Method of Manufacturing Three Dimensional Semiconductor Memory Device
    1.
    发明申请
    Method of Manufacturing Three Dimensional Semiconductor Memory Device 有权
    制造三维半导体存储器件的方法

    公开(公告)号:US20150104916A1

    公开(公告)日:2015-04-16

    申请号:US14248003

    申请日:2014-04-08

    IPC分类号: H01L27/115

    摘要: A method of manufacturing a three-dimensional semiconductor memory device is provided. The method includes alternately stacking a first insulation film, a first sacrificial film, alternating second insulation films and second sacrificial films, a third sacrificial film and a third insulation film on a substrate. A channel hole is formed to expose a portion of the substrate while passing through the first insulation film, the first sacrificial film, the second insulation films, the second sacrificial films, the third sacrificial film and the third insulation film. The method further includes forming a semiconductor pattern on the portion of the substrate exposed in the channel hole by epitaxial growth. Forming the semiconductor pattern includes forming a lower epitaxial film, doping an impurity into the lower epitaxial film, and forming an upper epitaxial film on the lower epitaxial film. Forming the lower epitaxial film, doping the impurity into the lower epitaxial film and forming the upper epitaxial film are all performed in-situ, and the semiconductor pattern includes a doped region and an undoped region.

    摘要翻译: 提供一种制造三维半导体存储器件的方法。 该方法包括在基板上交替堆叠第一绝缘膜,第一牺牲膜,交替的第二绝缘膜和第二牺牲膜,第三牺牲膜和第三绝缘膜。 形成通道孔,以在穿过第一绝缘膜,第一牺牲膜,第二绝缘膜,第二牺牲膜,第三牺牲膜和第三绝缘膜的同时暴露衬底的一部分。 该方法还包括通过外延生长在暴露在通道孔中的衬底的部分上形成半导体图案。 形成半导体图案包括形成下部外延膜,将杂质掺杂到下部外延膜中,以及在下部外延膜上形成上部外延膜。 形成下部外延膜,将杂质掺杂到下部外延膜中并形成上部外延膜全部原位进行,并且半导体图案包括掺杂区域和未掺杂区域。

    Method of manufacturing three dimensional semiconductor memory device
    2.
    发明授权
    Method of manufacturing three dimensional semiconductor memory device 有权
    制造三维半导体存储器件的方法

    公开(公告)号:US09064736B2

    公开(公告)日:2015-06-23

    申请号:US14248003

    申请日:2014-04-08

    IPC分类号: H01L21/311 H01L27/115

    摘要: A method of manufacturing a three-dimensional semiconductor memory device is provided. The method includes alternately stacking a first insulation film, a first sacrificial film, alternating second insulation films and second sacrificial films, a third sacrificial film and a third insulation film on a substrate. A channel hole is formed to expose a portion of the substrate while passing through the first insulation film, the first sacrificial film, the second insulation films, the second sacrificial films, the third sacrificial film and the third insulation film. The method further includes forming a semiconductor pattern on the portion of the substrate exposed in the channel hole by epitaxial growth. Forming the semiconductor pattern includes forming a lower epitaxial film, doping an impurity into the lower epitaxial film, and forming an upper epitaxial film on the lower epitaxial film. Forming the lower epitaxial film, doping the impurity into the lower epitaxial film and forming the upper epitaxial film are all performed in-situ, and the semiconductor pattern includes a doped region and an undoped region.

    摘要翻译: 提供一种制造三维半导体存储器件的方法。 该方法包括在基板上交替堆叠第一绝缘膜,第一牺牲膜,交替的第二绝缘膜和第二牺牲膜,第三牺牲膜和第三绝缘膜。 形成通道孔,以在穿过第一绝缘膜,第一牺牲膜,第二绝缘膜,第二牺牲膜,第三牺牲膜和第三绝缘膜的同时暴露衬底的一部分。 该方法还包括通过外延生长在暴露在通道孔中的衬底的部分上形成半导体图案。 形成半导体图案包括形成下部外延膜,将杂质掺杂到下部外延膜中,以及在下部外延膜上形成上部外延膜。 形成下部外延膜,将杂质掺杂到下部外延膜中并形成上部外延膜全部原位进行,并且半导体图案包括掺杂区域和未掺杂区域。

    Methods of manufacturing a vertical type semiconductor device
    3.
    发明授权
    Methods of manufacturing a vertical type semiconductor device 有权
    制造垂直型半导体器件的方法

    公开(公告)号:US08426304B2

    公开(公告)日:2013-04-23

    申请号:US13241316

    申请日:2011-09-23

    IPC分类号: H01L21/4763

    摘要: Methods of manufacturing a semiconductor device include forming a stopping layer pattern in a first region of a substrate. A first mold structure is formed in a second region of the substrate that is adjacent the first region. The first mold structure includes first sacrificial patterns and first interlayer patterns stacked alternately. A second mold structure is formed on the first mold structure and the stopping layer pattern. The second mold structure includes second sacrificial patterns and second interlayer patterns stacked alternately. The second mold structure partially covers the stopping layer pattern. A channel pattern is formed and passes through the first mold structure and the second mold structure.

