Abstract:
A method for fabricating a semiconductor power integrated circuit includes the steps of forming a semiconductor structure having at least one active region, wherein an active region includes a well region for forming a source and a drift region for forming a drain region, forming a trench for isolation of the active regions, wherein the trench has a predetermined depth from a surface of the semiconductor structure, forming a first TEOS-oxide layer inside the trench and above the semiconductor structure, wherein the first TEOS-oxide layer has a predetermined thickness from the surface of the semiconductor device, forming a second TEOS-oxide layer on the first TEOS-oxide layer, wherein a thickness of the second TEOS-oxide layer is smaller than that of the first TEOS-oxide layer, and performing a selective etching to the first and second TEOS-oxide layers, to thereby simultaneously form a field oxide layer pattern, a diode insulating layer pattern and a gate oxide layer pattern, to thereby reduce processing steps and obtain a low on-resistance.
Abstract:
A method for fabricating a semiconductor power integrated circuit includes the steps of forming a semiconductor structure having at least one active region, wherein an active region includes a well region for forming a source and a drift region for forming a drain region, forming a trench for isolation of the active regions, wherein the trench has a predetermined depth from a surface of the semiconductor structure, forming a first TEOS-oxide layer inside the trench and above the semiconductor structure, wherein the first TEOS-oxide layer has a predetermined thickness from the surface of the semiconductor device, forming a second TEOS-oxide layer on the first TEOS-oxide layer, wherein a thickness of the second TEOS-oxide layer is smaller than that of the first TEOS-oxide layer, and performing a selective etching to the first and second TEOS-oxide layers, to thereby simultaneously form a field oxide layer pattern, a diode insulating layer pattern and a gate oxide layer pattern, to thereby reduce processing steps and obtain a low on-resistance.
Abstract:
A phased array antenna system having low power amplifiers reduces power loss through several tens meters high frequency cables. The antenna system for transmitting a signal in a base station, comprising: a phased array unit for selecting an input signal through one of a plurality of beam ports, for dividing the input signal into a plurality of signals and for outputting the plurality of signals through a plurality of array ports, each of the signal having a linear phase difference according to difference of propagation path; a switch for receiving the input signal from a base station, for selecting one of the plurality of beam ports of said phased array and for transmitting the input signal to the selected beam port, responsive to a control signal transmitted from the base station; a plurality of low power amplifiers for low power amplifying the plurality of signals inputted from the plurality of array ports of said phased array; and phased array antennas for radiating the plurality of signals from said plurality of low power amplifiers, thereby providing a spatial power summation into a direction of equiphase plane allowing effective radiated power sufficiently enough to cover a cell into a steered direction selected by said switch.
Abstract:
The present invention relates to an orthodontic wire and a manufacturing method thereof, and more particularly, to an orthodontic wire, which is not harmful to the human body and is capable of continuously holding the color of teeth, and a manufacturing method of the orthodontic wire. According to the present invention, there is provided an orthodontic wire, comprising a metal wire formed of a shape memory alloy material; a silver (Ag) film applied to a surface of the metal wire; and a polymer compound film applied to a surface of the silver (Ag) film to prevent the silver (Ag) film from being discolored.