摘要:
A floating loop vehicle component cooling and air-conditioning system having at least one compressor for compressing cool vapor refrigerant into hot vapor refrigerant; at least one condenser for condensing the hot vapor refrigerant into hot liquid refrigerant by exchanging heat with outdoor air; at least one floating loop component cooling device for evaporating the hot liquid refrigerant into hot vapor refrigerant; at least one expansion device for expanding the hot liquid refrigerant into cool liquid refrigerant; at least one air conditioning evaporator for evaporating the cool liquid refrigerant into cool vapor refrigerant by exchanging heat with indoor air; and piping for interconnecting components of the cooling and air conditioning system.
摘要:
A method for cooling vehicle components using the vehicle air conditioning system comprising the steps of: tapping the hot liquid refrigerant of said air conditioning system, flooding a heat exchanger in the vehicle component with said hot liquid refrigerant, evaporating said hot liquid refrigerant into hot vapor refrigerant using the heat from said vehicle component, and returning said hot vapor refrigerant to the hot vapor refrigerant line in said vehicle air conditioning system.
摘要:
A cascaded die mounting device and method using spring contacts for die attachment, with or without metallic bonds between the contacts and the dies, is disclosed. One embodiment is for the direct refrigerant cooling of an inverter/converter carrying higher power levels than most of the low power circuits previously taught, and does not require using a heat sink.
摘要:
The invention is a direct contact refrigerant cooling system using a refrigerant floating loop having a refrigerant and refrigeration devices. The cooling system has at least one hermetic container disposed in the refrigerant floating loop. The hermetic container has at least one electronic component selected from the group consisting of capacitors, power electronic switches and gating signal module. The refrigerant is in direct contact with the electronic component.