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1.发明申请公开(公告)号：US20110085313A1
公开(公告)日：2011-04-14
申请号：US12579051
申请日：2009-10-14
CPC分类号： H05K1/144 , G11C5/025 , H05K1/113 , H05K1/114 , H05K1/141 , H05K3/0058 , H05K3/325 , H05K2201/044 , H05K2201/10378 , H05K2201/10545 , H05K2201/10719 , H05K2201/2009
摘要： A system, method, and motherboard assembly are described for interconnecting and distributing signals and power between co-planar boards that function as a single motherboard. The motherboard assembly includes a multilayered first printed circuit board having opposed parallel first and second surfaces, each having at least one land grid array (LGA) disposed thereon. The assembly further includes at least one wiring layer (Y) designed to only electrically interconnect components on or within the first PCB, and at least one wiring layer (X) designed to only electrically connect the components on the first PCB to a multilayered second PCB. The multilayered second PCB has opposed parallel first and second surfaces, the first surface having at least one LGA disposed thereon. It further includes at least one wiring layer (V) designed to only electrically interconnect components on or within the second PCB, and at least one layer (X) designed to only electrically interconnect the components on the second PCB with the components on the first PCB. A first LGA interposer couples to the LGA disposed on the first surface of the first PCB, and electrically connects at least one component to the first PCB. A second LGA interposer is sandwiched between and couples to the LGA disposed on the second surface of the first PCB and to the LGA disposed on the first surface of the second PCB. It electrically connects the first PCB to components on the second PCB.
摘要翻译： 描述了用于在用作单个主板的共面板之间互连和分配信号和功率的系统，方法和主板组件。 主板组件包括具有相对的平行的第一和第二表面的多层第一印刷电路板，每个具有设置在其上的至少一个焊盘格栅阵列（LGA）。 组件还包括至少一个布线层（Y），其被设计成仅电连接第一PCB上或其内部的部件，以及至少一个布线层（X），其设计成仅将第一PCB上的部件电连接到多层第二PCB 。 所述多层第二PCB具有相对的平行的第一和第二表面，所述第一表面具有设置在其上的至少一个LGA。 它还包括至少一个被设计成仅电连接第二PCB上或第二PCB内的组件的布线层（V），以及设计成仅将第二PCB上的部件与第一PCB上的部件电互连的至少一个层（X） 。 第一LGA插入器耦合到布置在第一PCB的第一表面上的LGA，并且将至少一个部件电连接到第一PCB。 第二LGA插入件夹在布置在第一PCB的第二表面上的LGA之间并耦合到布置在第二PCB的第一表面上的LGA。 它将第一个PCB电连接到第二个PCB上的组件。
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2.发明申请公开(公告)号：US20130055192A1
公开(公告)日：2013-02-28
申请号：US13611609
申请日：2012-09-12
IPC分类号： G06F17/50
CPC分类号： H05K1/144 , G11C5/025 , H05K1/113 , H05K1/114 , H05K1/141 , H05K3/0058 , H05K3/325 , H05K2201/044 , H05K2201/10378 , H05K2201/10545 , H05K2201/10719 , H05K2201/2009
摘要： Mechanisms for interconnecting and distributing signals and power between PCBs are provided. A first PCB having land grid arrays (LGAs) and a first wiring layer designed for interconnect components on the first PCB, and a second wiring layer for connecting the components to a second PCB, are provided. The second PCB has opposed parallel first and second surfaces, the first surface having a LGA. A wiring layer designed to interconnect components on the second PCB, and a layer for interconnecting the components on the second PCB with the components on the first PCB, are provided. A first interposer couples to a LGA of a first surface of the first PCB and connects a component to the first PCB. A second interposer is sandwiched between and couples to a LGA of a second surface of the first PCB and to the LGA of the first surface of the second PCB.
