公开(公告)号：US5393350A

公开(公告)日：1995-02-28

申请号：US133348

申请日：1993-10-08

申请人： Jon M. Schroeder

发明人： Jon M. Schroeder

IPC分类号： H01L35/00 ,  H01L35/32

CPC分类号： H01L35/00

摘要： A low voltage high amperage thermopile generating and electron storage unit is disclosed wherein current is formed by heating and cooling alternate junctions of dissimilar metals arranged in a circular fashion and may be enhanced with an electrical flux pump. Current may be withdrawn using an ultra fast thermopile type switch to connect to an electrical load source.

摘要翻译： 公开了一种低电压高电流热电堆发电和电子存储单元，其中通过加热和冷却以圆形方式布置的异种金属的交替接合形成电流，并且可以通过电通量泵来增强电流。 可以使用超快速热电堆型开关取出电流，以连接到电气负载源。

公开(公告)号：US4997047A

公开(公告)日：1991-03-05

申请号：US491276

申请日：1990-03-09

申请人： Jon M. Schroeder

发明人： Jon M. Schroeder

IPC分类号： E21B7/00 ,  E21B7/26

CPC分类号： E21B7/00 ,  E21B7/26

摘要： The disclosure describes an apparatus to use multiple expendable electromagnetically accelerated drill heads that are propelled into a electromagnetic accelerator that further accelerates the expendable drill heads to velocities as high as 30,000 ft./second to drill horizontal holes. Acceleration is achieved by making use of electromagnetic forces induced in a coil by opening a charged "ringing" circuit containing a capacitor interacting with magnetic poles around the expendable projectiles or drill head. Multiple accelerating coils, each charged by a D.C. source, are used while initial acceleration may be by interaction of electromagnetic fields between conductive rings on the drill head and induction coils.

摘要翻译： 本公开描述了一种使用多个消耗电磁加速钻头的装置，其被推进到电磁加速器中，该电磁加速器进一步将消耗的钻头加速到高达30,000英尺/秒的高度以钻出水平孔。 通过打开包含与消耗性弹丸或钻头头周围的磁极相互作用的电容器的充电“振铃”电路，通过利用在线圈中感应的电磁力来实现加速。 使用由直流源充电的多个加速线圈，而初始加速可以是通过钻头和感应线圈之间的导电环之间的电磁场的相互作用。

公开(公告)号：US5140985A

公开(公告)日：1992-08-25

申请号：US781485

申请日：1991-10-21

申请人： Jon M. Schroeder ,  Joseph F. Long

发明人： Jon M. Schroeder ,  Joseph F. Long

IPC分类号： A61B5/00

CPC分类号： A61B5/14521 ,  A61B5/1486

摘要： This invention gives an indication of blood glucose by measuring the glucose content in sweat. Other bodily fluids such as saliva, urine, or tears could also be used. The measuring system in our unit includes the substrate which may have printed wiring thereon; a plurality of oxygen sensors for measuring oxygen remaining after oxidation of the glucose with glucose oxidase and a reference oxygen sensor, all covered by a semi-porous membrane; a wick for conveying sweat to the glucose sensors and beyond; a battery, and a plurality of electroplateable indicator bars for indicating the glucose concentration in the sweat by difference in electrical output between the reference oxygen sensor and oxygen sensors that measure oxygen after reaction with the glucose oxidase or glucose sensors; a calibrateable legend associated with the bars relates the plating to the glucose level in the blood. In a second embodiment a liquid crystal display replaces the electroplateable indicator bars. This assembly allows the measurement of glucose level as related to glucose found in sweat by directly attaching the device to the arm and priming or activating the device with an electrolyte after which the measuring device will react with localized sweating and indicate the wearer's blood glucose level for at least an 18 hour period. The sealed monolithic unit becomes the entire measuring instrument and indicating device.

摘要翻译： 本发明通过测量汗液中的葡萄糖含量来指出血糖。 也可以使用其他体液，例如唾液，尿液或眼泪。 本机的测量系统包括可在其上印刷线路的基板; 多个氧传感器，用于测量用葡萄糖氧化酶氧化葡萄糖后剩余的氧气和参考氧传感器，全部由半多孔膜覆盖; 用于将汗液输送到葡萄糖传感器及其以外的灯芯; 电池和多个可电镀指示条，用于通过参考氧传感器和与葡萄糖氧化酶或葡萄糖传感器反应后测量氧的氧传感器之间的电输出的差异来指示汗液中的葡萄糖浓度; 与条相关联的可校准图例将电镀与血液中的葡萄糖水平相关联。 在第二实施例中，液晶显示器代替可电镀指示棒。 该组件允许通过将装置直接附接到手臂并用电解质填充或激活装置来测量与汗液中发现的葡萄糖相关的葡萄糖水平，之后测量装置将与局部出汗反应并且指示穿着者的血糖水平 至少18小时。 密封单片机成为整个测量仪器和指示装置。

