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16 条记录 (耗时 0.022 秒)

    Method of additive circuitization of circuit boards with high adhesion, voidless copper leads
    1.
    发明授权
    Method of additive circuitization of circuit boards with high adhesion, voidless copper leads 失效
    具有高附着力的无电镀铜导线的电路板的附加电路化方法

    公开(公告)号：US5166037A

    公开(公告)日：1992-11-24

    申请号：US655479

    申请日：1991-02-14

    申请人： John M. Atkinson ,  Russell E. Darrow ,  John D. Larnerd ,  Ronald J. Moore

    发明人： John M. Atkinson ,  Russell E. Darrow ,  John D. Larnerd ,  Ronald J. Moore

    IPC分类号： H05K3/18

    CPC分类号： H05K3/184

    摘要： Disclosed is a method of fabricating a microelectronic package, especially a microelectronic package having copper circuitization on a dielectric substrate. The method includes the steps of depositing, imaging, developing the photoresist for additive circuitization, and forming a pattern of copper circuitization on the so exposed portions of the package. In order to avoid the formation of deleterious air bubbles on the exposed walls of the imaged and developed resist, the panel is exposed to and wetted by a liquid mist.

    摘要翻译： 公开了一种制造微电子封装的方法，特别是在电介质基片上具有铜电路化的微电子封装。 该方法包括沉积，成像，显影用于附加电路化的光致抗蚀剂，并且在封装的暴露部分上形成铜电路图案。 为了避免在成像和显影的抗蚀剂的暴露的壁上形成有害的气泡，面板被液雾暴露和润湿。

    Method for treating substrates
    2.
    发明授权
    Method for treating substrates 失效
    处理底物的方法

    公开(公告)号：US5427627A

    公开(公告)日：1995-06-27

    申请号：US179653

    申请日：1994-01-05

    申请人： Michael J. Canestaro ,  Donald G. McBride ,  Louis J. Konrad, III ,  Ronald J. Moore

    发明人： Michael J. Canestaro ,  Donald G. McBride ,  Louis J. Konrad, III ,  Ronald J. Moore

    IPC分类号： C23F1/08 ,  B05C3/12 ,  B05C3/18 ,  B05C5/02 ,  C23G3/00 ,  H05K3/00 ,  H05K3/06 ,  H05K3/18 ,  H05K3/26 ,  H05K3/42 ,  B08B3/02

    CPC分类号： B05C3/18 ,  B05C3/125 ,  H05K3/0085

    摘要： A device for applying fluid to a substrate which includes a head member having first and second opposed portions adapted for being fixedly positioned relative to each other. The device is particularly suited for treating a substrate as the substrate moves between the first and second portions. Each portion may in turn include a first channel located at a predetermined distance from the substrate for having a first fluid impinge on the substrate at a first velocity. Additionally, each portion may include a weir adjacent the first channel for having fluid pass thereover at an accelerated rate and thus at a greater velocity than the first fluid, this weir being located at a lesser distance than the first channel. Fluid inlet means is coupled to the respective portions to provide the fluid thereto at desired velocities. Significantly, a fluid blocking means (e.g., an elongated bar) is also included as part of the structure for maintaining the fluids at pre-established levels.

    摘要翻译： 一种用于向衬底施加流体的装置，其包括具有适于相对于彼此固定定位的第一和第二相对部分的头部构件。 当衬底在第一和第二部分之间移动时，该器件特别适用于处理衬底。 每个部分还可以包括位于距衬底预定距离的第一通道，以使第一流体以第一速度冲击在衬底上。 另外，每个部分可以包括邻近第一通道的堰，用于使流体以加速的速度传递到其上，因此以比第一流体更大的速度传递，该堰位于比第一通道更小的距离处。 流体入口装置联接到相应的部分，以期望的速度向其提供流体。 重要的是，还包括流体阻塞装置（例如，细长条）作为用于将流体保持在预先确定的水平的结构的一部分。

    Method and apparatus for continuous fluid leak monitoring and detection in analytical instruments and instrument systems
    5.
    发明授权
    Method and apparatus for continuous fluid leak monitoring and detection in analytical instruments and instrument systems 失效
    用于分析仪器和仪器系统中连续流体泄漏监测和检测的方法和装置

    公开(公告)号：US07752890B2

    公开(公告)日：2010-07-13

    申请号：US11936989

    申请日：2007-11-08

    申请人： Karl K. Weitz ,  Ronald J. Moore

    发明人： Karl K. Weitz ,  Ronald J. Moore

    IPC分类号： G01M3/08

    CPC分类号： G01M3/16

    摘要： A method and device are disclosed that provide for detection of fluid leaks in analytical instruments and instrument systems. The leak detection device includes a collection tube, a fluid absorbing material, and a circuit that electrically couples to an indicator device. When assembled, the leak detection device detects and monitors for fluid leaks, providing a preselected response in conjunction with the indicator device when contacted by a fluid.