摘要翻译： 提供了在PCB之间互连和分配信号和电源的机制。 提供了具有地面栅格阵列（LGAs）的第一PCB和为第一PCB上的互连部件设计的第一布线层以及用于将部件连接到第二PCB的第二布线层。 第二PCB具有相对的平行的第一和第二表面，第一表面具有LGA。 设置用于互连第二PCB上的组件的布线层和用于将第二PCB上的组件与第一PCB上的组件互连的层。 第一插入器耦合到第一PCB的第一表面的LGA并将部件连接到第一PCB。 第二插入件夹在第一PCB的第二表面的LGA和第二PCB的第一表面的LGA之间并耦合到第二PCB的第二表面的LGA。
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3.发明授权公开(公告)号：US08958214B2
公开(公告)日：2015-02-17
申请号：US13611609
申请日：2012-09-12
CPC分类号： H05K1/144 , G11C5/025 , H05K1/113 , H05K1/114 , H05K1/141 , H05K3/0058 , H05K3/325 , H05K2201/044 , H05K2201/10378 , H05K2201/10545 , H05K2201/10719 , H05K2201/2009
摘要： Mechanisms for interconnecting and distributing signals and power between PCBs are provided. A first PCB having land grid arrays (LGAs) and a first wiring layer designed for interconnect components on the first PCB, and a second wiring layer for connecting the components to a second PCB, are provided. The second PCB has opposed parallel first and second surfaces, the first surface having a LGA. A wiring layer designed to interconnect components on the second PCB, and a layer for interconnecting the components on the second PCB with the components on the first PCB, are provided. A first interposer couples to a LGA of a first surface of the first PCB and connects a component to the first PCB. A second interposer is sandwiched between and couples to a LGA of a second surface of the first PCB and to the LGA of the first surface of the second PCB.
摘要翻译： 提供了在PCB之间互连和分配信号和电源的机制。 提供了具有平面栅格阵列（LGAs）的第一PCB和为第一PCB上的互连部件设计的第一布线层以及用于将部件连接到第二PCB的第二布线层。 第二PCB具有相对的平行的第一和第二表面，第一表面具有LGA。 设置用于互连第二PCB上的组件的布线层和用于将第二PCB上的组件与第一PCB上的组件互连的层。 第一插入器耦合到第一PCB的第一表面的LGA并将部件连接到第一PCB。 第二插入件夹在第一PCB的第二表面的LGA和第二PCB的第一表面的LGA之间并耦合到第二PCB的第二表面的LGA。
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4.发明授权公开(公告)号：US08446738B2
公开(公告)日：2013-05-21
申请号：US12579051
申请日：2009-10-14
CPC分类号： H05K1/144 , G11C5/025 , H05K1/113 , H05K1/114 , H05K1/141 , H05K3/0058 , H05K3/325 , H05K2201/044 , H05K2201/10378 , H05K2201/10545 , H05K2201/10719 , H05K2201/2009
摘要： A system, method, and motherboard assembly are described for interconnecting and distributing signals and power between co-planar boards that function as a single motherboard. The motherboard assembly includes a multilayered first printed circuit board having opposed parallel first and second surfaces, each having at least one land grid array (LGA) disposed thereon. The assembly further includes at least one wiring layer (Y) designed to only electrically interconnect components on or within the first PCB, and at least one wiring layer (X) designed to only electrically connect the components on the first PCB to a multilayered second PCB. The multilayered second PCB has opposed parallel first and second surfaces, the first surface having at least one LGA disposed thereon. It further includes at least one wiring layer (V) designed to only electrically interconnect components on or within the second PCB, and at least one layer (X) designed to only electrically interconnect the components on the second PCB with the components on the first PCB. A first LGA interposer couples to the LGA disposed on the first surface of the first PCB, and electrically connects at least one component to the first PCB. A second LGA interposer is sandwiched between and couples to the LGA disposed on the second surface of the first PCB and to the LGA disposed on the first surface of the second PCB. It electrically connects the first PCB to components on the second PCB.
