-
1.发明授权Heatsink apparatus for applying a specified compressive force to an integrated circuit device 有权用于向集成电路装置施加规定的压缩力的散热装置公开(公告)号：US07777329B2
公开(公告)日：2010-08-17
申请号：US11460334
申请日：2006-07-27
申请人： John L. Colbert , John S. Corbin, Jr. , Jason R. Eagle , Roger Duane Hamilton , Amanda E. Mikhail , Arvind K. Sinha , Terry L. Sobotta
发明人： John L. Colbert , John S. Corbin, Jr. , Jason R. Eagle , Roger Duane Hamilton , Amanda E. Mikhail , Arvind K. Sinha , Terry L. Sobotta
IPC分类号： H05K7/20
CPC分类号： H01L23/4093 , H01L2924/0002 , H01L2924/00
摘要： An apparatus is provided having an integrated circuit device disposed on a printed circuit board and a heat dissipation device on the integrated circuit device. An actuation screw in a spring plate is urged against a portion of the heat dissipation device by tightening the actuation screw. The actuation screw may be prevented from being tightened beyond a mechanical constraint corresponding to a pre-set calibration for the specific compressive force, which may be greater than or equal to a minimum compressive force corresponding to the greater of a minimum thermal interface pressure and a minimum contact interface pressure. Additionally, a method is provided in which the actuation screw is tightened, but prevented from being tightened beyond the mechanical constraint.
摘要翻译： 提供一种装置，其具有布置在印刷电路板上的集成电路装置和集成电路装置上的散热装置。 通过拧紧致动螺钉，弹簧板中的致动螺钉被推靠在散热装置的一部分上。 可以防止致动螺钉被紧固超过对应于对于特定压缩力的预设校准的机械约束，其可以大于或等于对应于较小的最小热界面压力的最小压缩力，并且 最小接触界面压力。 此外，提供了一种方法，其中致动螺钉被紧固，但是防止超过机械约束被紧固。
-
2.发明申请Heatsink Apparatus for Applying a Specified Compressive Force to an Integrated Circuit Device 有权用于将特定压缩力应用于集成电路装置的散热装置公开(公告)号：US20080024991A1
公开(公告)日：2008-01-31
申请号：US11460334
申请日：2006-07-27
申请人： John L. Colbert , John S. Corbin , Jason R. Eagle , Roger Duane Hamilton , Amanda E. Mikhail , Arvind K. Sinha , Terry L. Sobotta
发明人： John L. Colbert , John S. Corbin , Jason R. Eagle , Roger Duane Hamilton , Amanda E. Mikhail , Arvind K. Sinha , Terry L. Sobotta
IPC分类号： H05K7/20
CPC分类号： H01L23/4093 , H01L2924/0002 , H01L2924/00
摘要： A method and apparatus for applying a specified compressive force by a heat dissipation device for an integrated circuit are given, including placing the integrated circuit device onto a printed circuit board and then placing the heat dissipation device onto the integrated circuit device. The method includes tightening an actuation screw in a spring plate against a portion of the heat dissipation device. The actuation screw may be prevented from being tightened beyond a mechanical constraint corresponding to a pre-set calibration for the specific compressive force, which may be greater than or equal to a minimum compressive force corresponding to the greater of a minimum thermal interface pressure and a minimum contact interface pressure. Additionally, the specific compressive force may be less than or equal to a maximum pressure which may be exerted on the integrated circuit device.