    摘要翻译： 公开了一种方法和装置，用于检测分析仪器和仪器系统中的流体泄漏。 泄漏检测装置包括收集管，流体吸收材料和电连接到指示器装置的电路。 当组装时，泄漏检测装置检测并监测流体泄漏，当与流体接触时与指示器装置一起提供预选的响应。

    Method for forming a patterned layer on a substrate
    7.
    发明授权
    Method for forming a patterned layer on a substrate 失效
    在基板上形成图案层的方法

    公开(公告)号：US5334487A

    公开(公告)日：1994-08-02

    申请号：US918989

    申请日：1992-07-23

    申请人： Thomas E. Kindl ,  Ronald J. Moore ,  Paul G. Rickerl

    发明人： Thomas E. Kindl ,  Ronald J. Moore ,  Paul G. Rickerl

    IPC分类号： G03F7/095 ,  G03F7/20 ,  H05K1/00 ,  H05K1/11 ,  H05K3/00 ,  H05K3/06 ,  H05K3/34 ,  G03F7/00

    CPC分类号： H05K1/112 ,  G03F7/0957 ,  G03F7/2022 ,  H05K3/0023 ,  H05K1/0393 ,  H05K2201/0355 ,  H05K2201/0394 ,  H05K2201/09472 ,  H05K2203/041 ,  H05K3/064 ,  H05K3/3478

    摘要： The present invention provides a method of forming a pattern of conductive material on dielectric material with access openings or vias through said dielectric material and such a structure. A sheet of conductive material, which is to be circuitized, is provided with a layer of a first photoimageable dielectric material on one face thereof. A layer of a second photoimageable material, such as a conventional photoresist material, is provided on the opposite face of the conductive material. The layer of said first photoimageable material is selected such that it will not be developed by the developer that develops the layer of said second material. The two layers of photoimageable material are pattern-wise exposed to radiation. The second layer of material is developed and the revealed underlying conductive material is etched to form the desired circuit pattern. The first layer is then developed to form openings or vias communicating with the circuit pattern, and these are then filled with a conductive material such as solder.

    摘要翻译： 本发明提供了一种在电介质材料上形成具有通过所述介电材料和这种结构的进入开口或通孔的导电材料图案的方法。 要电路化的导电材料片在其一个表面上设置有第一可光成像电介质材料层。 在导电材料的相对面上设置有诸如常规光致抗蚀剂材料的第二可光成象材料层。 选择所述第一可光成像材料的层，使得其不会由显影剂显影出所述第二材料的层。 两层可光成像材料以图案方式暴露于辐射。 显影第二层材料，并将所揭示的底层导电材料进行蚀刻以形成所需的电路图案。 然后显影第一层以形成与电路图案连通的开口或通孔，然后用诸如焊料的导电材料填充第一层。

    Fluid treatment device
    9.
    发明授权
    Fluid treatment device 失效
    流体处理装置

    公开(公告)号：US5294259A

    公开(公告)日：1994-03-15

    申请号：US884818

    申请日：1992-05-18

    申请人： Michael J. Canestaro ,  Donald G. McBride ,  Louis J. Konrad, III ,  Ronald J. Moore

    发明人： Michael J. Canestaro ,  Donald G. McBride ,  Louis J. Konrad, III ,  Ronald J. Moore

    IPC分类号： C23F1/08 ,  B05C3/12 ,  B05C3/18 ,  B05C5/02 ,  C23G3/00 ,  H05K3/00 ,  H05K3/06 ,  H05K3/18 ,  H05K3/26 ,  H05K3/42 ,  B05C3/02

    CPC分类号： B05C3/18 ,  B05C3/125 ,  H05K3/0085

    摘要： A device for applying fluid to a substrate which includes a head member having first and second opposed portions adapted for being fixedly positioned relative to each other. The device is particularly suited for treating a substrate as the substrate moves between the first and second portions. Each portion may in turn include a first channel located at a predetermined distance from the substrate for having a first fluid impinge on the substrate at a first velocity. Additionally, each portion may include a weir adjacent the first channel for having fluid pass thereover at an accelerated rate and thus at a greater velocity than the first fluid, this weir being located at a lesser distance than the first channel. Fluid inlet means is coupled to the respective portions to provide the fluid thereto at desired velocities. Significantly, a fluid blocking means (e.g., an elongated bar) is also included as part of the structure for maintaining the fluids at pre-established levels.

    摘要翻译： 一种用于向衬底施加流体的装置，其包括具有适于相对于彼此固定定位的第一和第二相对部分的头部构件。 当衬底在第一和第二部分之间移动时，该器件特别适用于处理衬底。 每个部分还可以包括位于距衬底预定距离的第一通道，以使第一流体以第一速度冲击在衬底上。 另外，每个部分可以包括与第一通道相邻的堰，用于使流体以加速的速度通过，因此以比第一流体更大的速度传递，该堰位于比第一通道更小的距离处。 流体入口装置联接到相应的部分，以期望的速度向其提供流体。 重要的是，还包括流体阻塞装置（例如，细长条）作为用于将流体保持在预先确定的水平的结构的一部分。