摘要翻译： 描述了用于在用作单个主板的共面板之间互连和分配信号和功率的系统，方法和主板组件。 主板组件包括具有相对的平行的第一和第二表面的多层第一印刷电路板，每个具有设置在其上的至少一个焊盘格栅阵列（LGA）。 组件还包括至少一个布线层（Y），其被设计成仅电连接第一PCB上或其内部的部件，以及至少一个布线层（X），其设计成仅将第一PCB上的部件电连接到多层第二PCB 。 所述多层第二PCB具有相对的平行的第一和第二表面，所述第一表面具有设置在其上的至少一个LGA。 它还包括至少一个被设计成仅电连接第二PCB上或第二PCB内的组件的布线层（V），以及设计成仅将第二PCB上的部件与第一PCB上的部件电互连的至少一个层（X） 。 第一LGA插入器耦合到布置在第一PCB的第一表面上的LGA，并且将至少一个部件电连接到第一PCB。 第二LGA插入件夹在布置在第一PCB的第二表面上的LGA之间并耦合到布置在第二PCB的第一表面上的LGA。 它将第一个PCB电连接到第二个PCB上的组件。
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5.发明授权Heatsink apparatus for applying a specified compressive force to an integrated circuit device 有权用于向集成电路装置施加规定的压缩力的散热装置公开(公告)号：US07777329B2
公开(公告)日：2010-08-17
申请号：US11460334
申请日：2006-07-27
申请人： John L. Colbert , John S. Corbin, Jr. , Jason R. Eagle , Roger Duane Hamilton , Amanda E. Mikhail , Arvind K. Sinha , Terry L. Sobotta
发明人： John L. Colbert , John S. Corbin, Jr. , Jason R. Eagle , Roger Duane Hamilton , Amanda E. Mikhail , Arvind K. Sinha , Terry L. Sobotta
IPC分类号： H05K7/20
CPC分类号： H01L23/4093 , H01L2924/0002 , H01L2924/00
摘要： An apparatus is provided having an integrated circuit device disposed on a printed circuit board and a heat dissipation device on the integrated circuit device. An actuation screw in a spring plate is urged against a portion of the heat dissipation device by tightening the actuation screw. The actuation screw may be prevented from being tightened beyond a mechanical constraint corresponding to a pre-set calibration for the specific compressive force, which may be greater than or equal to a minimum compressive force corresponding to the greater of a minimum thermal interface pressure and a minimum contact interface pressure. Additionally, a method is provided in which the actuation screw is tightened, but prevented from being tightened beyond the mechanical constraint.
摘要翻译： 提供一种装置，其具有布置在印刷电路板上的集成电路装置和集成电路装置上的散热装置。 通过拧紧致动螺钉，弹簧板中的致动螺钉被推靠在散热装置的一部分上。 可以防止致动螺钉被紧固超过对应于对于特定压缩力的预设校准的机械约束，其可以大于或等于对应于较小的最小热界面压力的最小压缩力，并且 最小接触界面压力。 此外，提供了一种方法，其中致动螺钉被紧固，但是防止超过机械约束被紧固。
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公开(公告)号：US07499279B2
公开(公告)日：2009-03-03
申请号：US11741852
申请日：2007-04-30
IPC分类号： H05K7/20
CPC分类号： H05K7/1053 , G06F1/20 , G06F2200/201 , H01L23/4093 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： A cold plate assembly includes a cold plate with at least two plumbing ports. The cold plate assembly further includes a spring plate assembly, which applies an actuation load to the cold plate. The actuation load is configured to mechanically actuate the cold plate to a module.
摘要翻译： 冷板组件包括具有至少两个管道端口的冷板。 冷板组件还包括向冷板施加致动负载的弹簧板组件。 致动负载被配置为将冷板机械地致动到模块。
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公开(公告)号：US20090034198A1
公开(公告)日：2009-02-05
申请号：US11831135
申请日：2007-07-31
IPC分类号： H05K7/20
CPC分类号： H01L23/4006 , H01L2023/405 , H01L2023/4062 , H01L2023/4081 , H01L2023/4087 , H01L2924/0002 , H01L2924/00
摘要： An apparatus for attaching a heatsink to an electronic module mounted on a circuit card assembly includes a load frame; a load arm having a first end being pivotally coupled to one end of the load frame and a second end configured to receive at least a portion of a load screw therethrough; a spring plate disposed at an opposite end of the one end of the load frame, and configured to threadedly receive the load screw, opposite ends of the spring plate being retained while an intermediate portion threadedly receiving the at least a portion of the load screw is allowed to bow upwards toward a bottom of the opposite end of the load arm; and a heatsink disposed on the module. An intermediate portion of the load arm aligned with a center region of the module biases the heatsink toward the module when the load screw is threadedly engaged with the spring plate.