摘要翻译： 给出了一种通过用于集成电路的散热装置施加特定压缩力的方法和装置，包括将集成电路装置放置在印刷电路板上，然后将散热装置放置在集成电路装置上。 该方法包括将弹簧板中的致动螺钉紧固在散热装置的一部分上。 可以防止致动螺钉被紧固超过对应于对于特定压缩力的预设校准的机械约束，其可以大于或等于对应于较小的最小热界面压力的最小压缩力，并且 最小接触界面压力。 此外，比压缩力可以小于或等于可以施加在集成电路装置上的最大压力。
-
公开(公告)号：US20090034198A1
公开(公告)日：2009-02-05
申请号：US11831135
申请日：2007-07-31
IPC分类号： H05K7/20
CPC分类号： H01L23/4006 , H01L2023/405 , H01L2023/4062 , H01L2023/4081 , H01L2023/4087 , H01L2924/0002 , H01L2924/00
摘要： An apparatus for attaching a heatsink to an electronic module mounted on a circuit card assembly includes a load frame; a load arm having a first end being pivotally coupled to one end of the load frame and a second end configured to receive at least a portion of a load screw therethrough; a spring plate disposed at an opposite end of the one end of the load frame, and configured to threadedly receive the load screw, opposite ends of the spring plate being retained while an intermediate portion threadedly receiving the at least a portion of the load screw is allowed to bow upwards toward a bottom of the opposite end of the load arm; and a heatsink disposed on the module. An intermediate portion of the load arm aligned with a center region of the module biases the heatsink toward the module when the load screw is threadedly engaged with the spring plate.
摘要翻译： 一种用于将散热器附接到安装在电路卡组件上的电子模块的装置包括负载框架; 负载臂具有可枢转地联接到负载框架的一端的第一端和构造成容纳至少一部分负载螺钉的第二端; 弹簧板，设置在所述负载框架的一端的相对端，并且构造成螺纹地接收所述负载螺钉，所述弹簧板的相对端被保持，而螺纹接收所述负载螺钉的至少一部分的中间部分是 允许向上朝向负载臂的相对端的底部向上弯曲; 以及设置在模块上的散热器。 当负载螺钉与弹簧板螺纹接合时，与模块的中心区域对准的负载臂的中间部分将散热器朝向模块偏置。
-
4.发明授权Electronic assembly and techniques for installing a heatsink in an electronic assembly 有权用于在散热器中安装电子组件的电子装配和技术公开(公告)号：US07701720B2
公开(公告)日：2010-04-20
申请号：US11862848
申请日：2007-09-27
IPC分类号： H05K7/20
CPC分类号： H01L23/4006 , H01L2924/0002 , Y10T29/53113 , H01L2924/00
摘要： A technique for installing a heatsink in an electronic assembly includes simultaneously applying force to multiple fastener assemblies that each retain a respective fastener in a body of the heatsink. The heatsink is then attached to the electronic assembly by actuating the fasteners while the force is simultaneously applied to the multiple fastener assemblies.
摘要翻译： 用于在电子组件中安装散热器的技术包括同时向多个紧固件组件施加力，每个紧固件组件将相应的紧固件保持在散热器的主体中。 然后通过致动紧固件将散热器附接到电子组件，同时力同时施加到多个紧固件组件。
-
5.发明申请Electronic Assembly and Techniques for Installing a Heatsink in an Electronic Assembly 有权电子组装中安装散热器的电子组装和技术公开(公告)号：US20090083972A1
公开(公告)日：2009-04-02
申请号：US11862848
申请日：2007-09-27
CPC分类号： H01L23/4006 , H01L2924/0002 , Y10T29/53113 , H01L2924/00
摘要： A technique for installing a heatsink in an electronic assembly includes simultaneously applying force to multiple fastener assemblies that each retain a respective fastener in a body of the heatsink. The heatsink is then attached to the electronic assembly by actuating the fasteners while the force is simultaneously applied to the multiple fastener assemblies.
摘要翻译： 用于在电子组件中安装散热器的技术包括同时向多个紧固件组件施加力，每个紧固件组件将相应的紧固件保持在散热器的主体中。 然后通过致动紧固件将散热器附接到电子组件，同时力同时施加到多个紧固件组件。
-
6.发明授权Apparatus and method that minimizing dimensional instability and solder stress in surface mounted interconnections 有权在表面安装的互连中最小化尺寸不稳定性和焊料应力的装置和方法公开(公告)号：US07488192B1
公开(公告)日：2009-02-10
申请号：US11972168
申请日：2008-01-10
IPC分类号： H01R13/62
CPC分类号： H01R43/0256 , H01R12/57 , H01R12/707 , H01R12/714 , H01R13/436 , H01R13/62988 , H05K3/3426 , H05K2201/09136 , H05K2201/10189 , Y02P70/613
摘要： A surface mounted apparatus for use with electrical component interconnections including a planar surface, a slide disposed proximate to the planar surface and being made of a material having a coefficient of thermal expansion (CTE) that is substantially matched to that of a material of the planar surface, the slide being further configured to accommodate solderable contact elements stitched therethrough and soldered to the planar surface, a connector body to support the slide in a cavity defined therein, the cavity being sufficiently large to allow the slide to float in accordance with thermal expansions and contractions of the slide and the planar surface, which respectively occur during solder reflow and subsequent cool-down of the connector assembly.
