公开(公告)号：US06762510B2

公开(公告)日：2004-07-13

申请号：US10140663

申请日：2002-05-08

申请人： Johann-Heinrich Fock ,  Wolfgang Schnitt ,  Hauke Pohlmann ,  Andreas Gakis ,  Michael Burnus ,  Martin Schaefer ,  Henricus Godefridus Rafael Maas ,  Theodorus Martinus Michielsen ,  Ronald Dekker

发明人： Johann-Heinrich Fock ,  Wolfgang Schnitt ,  Hauke Pohlmann ,  Andreas Gakis ,  Michael Burnus ,  Martin Schaefer ,  Henricus Godefridus Rafael Maas ,  Theodorus Martinus Michielsen ,  Ronald Dekker

IPC分类号： H01L2348

CPC分类号： H01L23/49855 ,  H01L23/5388 ,  H01L2221/6835 ,  H01L2221/68359 ,  H01L2221/68368 ,  H01L2924/0002 ,  H01L2924/12044 ,  H01L2924/00

摘要： A flexible monolithic integrated circuit which is essentially formed from flexible circuit elements, connecting elements between the flexible circuit elements, and a flexible coating which comprises at least one layer of a coating material comprising a polymer, is suitable as a small and convenient integrated circuit for electronic devices on flexible data carriers for the logistic tracking of objects and persons. The invention also relates to a method of manufacturing a flexible integrated monolithic circuit whereby integrated monolithic circuit elements and connecting elements are formed in and on a semiconductor substrate, the main surface of the integrated circuit elements facing away from the semiconductor substrate are coated with a polymer resin, and the semiconductor substrate is removed. The method is based on conventional process steps in semiconductor technology and leads to a flexible integrated monolithic circuit in a small number of process steps.

摘要翻译： 基本上由柔性电路元件形成的柔性单片集成电路，柔性电路元件之间的连接元件以及包括至少一层包含聚合物的涂层材料的柔性涂层，适合作为小型便利的集成电路 柔性数据载体上的电子设备用于对物体和人的物流跟踪。本发明还涉及一种制造柔性集成单体电路的方法，由此在半导体衬底内和半导体衬底上形成集成的单体电路元件和连接元件， 面向半导体衬底的集成电路元件被涂覆有聚合物树脂，并且去除半导体衬底。 该方法基于半导体技术中的常规工艺步骤，并且在少量工艺步骤中导致灵活的集成单片电路。

公开(公告)号：US08338228B2

公开(公告)日：2012-12-25

申请号：US11574014

申请日：2005-08-09

申请人： Andreas Gakis ,  Wolfgang Schnitt

发明人： Andreas Gakis ,  Wolfgang Schnitt

IPC分类号： H01L21/00

CPC分类号： H01L21/6835 ,  H01L2221/68359 ,  H01L2924/19041

摘要： In order to provide a method of detaching a thin semiconductor circuit (1) from its base (2), wherein the semiconductor circuit (1) is provided with terminals (3) for electrical contacting, in particular with gold contacts, by means of which method thin semiconductor circuits (1) can also be mounted without damage for example directly on a chip card, it is proposed that a layer of soldering tin (6) is applied to a support substrate (4), the support substrate (4) is soldered to the electrical terminals (3) and the base (2) of the semiconductor circuit (1) is removed.

摘要翻译： 为了提供从其底座（2）分离薄半导体电路（1）的方法，其中半导体电路（1）设置有用于电接触的端子（3），特别是与金触点电连接 方法薄半导体电路（1）也可以直接安装在芯片卡上而没有损坏的情况下，提出将一层焊锡（6）施加到支撑基板（4）上，支撑基板（4）是 焊接到半导体电路（1）的电端子（3）和基极（2）。

公开(公告)号：US20090215226A1

公开(公告)日：2009-08-27

申请号：US11574014

申请日：2005-08-09

申请人： Andreas Gakis ,  Wolfgang Schnitt

发明人： Andreas Gakis ,  Wolfgang Schnitt

IPC分类号： H01L21/50

CPC分类号： H01L21/6835 ,  H01L2221/68359 ,  H01L2924/19041

摘要： In order to provide a method of detaching a thin semiconductor circuit (1) from its base (2), wherein the semiconductor circuit (1) is provided with terminals (3) for electrical contacting, in particular with gold contacts, by means of which method thin semiconductor circuits (1) can also be mounted without damage for example directly on a chip card, it is proposed that a layer of soldering tin (6) is applied to a support substrate (4), the support substrate (4) is soldered to the electrical terminals (3) and the base (2) of the semiconductor circuit (1) is removed.

摘要翻译： 为了提供从其底座（2）分离薄半导体电路（1）的方法，其中半导体电路（1）设置有用于电接触的端子（3），特别是与金触点电连接 方法薄半导体电路（1）也可以直接安装在芯片卡上而没有损坏的情况下，提出将一层焊锡（6）施加到支撑基板（4）上，支撑基板（4）是 焊接到半导体电路（1）的电端子（3）和基极（2）。

公开(公告)号：US5572036A

公开(公告)日：1996-11-05

申请号：US492066

申请日：1995-09-11

申请人： Andreas Gakis ,  Ralph Busskamp

发明人： Andreas Gakis ,  Ralph Busskamp

IPC分类号： G03F9/00 ,  G03F7/20 ,  H01L21/027 ,  H01L21/683 ,  H01L21/687 ,  H01L21/68

CPC分类号： H01L21/68785 ,  G03F7/707

摘要： A support element of an automatic load platform of a silicon wafer exposure unit, having a circular cross-section, with a first outer diameter adapted to the guide of a load station, which diameter is smaller than that of a silicon wafer, wherein the circular disc of the support element has at its circumference in a direction parallel to the insertion direction of the load station at least partly enlarged portions and therewith a second outer diameter which corresponds approximately to that of the silicon wafer, and wherein the greatest width of the support element at right angles to the insertion direction corresponds to that of the circular disc.

摘要翻译： 具有圆形横截面的硅晶片曝光单元的自动负载平台的支撑元件，其具有适于加载工位引导的第一外径，该直径小于硅晶片的直径，其中圆形 支撑元件的圆盘在其圆周上具有平行于载荷台的插入方向的方向的至少部分增大的部分，并且具有大致对应于硅晶片的第二外径，并且其中支撑件的最大宽度 与插入方向成直角的元件对应于圆盘的元件。