layer (152) contacting the spacer contact layer (142, 185) at the spacer pads (130, 230); and an electron emitter (170) disposed within the dielectric layer (124) and spaced apart from the second edge (155) of the spacer (150).
摘要:
A field emission device (100) includes an electroplated structure (122) and an electron emitter (118). Electroplated structure (122) includes a base (124), which is disposed proximate to electron emitter (118) and is made from the same material from which electron emitter (118) is made. Electroplated structure (122) further includes an electroplating electrode (126), which is disposed on base (124), and an electroplated layer (128), which is disposed on electroplating electrode (126). A method for fabricating field emission device (100) includes a step of forming electron emitter (118) and further includes a step of forming base (124) during the step of forming electron emitter (118). The method further includes a step of completely encapsulating electron emitter (118) prior to a step of forming electroplated layer (128).