公开(公告)号：US5024137A

公开(公告)日：1991-06-18

申请号：US435616

申请日：1989-11-13

申请人： Jon M. Schroeder

发明人： Jon M. Schroeder

IPC分类号： F41B6/00 ,  F42B6/00

CPC分类号： F42B6/006 ,  F41B6/00

摘要： A fuel assisted electromagnetic launcher wherein a payload is contained in a forward portion of a pointed cylindrical launch container and rocket fuel is contained in a rearward portion; and wherein a launch preparation unit in the launcher cools and heats alternate junctions in circular disposed thermopiles around the cylindrical launch container; and wherein electrical coils encased in plastic form a cylindrical barrel. With the coils with spacers in between each containing a photoelectric detector charged by an external D.C. voltage source electrical fields from the coils interact with the electrical fields around the launch container when the launch container is propelled into the cylindrical barrel by ignition of the rocket fuel; the interaction being caused by the magnetic wave field successively generated in the coils as the ablative tip of the launch container approaches each coil and thereby activates thru the photoelectric detector in the spacer a Mos-Fet switch or a similar nano-second switch to open a switch in the D.C. charged coil circuit between the D.C. voltage source and a capacitor connected across the inlet and exit leads of each of the coils.

摘要翻译： 一种燃料辅助电磁发射器，其中有效载荷被容纳在尖的圆柱形发射容器的前部中，并且火箭燃料容纳在后部中; 并且其中所述发射器中的发射准备单元冷却并加热围绕所述圆柱形发射容器的环形设置的热电堆中的交替接合点; 并且其中封装在塑料中的电线圈形成圆柱形筒。 当发射容器通过点燃火箭燃料而推进到圆柱形筒中时，带有间隔物的线圈之间，每个线圈包含由外部直流电压源充电的光电探测器，来自线圈的电场与发射容器周围的电场相互作用; 这种相互作用是由在发射容器的消融尖端接近每个线圈的线圈中连续产生的磁波场引起的，从而通过间隔器中的光电探测器激活Mos-Fet开关或类似的纳秒级开关来打开 在DC电压源和连接在每个线圈的入口和出口引线之间的电容器之间切换直流充电线圈电路。

公开(公告)号：US5168939A

公开(公告)日：1992-12-08

申请号：US574361

申请日：1990-08-29

申请人： Jon M. Schroeder

发明人： Jon M. Schroeder

IPC分类号： E21B7/00 ,  E21B7/26 ,  H02K41/02

CPC分类号： E21B7/00 ,  E21B7/26 ,  H02K41/02

摘要： The electromagnetically accelerated impact oil well drill uses magnetic interaction of a ringing circuit formed in each of multiple accelerating coils with the electromagnetic field of charge rings around an expendable ice filled plastic drill head to accelerate the drillhead to hypervelocity with the drill head properly aligned to shoot down through an upper installed oil well casing. The oil well casing being fitted with a rapidly operating diverter valve to deflect effluent from the casing from blowing back into the electromagnetically accelerated impact drill.

摘要翻译： 电磁加速冲击油井钻头使用在多个加速线圈中形成的振铃电路的磁相互作用与围绕消耗的充满冰的塑料钻头的电磁场的电磁场，以将钻头加速到超高速，钻头正确对齐以射出 通过上部安装的油井套管。 油井套管装有快速操作的分流阀，以将来自壳体的流出物从吹回到电磁加速冲击钻中。

公开(公告)号：US4616412A

公开(公告)日：1986-10-14

申请号：US548570

申请日：1983-11-04

申请人： Jon M. Schroeder

发明人： Jon M. Schroeder

IPC分类号： H01L21/603 ,  H01L23/495 ,  H01R43/00

CPC分类号： H01L24/86 ,  H01L23/49572 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  Y10T29/49121

摘要： A preformed metallic tape for thermocompression bonding to electronic component chips and a method and apparatus for the use thereof. The tape has etched thereinto a chip bonding site which includes a central, pull-tab region surrounded by a frame region. Intermediate the pull-tab and the frame regions, electrically conductive leads are formed and connected to the pull-tab. Several of the leads are further connected to the frame. The leads are formed with neck regions located respectively between their ends and the pull-tab and frame. One surface of the tape is a bonding surface and the opposite surface is a pressure pad surface. Protruding above the pressure pad surface are a plurality of mushroom-shaped pressure pads located respectively at the ends of leads. The tape is bonded to a chip by first aligning mating electrical contact pads thereof and terminal ends of the leads. The pads are then urged into the tape so that the pressure pads located on the opposite side thereof contact a heated anvil. Thus, the leads and chip pads are heated and softened permitting a force applied thereto by the pressure pads to form an electrically conductive bond therebetween. The same process may then be used to bond the other ends of the leads to either a lad frame or a chip carrier frame. The leads may then be electrically isolated by first adhering an adhesive tape to the exposed surface of the pull-tab region. Withdrawal of the tape then breaks the leads at their respective neck regions.