摘要翻译： 一种用于将散热器附接到安装在电路卡组件上的电子模块的装置包括负载框架; 负载臂具有可枢转地联接到负载框架的一端的第一端和构造成容纳至少一部分负载螺钉的第二端; 弹簧板，设置在所述负载框架的一端的相对端，并且构造成螺纹地接收所述负载螺钉，所述弹簧板的相对端被保持，而螺纹接收所述负载螺钉的至少一部分的中间部分是 允许向上朝向负载臂的相对端的底部向上弯曲; 以及设置在模块上的散热器。 当负载螺钉与弹簧板螺纹接合时，与模块的中心区域对准的负载臂的中间部分将散热器朝向模块偏置。
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8.发明授权公开(公告)号：US07751918B2
公开(公告)日：2010-07-06
申请号：US11620088
申请日：2007-01-05
CPC分类号： H05K7/20809 , G06F1/20
摘要： Methods of configuring a cooling subassembly for an electronics system are provided, that is, for establishing a coolant-carrying tube layout for interconnecting multiple liquid-cooled cold plates in series-fluid communication for cooling multiple heat-generating electronic components of an electronics system. The electronic components are to be plugged in fixed relation into a preconfigured motherboard, and the tube layout includes at least one rigid coolant-carrying tube. Simplified analysis is initially performed to evaluate stress on the rigid tube(s) and determine if loss of actuation load on the electronic components exceeds an acceptable threshold, and if so, at least one tube having high stress is identified and reconfigured. Thereafter, analysis is performed to determine whether, with available actuation load on the cooling subassembly, electrical connection loading between the electronic components and the supporting motherboard is above an acceptable minimum level. If so, the coolant-carrying tube layout is chosen as a final design.
摘要翻译： 提供了构造用于电子系统的冷却子组件的方法，即，用于建立冷却剂承载管布局，用于将串联流体通信中的多个液冷冷板互连，以冷却电子系统的多个发热电子部件。 电子部件将以固定关系插入到预配置的主板中，并且管布置包括至少一个刚性的冷却剂输送管。 最初进行简化分析以评估刚性管上的应力，并确定电子部件上的致动负载的损失是否超过可接受的阈值，如果是，则识别和重新配置至少一个具有高应力的管。 此后，执行分析以确定在冷却子组件上的可用致动负载下，电子部件和支撑母板之间的电连接负载是否高于可接受的最低水平。 如果是这样，选择冷却剂载体管布局作为最终设计。
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公开(公告)号：US20080266799A1
公开(公告)日：2008-10-30
申请号：US11741852
申请日：2007-04-30
IPC分类号： H05K7/20
CPC分类号： H05K7/1053 , G06F1/20 , G06F2200/201 , H01L23/4093 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： A cold plate assembly includes a cold plate with at least two plumbing ports. The cold plate assembly further includes a spring plate assembly, which applies an actuation load to the cold plate. The actuation load is configured to mechanically actuate the cold plate to a module.
摘要翻译： 冷板组件包括具有至少两个管道端口的冷板。 冷板组件还包括向冷板施加致动负载的弹簧板组件。 致动负载被配置为将冷板机械地致动到模块。
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10.发明申请Heatsink Apparatus for Applying a Specified Compressive Force to an Integrated Circuit Device 有权用于将特定压缩力应用于集成电路装置的散热装置公开(公告)号：US20080024991A1
公开(公告)日：2008-01-31
申请号：US11460334
申请日：2006-07-27
申请人： John L. Colbert , John S. Corbin , Jason R. Eagle , Roger Duane Hamilton , Amanda E. Mikhail , Arvind K. Sinha , Terry L. Sobotta
发明人： John L. Colbert , John S. Corbin , Jason R. Eagle , Roger Duane Hamilton , Amanda E. Mikhail , Arvind K. Sinha , Terry L. Sobotta
IPC分类号： H05K7/20
CPC分类号： H01L23/4093 , H01L2924/0002 , H01L2924/00
摘要： A method and apparatus for applying a specified compressive force by a heat dissipation device for an integrated circuit are given, including placing the integrated circuit device onto a printed circuit board and then placing the heat dissipation device onto the integrated circuit device. The method includes tightening an actuation screw in a spring plate against a portion of the heat dissipation device. The actuation screw may be prevented from being tightened beyond a mechanical constraint corresponding to a pre-set calibration for the specific compressive force, which may be greater than or equal to a minimum compressive force corresponding to the greater of a minimum thermal interface pressure and a minimum contact interface pressure. Additionally, the specific compressive force may be less than or equal to a maximum pressure which may be exerted on the integrated circuit device.
摘要翻译： 给出了一种通过用于集成电路的散热装置施加特定压缩力的方法和装置，包括将集成电路装置放置在印刷电路板上，然后将散热装置放置在集成电路装置上。 该方法包括将弹簧板中的致动螺钉紧固在散热装置的一部分上。 可以防止致动螺钉被紧固超过对应于对于特定压缩力的预设校准的机械约束，其可以大于或等于对应于较小的最小热界面压力的最小压缩力，并且 最小接触界面压力。 此外，比压缩力可以小于或等于可以施加在集成电路装置上的最大压力。
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