摘要翻译： 一种用于电气部件互连的表面安装装置，包括平面表面，靠近平面表面设置的滑动件，并且由具有与平面材料的材料基本匹配的热膨胀系数（CTE）的材料制成 所述滑动件进一步构造成容纳通过其穿过并焊接到所述平面表面的可焊接接触元件，连接器主体，用于将所述滑块支撑在限定在其中的空腔中，所述空腔足够大以允许所述滑块根据热膨胀 以及分别在焊料回流和连接器组件的随后冷却期间发生的滑块和平面的收缩。
-
7.发明授权Implementing connection of two large electronic boards utilizing LGA interconnect 失效实现利用LGA互连的两个大型电子板的连接公开(公告)号：US08747122B2
公开(公告)日：2014-06-10
申请号：US12821312
申请日：2010-06-23
IPC分类号： H01R12/00
CPC分类号： H05K3/36 , H01R43/205 , H05K1/141 , H05K3/301 , H05K3/368 , Y10T29/49126
摘要： A method and apparatus are provided for implementing electrical connection of two large circuit cards through multiple discrete land grid array (LGA) sites. Each of the circuit cards includes a plurality of LGA sites. A first circuit card includes a plurality of LGA interposers locally aligned at the respective LGA sites of the first circuit card. A board-to-board connection hardware assembly connecting a second circuit card to the first circuit card includes a elongated carrier defining a cavity receiving a plurality of load springs coupled to an associated bearing block for loading and maintaining flatness of the LGA sites.
摘要翻译： 提供一种方法和装置，用于通过多个离散的陆地网格阵列（LGA）实现两个大电路卡的电连接。 每个电路卡包括多个LGA位置。 第一电路卡包括在第一电路卡的相应LGA位置局部排列的多个LGA插入器。 将第二电路卡连接到第一电路卡的板对板连接硬件组件包括细长载体，其限定了容纳耦合到相关联的轴承座的多个负载弹簧的空腔，用于加载和保持LGA位置的平坦度。
-
8.发明申请IMPLEMENTING CONNECTION OF TWO LARGE ELECTRONIC BOARDS UTILIZING LGA INTERCONNECT 失效利用LGA互连实现两大电子板的连接公开(公告)号：US20140127915A1
公开(公告)日：2014-05-08
申请号：US12821312
申请日：2010-06-23
CPC分类号： H05K3/36 , H01R43/205 , H05K1/141 , H05K3/301 , H05K3/368 , Y10T29/49126
摘要： A method and apparatus are provided for implementing electrical connection of two large circuit cards through multiple discrete land grid array (LGA) sites. Each of the circuit cards includes a plurality of LGA sites. A first circuit card includes a plurality of LGA interposers locally aligned at the respective LGA sites of the first circuit card. A board-to-board connection hardware assembly connecting a second circuit card to the first circuit card includes a elongated carrier defining a cavity receiving a plurality of load springs coupled to an associated bearing block for loading and maintaining flatness of the LGA sites.