摘要翻译： 一种用于热压接电子元件芯片的预制金属带及其使用方法和装置。 胶带已经蚀刻到芯片粘合部位，该芯片粘合部位包括由框架区域包围的中央的拉片区域。 中间拉片和框架区域，导电引线形成并连接到拉片。 多个引线进一步连接到框架。 引线形成有分别位于其端部和拉片和框架之间的颈部区域。 胶带的一个表面是粘结表面，相对的表面是压垫表面。 在压力垫表面上方突出的是分别位于引线端部的多个蘑菇形压力垫。 通过首先对齐其配合的电接触焊盘和引线的末端，将带粘合到芯片。 然后将垫推入带中，使得位于其相对侧上的压垫接触加热的砧座。 因此，引线和芯片焊盘被加热和软化，允许由压力焊盘施加到其上的力在它们之间形成导电结合。 然后可以使用相同的过程将引线的另一端连接到一个小框架或芯片载体框架。 然后可以通过首先将粘合带粘附到拉片区域的暴露表面来将引线电隔离。 取出磁带，然后在其各自的颈部区域断开引线。

公开(公告)号：US4449690A

公开(公告)日：1984-05-22

申请号：US402714

申请日：1982-07-28

申请人： Jon M. Schroeder

发明人： Jon M. Schroeder

IPC分类号： B29C33/30 ,  B29C70/02 ,  B29C70/36 ,  B29C70/48 ,  B29C70/72 ,  H01L21/00 ,  B29D27/00

CPC分类号： H01L21/67126 ,  B29C33/301 ,  B29C70/02 ,  B29C70/36 ,  B29C70/48 ,  B29C70/72 ,  B29K2063/00 ,  B29K2105/16 ,  B29K2105/20 ,  B29L2031/3061

摘要： An apparatus and a method of use thereof for cast encapsulation of items, particularly electronic components. The apparatus consists of a plurality of identically shaped split matrix elements. Each matrix element has a first surface for receiving and securing the item to be encapsulated. A second surface of another identically shaped matrix element, located on a side thereof opposite to its first surface, is then mated with the first surface securing the item. Thus mated, the first and second surfaces establish a molding cavity for enclosing the item and an orifice providing access thereto. This process of securing an item to a first surface and enclosing it with a second surface is repeated thereby assembling a stack of matrix elements. This stack is then rigidly secured and the molding cavities are filled with particulate filler material through upright orifices. Excess filler is removed by quickly turning the stack over and then righting it again. The stack of matrices is then heated, its orifices filled with a quantity of heated, liquid thermosetting encapsulating compound and exposed to vacuum whereby substantially all air is drawn from the molding cavities through the liquid encapsulating compound. The stack is then again exposed to atmospheric pressure forcing the encapsulating compound throughout the unoccupied voids in the molding cavities after which that compound is permitted to solidify, thereby completing the encapsulation process.

摘要翻译： 一种用于物品，特别是电子部件的铸造封装的装置及其使用方法。 该装置由多个相同形状的分裂矩阵元件组成。 每个矩阵元件具有用于接收和固定待封装的物品的第一表面。 然后，与固定该物品的第一表面配合位于其与其第一表面相对的一侧上的另一相同形状的矩阵元件的第二表面。 如此配合，第一表面和第二表面建立用于封闭物品的模制腔和提供对其的通路的孔口。 重复将物品固定到第一表面并用第二表面包围的过程，从而组装一堆矩阵元件。 然后将该堆叠牢固地固定，并且通过竖立的孔口填充颗粒填料。 通过快速翻转堆叠然后再次对齐，可以清除过多的填充物。 然后将堆叠的基质加热，其孔口填充有一定数量的加热的液体热固性封装化合物并暴露于真空中，从而基本上所有的空气都通过液体封装化合物从模制腔抽出。 然后将堆叠再次暴露于大气压力，迫使封装化合物贯穿模制腔中的空闲空隙，之后允许该化合物固化，由此完成封装过程。

公开(公告)号：US5113580A

公开(公告)日：1992-05-19

申请号：US617011

申请日：1990-11-19

申请人： Jon M. Schroeder ,  Joseph F. Long ,  Randall J. Hartgrove

发明人： Jon M. Schroeder ,  Joseph F. Long ,  Randall J. Hartgrove

IPC分类号： H01L21/60

CPC分类号： H01L24/86 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  Y10T29/49121 ,  Y10T29/49144

摘要： The invention encompasses plating to form leads to allow one step bonding of a chip to tape; one step bonding of leads on the tape to a special chip package wherein chip packages may be stacked and connected as well as surface mounted and formation of a very dense circuitry on one or both sides of a board by using a photo imagable dielectric to separate circuitry and allow plating thru to form integral connections and edge connectors to connect circuitry to allow use of both sides of a board.

