摘要:
A method for implementing at speed bit fail mapping of an embedded memory system having ABIST (Array Built In Self Testing), comprises using a high speed multiplied clock which is a multiple of an external clock of an external tester to sequence ABIST bit fail testing of the embedded memory system. Collect store fail data during ABIST testing of the embedded memory system. Perform a predetermined number of ABIST runs before issuing a bypass order substituting the external clock for the high speed multiplied clock. Use the external clock of the tester to read bit fail data out to the external tester.
摘要翻译:一种用于实现具有ABIST(Array Built In Self Testing阵列)的嵌入式存储器系统的速率位故障映射的方法,包括使用作为外部测试器的外部时钟的倍数的高速倍增时钟来对ABIST位故障测试进行排序 嵌入式内存系统。 在嵌入式存储系统的ABIST测试期间收集存储失败数据。 在发出旁路命令之前,执行预定数量的ABIST运行,将外部时钟替换为高速倍增时钟。 使用测试仪的外部时钟将位故障数据读出外部测试仪。
摘要:
A method for implementing at speed bit fail mapping of an embedded memory system having ABIST (Array Built In Self Testing), comprises using a high speed multiplied clock which is a multiple of an external clock of an external tester to sequence ABIST bit fail testing of the embedded memory system. Collect store fail data during ABIST testing of the embedded memory system. Perform a predetermined number of ABIST runs before issuing a bypass order substituting the external clock for the high speed multiplied clock. Use the external clock of the tester to read bit fail data out to the external tester.
摘要翻译:一种用于实现具有ABIST(Array Built In Self Testing阵列)的嵌入式存储器系统的速率位故障映射的方法,包括使用作为外部测试器的外部时钟的倍数的高速倍增时钟来对ABIST位故障测试进行排序 嵌入式内存系统。 在嵌入式存储系统的ABIST测试期间收集存储失败数据。 在发出旁路命令之前,执行预定数量的ABIST运行,将外部时钟替换为高速倍增时钟。 使用测试仪的外部时钟将位故障数据读出外部测试仪。
摘要:
This invention involves the use of the JTAG functional test patterns and exercisors to solve the problem of diagnosing broken scan chains in either a serial or a lateral broadside insertion manner across all latch system ports and to analyze the response data efficiently for the purpose of readily identifying switching and non-switching latches with the next to last non-switching latch being the point of the break within a defective scan chain(s). This comprehensive latch perturbation, in conjunction with iterative diagnostic algorithms is used to identify and to pinpoint the defective location in such a broken scan chain(s). This JTAG Functional test function and the JTAG test patterns ultimately derived therefrom, can take on different forms and origins, some external to a product and some internal to a product.
摘要:
This invention involves the use of the JTAG functional test patterns and exercisors to solve the problem of diagnosing broken scan chains in either a serial or a lateral broadside insertion manner across all latch system ports and to analyze the response data efficiently for the purpose of readily identifying switching and non-switching latches with the next to last non-switching latch being the point of the break within a defective scan chain(s). This comprehensive latch perturbation, in conjunction with iterative diagnostic algorithms is used to identify and to pinpoint the defective location in such a broken scan chain(s). This JTAG Functional test function and the JTAG test patterns ultimately derived therefrom, can take on different forms and origins, some external to a product and some internal to a product.
摘要:
The present invention relates to a test for current leakage of driver/receiver stages, and in particular for bi-directional input/output stages (10) of a semiconductor chip. Two dedicated support transistor devices (56, 58) are added into the prior art switching scheme, together with a simple control logic (48, 50, 52, 60, 62, 64) for selectively controlling the two dedicated support transistor devices according to a predetermined test scheme. An on-chip self-test feature provides valid voltage levels which are convertible by the receiver (24) to predictable logic states at the evaluation line RDATA. The test can be performed autonomously on the chip without the requirement for an external test device.
摘要:
The present invention relates to a method and system for full parametric testing of the drive and receive capability of bi-directional driver/receiver-stages, and in particular of bi-directional input/output-stages of a semiconductor chip. Electrical properties, as for example DC-resistance, AC-impedance of a driver stage are tested by at least one test load implemented on the chip itself which causes a characteristic voltage drop usable for test evaluation. Advantageously, the output stage devices of P-type (50, 52) and N-type (54, 56), respectively, are split into at least two sub-devices P1, P2 and N1, N2, and are controlled separately by a control logic (60, 62, 64, 70, 72, 74). Then, for example N2 is used for testing the P device, and P2 is used for testing the N-device. Thus, devices already present on the chip are re-used for test purposes, which makes off-chip testing unnecessary.
摘要:
A method of and system for testing multi clock domain devices at functional clock speed by aligning the Launching C2 clocks of the high speed and low speed domains, issuing a Cl->C2 clock in each domain, to at speed test all intra-domain paths and the low speed to high speed paths; aligning the capturing C1 clock edges of the high speed and low speed clocks; and issuing a C2->C1 clock in each domain, to test the high speed to low speed paths.