摘要翻译： 提供一种方法和装置，用于通过多个离散的陆地网格阵列（LGA）实现两个大电路卡的电连接。 每个电路卡包括多个LGA位置。 第一电路卡包括在第一电路卡的相应LGA位置局部排列的多个LGA插入器。 将第二电路卡连接到第一电路卡的板对板连接硬件组件包括细长载体，其限定了容纳耦合到相关联的轴承座的多个负载弹簧的空腔，用于加载和保持LGA位置的平坦度。
-
公开(公告)号：US08363404B2
公开(公告)日：2013-01-29
申请号：US12967854
申请日：2010-12-14
申请人： John L. Colbert , Jason R. Eagle , Roger D. Hamilton , Kenneth C. Marston , Steven P. Ostrander
发明人： John L. Colbert , Jason R. Eagle , Roger D. Hamilton , Kenneth C. Marston , Steven P. Ostrander
CPC分类号： G06F1/20 , G06F2200/201 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： A method and apparatus are provided for implementing loading and heat removal for a hub module assembly. The hub module assembly includes a hub chip and a plurality of optical modules attached by land grid array (LGA) assembly disposed on a top surface metallurgy (TSM) LGA residing on a hub ceramic substrate. The ceramic substrate is connected to a circuit board through a bottom surface metallurgy (BSM) LGA assembly. A base alignment ring includes a plurality of alignment features for engaging the circuit board and locating an LGA interposer of the BSM LGA assembly. Each of a pair of top alignment rings includes cooperating alignment features for engaging and locating a respective LGA interposer of respective LGA sites of the TSM LGA assembly. The two LGA interposers of the TSM LGA assembly align, retain, and make the electrical connection between the optical modules and the hub chip.
摘要翻译： 提供了一种用于实现轮毂模块组件的加载和除热的方法和装置。 集线器模块组件包括集线器芯片和多个光学模块，其通过设置在驻留在轮毂陶瓷衬底上的顶表面冶金（TSM）LGA上的焊盘网阵列（LGA）组件连接。 陶瓷基板通过底表面冶金（BSM）LGA组件连接到电路板。 基座对准环包括用于接合电路板和定位BSM LGA组件的LGA插入器的多个对准特征。 一对顶部对准环中的每一个包括用于接合和定位TSM LGA组件的相应LGA位置的相应LGA插入器的协作对准特征。 TSM LGA组件的两个LGA插入器对齐，保持并使光学模块与集线器芯片之间的电连接。
-
公开(公告)号：US20120147563A1
公开(公告)日：2012-06-14
申请号：US12967854
申请日：2010-12-14
申请人： John L. Colbert , Jason R. Eagle , Roger D. Hamilton , Kenneth C. Marston , Steven P. Ostrander
发明人： John L. Colbert , Jason R. Eagle , Roger D. Hamilton , Kenneth C. Marston , Steven P. Ostrander
IPC分类号： H05K7/20
CPC分类号： G06F1/20 , G06F2200/201 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： A method and apparatus are provided for implementing loading and heat removal for a hub module assembly. The hub module assembly includes a hub chip and a plurality of optical modules attached by land grid array (LGA) assembly disposed on a top surface metallurgy (TSM) LGA residing on a hub ceramic substrate. The ceramic substrate is connected to a circuit board through a bottom surface metallurgy (BSM) LGA assembly. A base alignment ring includes a plurality of alignment features for engaging the circuit board and locating an LGA interposer of the BSM LGA assembly. Each of a pair of top alignment rings includes cooperating alignment features for engaging and locating a respective LGA interposer of respective LGA sites of the TSM LGA assembly. The two LGA interposers of the TSM LGA assembly align, retain, and make the electrical connection between the optical modules and the hub chip.
摘要翻译： 提供了一种用于实现轮毂模块组件的加载和除热的方法和装置。 集线器模块组件包括集线器芯片和多个光学模块，其通过设置在驻留在轮毂陶瓷衬底上的顶表面冶金（TSM）LGA上的焊盘网阵列（LGA）组件连接。 陶瓷基板通过底表面冶金（BSM）LGA组件连接到电路板。 基座对准环包括用于接合电路板和定位BSM LGA组件的LGA插入器的多个对准特征。 一对顶部对准环中的每一个包括用于接合和定位TSM LGA组件的相应LGA位置的相应LGA插入器的协作对准特征。 TSM LGA组件的两个LGA插入器对齐，保持并使光学模块与集线器芯片之间的电连接。
-
-
-
-
-
-
-
-
-
搜索结果
15 条记录 (耗时 0.035 秒)
