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    Method of additive circuitization of circuit boards with high adhesion, voidless copper leads
    1.
    发明授权
    Method of additive circuitization of circuit boards with high adhesion, voidless copper leads 失效
    具有高附着力的无电镀铜导线的电路板的附加电路化方法

    公开(公告)号：US5166037A

    公开(公告)日：1992-11-24

    申请号：US655479

    申请日：1991-02-14

    申请人： John M. Atkinson ,  Russell E. Darrow ,  John D. Larnerd ,  Ronald J. Moore

    发明人： John M. Atkinson ,  Russell E. Darrow ,  John D. Larnerd ,  Ronald J. Moore

    IPC分类号： H05K3/18

    CPC分类号： H05K3/184

    摘要： Disclosed is a method of fabricating a microelectronic package, especially a microelectronic package having copper circuitization on a dielectric substrate. The method includes the steps of depositing, imaging, developing the photoresist for additive circuitization, and forming a pattern of copper circuitization on the so exposed portions of the package. In order to avoid the formation of deleterious air bubbles on the exposed walls of the imaged and developed resist, the panel is exposed to and wetted by a liquid mist.

    摘要翻译： 公开了一种制造微电子封装的方法，特别是在电介质基片上具有铜电路化的微电子封装。 该方法包括沉积，成像，显影用于附加电路化的光致抗蚀剂，并且在封装的暴露部分上形成铜电路图案。 为了避免在成像和显影的抗蚀剂的暴露的壁上形成有害的气泡，面板被液雾暴露和润湿。

    METAL CONSERVATION WITH STRIPPER SOLUTIONS CONTAINING RESORCINOL
    4.
    发明申请
    METAL CONSERVATION WITH STRIPPER SOLUTIONS CONTAINING RESORCINOL 有权
    金属保存与含有RESORCINOL的剥离剂溶液

    公开(公告)号：US20090047609A1

    公开(公告)日：2009-02-19

    申请号：US11928728

    申请日：2007-10-30

    申请人： John M. Atkinson ,  Kimberly Dona Pollard

    发明人： John M. Atkinson ,  Kimberly Dona Pollard

    IPC分类号： G03C5/00 ,  G03C11/12

    CPC分类号： G03F7/422 ,  C11D7/10 ,  C11D7/261 ,  C11D7/3209 ,  C11D7/3218 ,  C11D7/5009 ,  C11D11/0047 ,  G03F7/425 ,  G03F7/426 ,  H01L21/02071 ,  H01L21/30604 ,  H01L21/31133

    摘要： Resist stripping agents useful for fabricating circuits and/or forming electrodes on semiconductor devices for semiconductor integrated circuits and/or liquid crystals with reduced metal and metal alloy etch rates (particularly copper etch rates and TiW etch rates), are provided with methods for their use. The preferred stripping agents contain low concentrations of resorcinol or a resorcinol derivative, with or without an added copper salt, and with or without an added amine to improve solubility of the copper salt. Further provided are integrated circuit devices and electronic interconnect structures prepared according to these methods.

    摘要翻译： 具有减少的金属和金属合金蚀刻速率（特别是铜蚀刻速率和TiW蚀刻速率）的半导体集成电路和/或液晶的半导体器件上制造电路和/或形成电极的抗蚀剂剥离剂提供了它们使用的方法 。 优选的汽提剂含有低浓度的间苯二酚或间苯二酚衍生物，具有或不具有加入的铜盐，以及具有或不具有加入的胺以改善铜盐的溶解度。 还提供了根据这些方法制备的集成电路器件和电子互连结构。