    摘要翻译: 制造半导体器件的方法包括在衬底的第一区域中形成停止层图案。 第一模具结构形成在与第一区域相邻的基板的第二区域中。 第一模具结构包括交替堆叠的第一牺牲图案和第一层间图案。 在第一模具结构和止挡层图案上形成第二模具结构。 第二模具结构包括交替堆叠的第二牺牲图案和第二层间图案。 第二模具结构部分地覆盖止挡层图案。 形成通道图案并通过第一模具结构和第二模具结构。

    Methods of Manufacturing a Vertical Type Semiconductor Device
    4.
    发明申请
    Methods of Manufacturing a Vertical Type Semiconductor Device 有权
    制造垂直型半导体器件的方法

    公开(公告)号:US20120115309A1

    公开(公告)日:2012-05-10

    申请号:US13241316

    申请日:2011-09-23

    IPC分类号: H01L21/28

    摘要: Methods of manufacturing a semiconductor device include forming a stopping layer pattern in a first region of a substrate. A first mold structure is formed in a second region of the substrate that is adjacent the first region. The first mold structure includes first sacrificial patterns and first interlayer patterns stacked alternately. A second mold structure is formed on the first mold structure and the stopping layer pattern. The second mold structure includes second sacrificial patterns and second interlayer patterns stacked alternately. The second mold structure partially covers the stopping layer pattern. A channel pattern is formed and passes through the first mold structure and the second mold structure.

    摘要翻译: 制造半导体器件的方法包括在衬底的第一区域中形成停止层图案。 第一模具结构形成在与第一区域相邻的基板的第二区域中。 第一模具结构包括交替堆叠的第一牺牲图案和第一层间图案。 在第一模具结构和止挡层图案上形成第二模具结构。 第二模具结构包括交替堆叠的第二牺牲图案和第二层间图案。 第二模具结构部分地覆盖止挡层图案。 形成通道图案并通过第一模具结构和第二模具结构。

    Organic Light-Emitting Display Device and Method of Fabricating the Same
    5.
    发明申请
    Organic Light-Emitting Display Device and Method of Fabricating the Same 审中-公开
    有机发光显示装置及其制造方法

    公开(公告)号:US20130056784A1

    公开(公告)日:2013-03-07

    申请号:US13415655

    申请日:2012-03-08

    IPC分类号: H01L33/62

    摘要: An organic electro-luminescence device capable of reducing a resistance of a cathode electrode to enhance brightness uniformity at each location within the device is described. The organic electro-luminescence device includes a bank layer formed over a substrate, the bank layer including a first, second, and third portion. A first electrode is formed between the first and second portions of the bank layer. An auxiliary electrode is formed where at least a part of the auxiliary electrode is formed between the second and third portions of the bank layer. A pattern is formed on the auxiliary electrode. An organic material layer formed between the first and second portions of the bank layer. A second electrode formed on the organic material layer, where at least a portion of the second electrode is electrically coupled to the auxiliary electrode.

    摘要翻译: 描述了能够降低阴极电阻以提高装置内每个位置的亮度均匀性的有机电致发光器件。 有机电致发光器件包括在衬底上形成的堤层,堤层包括第一,第二和第三部分。 在堤层的第一和第二部分之间形成第一电极。 形成辅助电极,其中辅助电极的至少一部分形成在堤层的第二和第三部分之间。 在辅助电极上形成图案。 形成在堤层的第一和第二部分之间的有机材料层。 形成在有机材料层上的第二电极,其中第二电极的至少一部分电耦合到辅助电极。

    Dual panel type organic electroluminescent display device and method of fabricating the same
    6.
    发明授权
    Dual panel type organic electroluminescent display device and method of fabricating the same 有权
    双面板型有机电致发光显示装置及其制造方法

    公开(公告)号:US08395569B2

    公开(公告)日:2013-03-12

    申请号:US12588257

    申请日:2009-10-08

    IPC分类号: G09G3/32

    CPC分类号: H01L27/3246 H01L27/3253

    摘要: The present invention relates to an organic electroluminescent display (OELD) device, more particularly, to a dual panel type OELD device and a method of fabricating the same. The OLED structure has first and second barrier walls having a reverse-taper shape with respect to the first substrate and first and second side surfaces, wherein the walls define novel polymer patterns with varying heights relative to each other.

    摘要翻译: 本发明涉及一种有机电致发光显示器(OELD)器件,更具体地涉及一种双面板型OELD器件及其制造方法。 OLED结构具有相对于第一基板和第一和第二侧表面具有倒锥形的第一和第二阻挡壁,其中壁限定相对于彼此具有不同高度的新型聚合物图案。

    Dual panel type organic electroluminescent display device and method of fabricating the same
    7.
    发明申请
    Dual panel type organic electroluminescent display device and method of fabricating the same 有权
    双面板型有机电致发光显示装置及其制造方法

    公开(公告)号:US20100110048A1

    公开(公告)日:2010-05-06

    申请号:US12588257

    申请日:2009-10-08

    IPC分类号: G09G5/00 H01L51/56

    CPC分类号: H01L27/3246 H01L27/3253

    摘要: The present invention relates to an organic electroluminescent display (OELD) device, more particularly, to a dual panel type OELD device and a method of fabricating the same. The OLED structure has first and second barrier walls having a reverse-taper shape with respect to the first substrate and first and second side surfaces, wherein the walls define novel polymer patterns with varying heights relative to each other.

    摘要翻译: 本发明涉及一种有机电致发光显示器(OELD)器件,更具体地涉及一种双面板型OELD器件及其制造方法。 OLED结构具有相对于第一基板和第一和第二侧表面具有倒锥形的第一和第二阻挡壁,其中壁限定相对于彼此具有不同高度的新型聚合物图案。