摘要翻译： 本发明包括电镀以形成引线以允许将芯片一步接合到带上; 将带上的引线一步接合到特殊的芯片封装，其中芯片封装可以堆叠并连接，并且通过使用可照像成像的电介质来分离电路，在板的一侧或两侧上进行表面安装和形成非常密集的电路 并允许电镀形成一体化连接和边缘连接器，以连接电路，以允许使用电路板的两面。

公开(公告)号：US4878846A

公开(公告)日：1989-11-07

申请号：US358503

申请日：1989-05-30

申请人： Jon M. Schroeder

发明人： Jon M. Schroeder

IPC分类号： H01L21/00 ,  H01R12/04

CPC分类号： H01L21/67144

摘要： This assembly allows connecting in one operation a plurality of chips to chips and to a substrate or each chip to a substrate using an elastomeric pressure means that continues to pressure chips connecting micron sized leads to chip pads on one end and to circuitry on a substrate on the other end; a metallic cover fastening to the substrate and containing said electronic pressure means also includes a ribbed projection to hermetically seal the unit so that the substrate itself becomes an integral part of the assembly package.

摘要翻译： 该组件允许将多个芯片的一个操作连接到芯片，并且使用弹性体压力装置将衬底或每个芯片连接到衬底或每个芯片，所述弹性体压力装置继续将芯片连接到微型尺寸的引线到一端的芯片焊盘和衬底上的电路 另一端 紧固到基板并且容纳所述电子压力装置的金属盖子还包括肋状凸起，以密封该单元，使得基板本身变成组件封装的整体部分。

公开(公告)号：US4374080A

公开(公告)日：1983-02-15

申请号：US224659

申请日：1981-01-13

申请人： Jon M. Schroeder

发明人： Jon M. Schroeder

IPC分类号： B29C33/30 ,  B29C70/02 ,  B29C70/36 ,  B29C70/48 ,  B29C70/72 ,  H01L21/00 ,  B29C6/00 ,  B29C6/02

CPC分类号： H01L21/67126 ,  B29C33/301 ,  B29C70/02 ,  B29C70/36 ,  B29C70/48 ,  B29C70/72 ,  B29K2063/00 ,  B29K2105/16 ,  B29K2105/20 ,  B29L2031/3061

摘要： An apparatus and a method of use thereof for cast encapsulation of items, particularly electronic components. The apparatus consists of a plurality of identically shaped split matrix elements. Each matrix element has a first surface for receiving and securing the item to be encapsulated. A second surface of another identically shaped matrix element, located on a side thereof opposite to its first surface, is then mated with the first surface securing the item. Thus mated, the first and second surfaces establish a molding cavity for enclosing the item and an orifice providing access thereto. This process of securing an item to a first surface and enclosing it with a second surface is repeated thereby assembling a stack of matrix elements. This stack is then rigidly secured and the molding cavities are filled with particulate filler material through upright orifices. Excess filler is removed by quickly turning the stack over and then righting it again. The stack of matrices is then heated, its orifices filled with a quantity of heated, liquid thermosetting encapsulating compound and exposed to vacuum whereby substantially all air is drawn from the molding cavities through the liquid encapsulating compound. The stack is then again exposed to atmospheric pressure forcing the encapsulating compound throughout the unoccupied voids in the molding cavities after which that compound is permitted to solidify, thereby completing the encapsulation process.

摘要翻译： 一种用于物品，特别是电子部件的铸造封装的装置及其使用方法。 该装置由多个相同形状的分裂矩阵元件组成。 每个矩阵元件具有用于接收和固定待封装的物品的第一表面。 然后，与固定该物品的第一表面配合位于其与其第一表面相对的一侧上的另一相同形状的矩阵元件的第二表面。 如此配合，第一表面和第二表面建立用于封闭物品的模制腔和提供对其的通路的孔口。 重复将物品固定到第一表面并用第二表面包围的过程，从而组装一堆矩阵元件。 然后将该堆叠牢固地固定，并且通过竖立的孔口填充颗粒填料。 通过快速翻转堆叠然后再次对齐，可以清除过多的填充物。 然后将堆叠的基质加热，其孔口填充有一定数量的加热的液体热固性封装化合物并暴露于真空中，从而基本上所有的空气都通过液体封装化合物从模制腔抽出。 然后将堆叠再次暴露于大气压力，迫使封装化合物贯穿模制腔中的空闲空隙，之后允许该化合物固化，由此完成封装过程。