摘要:
An electronics assembly apparatus with improved pick evaluation is provided. The apparatus includes a placement head having at least one nozzle for releasably picking up and holding a component. A robotic system is provided for generating relative movement between the placement head and a workpiece, such as a circuit board. An image acquisition system is disposed to obtain at least one before-pick image of a component pick up location and at least one after-pick image of the component pick up location. The before-pick image contains a plurality of image portions, having each image portion view the pick-up location from a different point of view, while the after-pick image contains a plurality of image portions, having each image portion view the pick-up location from a different point of view.
摘要:
A pick and place machine includes a sensor disposed to acquire an image of a nozzle before a pick operation, and one or more images after the pick operation. Image analytics based upon these images reveal important characteristics that can be used to classify the pick operation. In some embodiments, a plurality of after-pick images are acquired at different poses (angular orientations).
摘要:
An electronics assembly apparatus with improved pick evaluation is provided. The apparatus includes a placement head having at least one nozzle for releasably picking up and holding a component. A robotic system is provided for generating relative movement between the placement head and a workpiece, such as a circuit board. An image acquisition system is disposed to obtain at least one before-pick image of a component pick up location and at least one after-pick image of the component pick up location. The before-pick image contains a plurality of image portions, having each image portion view the pick-up location from a different point of view, while the after-pick image contains a plurality of image portions, having each image portion view the pick-up location from a different point of view.
摘要:
Embodiments of the present invention improve upon component level inspection performed by pick and place machines. Such improvements include inspecting the pick operation in pick and place machines by collecting images of the pick event inside the machine and identifying errors as they happen. By detecting and displaying this information as it generated on the machine, the operator or machine can take prompt and effective corrective actions.
摘要:
The present invention includes a method of determining a location of a component on a workpiece. A before-placement standard image is acquired of an intended placement location on a standard workpiece. Then, a standard component is placed upon the standard workpiece and the placement is verified. An after-placement standard image is acquired and a standard difference image is created from the before and after standard images. Then, a before-placement test image is acquired of an intended placement location on the workpiece. A component is then placed upon the workpiece, and after-placement test image is acquired. A test difference image is created from the before and after test images. A first offset is calculated between the before standard difference image and the before test image. Then, the test difference is transformed based on the first offset to generate a difference test image (DTR) that is registered to the standard difference image. The standard difference image is correlated to the registered difference test image (DTR) to generate a registration offset indicative of placement efficacy.
摘要:
A sensor for sensing placement information of a component to be placed by a pick and place machine is disclosed. The sensor includes a plurality of light sources each of which is disposed to direct illumination at different angles of incidence upon the component. Each source is further adapted to generate light based upon an energization signal. Source control electronics are provided and coupled to the plurality of light sources to successively and/or provide energization signals to each source. A detector is disposed within the sensor relative to the plurality of sources to receive at least one shadow of the component, and provide data at a detector output indicative of the shadow imaged while the component is rotated.
摘要:
An inspection system for inspecting web printed electronic circuitry includes a strobed illuminator, a detector, a motion encoder, and a processor. The strobed illuminator is adapted to project light through a reticle to project a pattern of light onto an area of the web. The projected light occurs in a pulse sufficiently short to essentially freeze the web motion. The system projects the pattern of light onto the area of the web in at least two different positions of the web each position corresponding to a different phase of the projected light. A detector is adapted to acquire at least two images of the area, each image corresponding to one of the at least two different phases. The motion encoder provides a position output relative to a position of the web. The processor is coupled to the encoder, the illuminator and the detector. The processor is adapted to synchronize the illuminator with the web motion to expose the area of the web. The processor co-sites the at least two images and can construct a height map image with the co-sited images.
摘要:
A sensor for sensing component offset and orientation when held on a nozzle of a pick and place machine is provided. The sensor includes a plurality of two-dimensional cameras, a backlight illuminator and a controller. Each camera has a field of view that includes a nozzle of the pick and place machine. The backlight illuminator is configured to direct illumination toward the plurality of two-dimensional cameras. The backlight illuminator is positioned on an opposite side of a nozzle from the plurality of two-dimensional cameras. The controller is coupled to the plurality of two-dimensional cameras and the backlight illuminator. The controller is configured to determine offset and orientation information of the component(s) based upon a plurality of backlit shadow images detected by the plurality of two-dimensional cameras. The controller provides the offset and orientation information to a controller of the pick and place machine.
摘要:
A method and apparatus reduces two types of undesirable glints in an optical position alignment sensor designed to orient at least two components. In one aspect, a method includes using an aperture and a positive optic to block large angle glint generated by the components. In another aspect, a detector is positioned behind the image plane of the components to reduce the effect of small angle glint.
摘要:
Improved component placement inspection and verification is performed by a pick and place machine. Improvements include stereovision imaging of the intended placement location; enhanced illumination to facilitate the provision of relatively high-power illumination in the restricted space near the placement nozzle(s); optics to allow image acquisition device to view the placement location from an angle relative to a plane of the placement location, thereby reducing the possibility of such images being obstructed by the component; techniques for rapidly acquiring images with commercially available CCD arrays such that acquisition of before and after images does not substantially impact system throughput; and image processing techniques to provide component inspection and verification information.