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1.发明申请公开(公告)号：US20070067417A1
公开(公告)日：2007-03-22
申请号：US11324973
申请日：2006-01-03
申请人： John Burroughs , Matthew Iong , Bassem Bishay , Douglas Peeke
发明人： John Burroughs , Matthew Iong , Bassem Bishay , Douglas Peeke
IPC分类号： G06F15/16
CPC分类号： G06F3/0658 , G06F3/0626 , G06F3/067 , G06F3/0689 , G06F11/2089 , G06F11/2097 , G06F13/385
摘要： Data storage equipment includes a first storage processor comprising a processing circuit and a collection of packaged integrated circuit devices which has a first set of ports and a second set of ports; a second storage processor; and an interconnect coupled between the first and second storage processors. The processing circuit of the first storage processor is adapted to execute as follows. The collection of packaged integrated circuit devices of the first storage processor is configured to provide (i) communications to a set of storage devices through the first set of ports of the collection of packaged integrated circuit devices and (ii) other communications to the second storage processor through the second set of ports of the collection of packaged integrated circuit devices. Communications is passed between the first storage processor and the set of storage devices through the first set of ports of the collection of packaged integrated circuit devices. Communications is passed between the first storage processor and the second storage processor through the second set of ports of the collection of packaged integrated circuit devices.
摘要翻译： 数据存储设备包括第一存储处理器，其包括处理电路和具有第一组端口和第二组端口的封装集成电路器件的集合; 第二存储处理器; 以及耦合在第一和第二存储处理器之间的互连。 第一存储处理器的处理电路适于执行如下。 第一存储处理器的封装集成电路设备的集合被配置为提供（i）通过封装的集成电路设备的集合的第一组端口向一组存储设备进行通信，以及（ii）到第二存储器的其他通信 处理器通过第二套端口集成封装的集成电路器件。 通过封装集成电路器件集合的第一组端口在第一存储处理器和存储设备组之间通信通信。 通过封装集成电路装置集合的第二组端口在第一存储处理器和第二存储处理器之间通信通信。
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公开(公告)号：US09506821B1
公开(公告)日：2016-11-29
申请号：US13251163
申请日：2011-09-30
申请人： Michael N. Robillard , Robert M. Beauchamp , Bassem Bishay , David Boudreau , John K. Bowman , John V. Burroughs , Steven R. Cieluch , James W. Espy , Gordon A. Frye , Joseph P. King , Samuel Zeman
发明人： Michael N. Robillard , Robert M. Beauchamp , Bassem Bishay , David Boudreau , John K. Bowman , John V. Burroughs , Steven R. Cieluch , James W. Espy , Gordon A. Frye , Joseph P. King , Samuel Zeman
摘要： A method and computer program product for determining an internal temperature of a computing device, a power consumption factor for the computing device, and an airflow factor for the computing device. An approximated ambient air temperature is generated based upon the internal temperature, power consumption factor, and the airflow factor. A workload factor is determined for the computing device and a fan speed for the computing device is controlled based at least in part upon the approximated ambient air temperature and the workload factor.
摘要翻译： 一种用于确定计算设备的内部温度的方法和计算机程序产品，用于所述计算设备的功耗因数以及所述计算设备的气流因子。 基于内部温度，功耗因数和气流因子产生近似的环境空气温度。 确定计算设备的工作负载因子，并且至少部分地基于近似的环境空气温度和工作负载因子来控制计算设备的风扇速度。
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公开(公告)号：US20050186810A1
公开(公告)日：2005-08-25
申请号：US11114761
申请日：2005-04-26
CPC分类号： H05K7/1429 , Y10T29/49128 , Y10T29/4913 , Y10T29/49139 , Y10T29/49147
摘要： Disclosed is a system including a circuit board and several pluggable modules coupled to the circuit board. The several pluggable modules are insertable through side-by-side slots in an enclosure in which the circuit board resides. A first pluggable module is coupled to the circuit board via a first connector, while a second pluggable module is coupled to the circuit board via a second connector such that the second pluggable module is laterally offset from the first pluggable module. The first and second connectors are right angle connectors, and the second right angle connector is inverted relative to the first right angle connector. The first and second pluggable modules are I/O modules for transporting high speed differential signals, and wherein the first pluggable module includes several XFP connectors, and wherein the second pluggable module includes several SFP connectors. The second pluggable module includes several SFP connectors arranged on both sides of the pluggable module.
摘要翻译： 公开了一种包括电路板和耦合到电路板的几个可插拔模块的系统。 几个可插拔模块可以通过电路板所在的外壳中的并排插槽插入。 第一可插拔模块经由第一连接器耦合到电路板，而第二可插拔模块经由第二连接器耦合到电路板，使得第二可插拔模块从第一可插拔模块横向偏移。 第一和第二连接器是直角连接器，第二直角连接器相对于第一直角连接器反转。 第一和第二可插拔模块是用于传送高速差分信号的I / O模块，并且其中第一可插拔模块包括多个XFP连接器，并且其中第二可插拔模块包括多个SFP连接器。 第二可插拔模块包括布置在可插拔模块两侧的多个SFP连接器。
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公开(公告)号：US20060292901A1
公开(公告)日：2006-12-28
申请号：US11114358
申请日：2005-04-26
IPC分类号： H05K1/00
CPC分类号： H05K7/1429 , Y10T29/49128 , Y10T29/4913 , Y10T29/49139 , Y10T29/49147
摘要： Disclosed is a system including a circuit board and several pluggable modules coupled to the circuit board. The several pluggable modules are insertable through side-by-side slots in an enclosure in which the circuit board resides. A first pluggable module is coupled to the circuit board via a first connector, while a second pluggable module is coupled to the circuit board via a second connector such that the second pluggable module is laterally offset from the first pluggable module. The first and second connectors are right angle connectors, and the second right angle connector is inverted relative to the first right angle connector. The first and second pluggable modules are I/O modules for transporting high speed differential signals, and wherein the first pluggable module includes several XFP connectors, and wherein the second pluggable module includes several SFP connectors. The second pluggable module includes several SFP connectors arranged on both sides of the pluggable module.
摘要翻译： 公开了一种包括电路板和耦合到电路板的几个可插拔模块的系统。 几个可插拔模块可以通过电路板所在的外壳中的并排插槽插入。 第一可插拔模块经由第一连接器耦合到电路板，而第二可插拔模块经由第二连接器耦合到电路板，使得第二可插拔模块从第一可插拔模块横向偏移。 第一和第二连接器是直角连接器，第二直角连接器相对于第一直角连接器反转。 第一和第二可插拔模块是用于传送高速差分信号的I / O模块，并且其中第一可插拔模块包括多个XFP连接器，并且其中第二可插拔模块包括多个SFP连接器。 第二可插拔模块包括布置在可插拔模块两侧的多个SFP连接器。
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